Mitul B. Modi, Ph.D. - Publications

Affiliations: 
2003 Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering, Electronics and Electrical Engineering, Materials Science Engineering

7 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2009 Modi MB, Ginga N, Sitaraman SK. Microcontact spring reliability: Design against interfacial fracture Ieee Transactions On Components and Packaging Technologies. 32: 197-206. DOI: 10.1109/TCAPT.2008.2010131  1
2004 Modi MB, Sitaraman SK. Single-sample decohesion test: Mechanics and implementataion International Journal of Fracture. 129: 1-20. DOI: 10.1023/B:FRAC.0000038907.94272.e5  1
2004 Modi MB, Sitaraman SK. Interfacial fracture toughness measurement for thin film interfaces Engineering Fracture Mechanics. 71: 1219-1234. DOI: 10.1016/S0013-7944(03)00210-8  1
2003 Modi MB, Sitaraman SK. Single-substrate decohesion test (SSDT) for interfacial fracture toughness measurement Proceedings of 5th Electronics Packaging Technology Conference, Eptc 2003. 456-461. DOI: 10.1109/EPTC.2003.1271565  1
2003 Modi MB, Sitaraman SK. Measurement of the mode mix dependent interfacial fracture toughness for a Ti/Si interface using a modified decohesion test Advances in Electronic Packaging. 1: 559-573.  1
2002 Modi MB, Sitaraman SK. Modified decohesion test (MDT) for interfacial fracture toughness measurement in microelectronic/MEMS applications Asme International Mechanical Engineering Congress and Exposition, Proceedings. 277-282. DOI: 10.1115/IMECE2002-39670  1
2001 Modi MB, Fork DK, Sitaraman SK. Numerical approximation of the energy release rate in intrinsically stressed micro-spring structures Advances in Electronic Packaging. 1: 357-364.  1
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