Thorlindur Thorolfsson, Ph.D. - Publications

2011 North Carolina State University, Raleigh, NC 
Computer Engineering, Electronics and Electrical Engineering

19 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2013 Franzon PD, Priyadarshi S, Lipa S, Davis WR, Thorolfsson T. Exploring early design tradeoffs in 3DIC Proceedings - Ieee International Symposium On Circuits and Systems. 545-549. DOI: 10.1109/ISCAS.2013.6571901  0.64
2013 Franzon PD, Rotenberg E, Tuck J, Davis WR, Zhou H, Schabel J, Zhang Z, Park J, Dwiel B, Forbes E, Huh J, Priyadarshi S, Lipa S, Thorolfsson T. Applications and design styles for 3DIC Technical Digest - International Electron Devices Meeting, Iedm. 29.4.1-29.4.4. DOI: 10.1109/IEDM.2013.6724717  0.32
2012 Melamed S, Thorolfsson T, Harris TR, Priyadarshi S, Franzon P, Steer MB, Davis WR. Junction-level thermal analysis of 3-d integrated circuits using high definition power blurring Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 676-689. DOI: 10.1109/TCAD.2011.2180384  0.44
2012 Thorolfsson T, Lipa S, Franzon PD. A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration Proceedings of the Custom Integrated Circuits Conference. DOI: 10.1109/CICC.2012.6330589  0.56
2011 Franzon PD, Davis WR, Thorolfsson T, Melamed S. 3D specific systems design and CAD Proceedings - 2011 International Conference On Embedded Computer Systems: Architectures, Modeling and Simulation, Ic-Samos 2011. 326-329. DOI: 10.1109/SAMOS.2011.6045479  0.32
2011 Franzon PD, Davis WR, Thorolfsson T, Melamed S. 3D specific systems: Design and CAD Proceedings of the Asian Test Symposium. 470-473. DOI: 10.1109/ATS.2011.99  0.32
2011 Thorolfsson T, Moezzi-Madani N, Franzon PD. Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor Iet Computers and Digital Techniques. 5: 198-204. DOI: 10.1049/iet-cdt.2009.0106  0.64
2010 Thorolfsson T, Melamed S, Davis WR, Franzon PD. Low-power hypercube divided memory FFT engine using 3D integration Acm Transactions On Design Automation of Electronic Systems. 16. DOI: 10.1145/1870109.1870114  0.4
2010 Thorolfsson T, Luo G, Cong J, Franzon PD. Logic-on-logic 3D integration and placement Ieee 3d System Integration Conference 2010, 3dic 2010. DOI: 10.1109/3DIC.2010.5751451  0.6
2010 Lipa S, Thorolfsson T, Franzon P. The NCSU Tezzaron design kit Ieee 3d System Integration Conference 2010, 3dic 2010. DOI: 10.1109/3DIC.2010.5751418  0.68
2010 Franzon PD, Davis WR, Thorolfsson T, Melamed S. Creating 3D specific systems: Architecture, design and CAD 43rd International Symposium On Microelectronics 2010, Imaps 2010. 23-27.  0.48
2010 Melamed S, Thorolfsson T, Srinivasany A, Chengy E, Franzon P, Davis WR. Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICs 16th International Workshop On Thermal Investigations of Ics and Systems, Therminic 2010. 74-79.  0.68
2009 Thorolfsson T, Moezzi-Madani N, Franzon PD. A low power 3D integrated FFT engine using hypercube memory division Proceedings of the International Symposium On Low Power Electronics and Design. 231-236. DOI: 10.1145/1594233.1594289  0.76
2009 Thorolfsson T, Melamed S, Charles G, Franzon PD. Comparative analysis of two 3D integration implementations of a SAR processor 2009 Ieee International Conference On 3d System Integration, 3dic 2009. DOI: 10.1109/3DIC.2009.5306598  0.36
2009 Melamed S, Thorolfsson T, Srinivasany A, Chengy E, Franzon P, Davis R. Junction-level thermal extraction and simulation of 3DICs 2009 Ieee International Conference On 3d System Integration, 3dic 2009. DOI: 10.1109/3DIC.2009.5306529  0.56
2009 Thorolfsson T, Gonsalves K, Franzon PD. Design automation for a 3DIC FFT processor for synthetic aperture radar: A case study Proceedings - Design Automation Conference. 51-56.  0.4
2008 Franzon PD, Lipa S, Oh J, Thorolfsson T, Davis R. Memory rich applications for 3D integration Proceedings of Spie - the International Society For Optical Engineering. 7268. DOI: 10.1117/12.810061  0.44
2008 Franzon PD, Davis WR, Steer MB, Lipa S, Oh EC, Thorolfsson T, Melamed S, Luniya S, Doxsee T, Berkeley S, Shani B, Obermiller K. Design and CAD for 3D integrated circuits Proceedings - Design Automation Conference. 668-673. DOI: 10.1109/DAC.2008.4555903  0.44
2007 Thorolfsson T, Franzon PD. System design for 3D multi-FPGA packaging Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 171-174. DOI: 10.1109/EPEP.2007.4387152  0.96
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