Krishna Bharath, Ph.D. - Publications

Affiliations: 
2009 Georgia Institute of Technology, Atlanta, GA 
Area:
Electronics and Electrical Engineering

13 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2010 Swaminathan M, Chung D, Grivet-Talocia S, Bharath K, Laddha V, Xie J. Designing and modeling for power integrity Ieee Transactions On Electromagnetic Compatibility. 52: 288-310. DOI: 10.1109/TEMC.2010.2045382  0.36
2010 Choi J, Govind V, Swaminathan M, Bharath K. Noise isolation in mixed-signal systems using alternating impedance electromagnetic bandgap (AI-EBG) structure-based power distribution network (PDN) Ieee Transactions On Advanced Packaging. 33: 2-12. DOI: 10.1109/TADVP.2009.2033705  0.84
2009 Bharath K, Choi JY, Swaminathan M. Use of the finite element method for the modeling of multi-layered power/ground planes with small features Proceedings - Electronic Components and Technology Conference. 1630-1635. DOI: 10.1109/ECTC.2009.5074233  0.88
2008 Bharath K, Sankaran N, Engin AE, Swaminathan M. Multi-layer fringe-field augmentations for the efficient modeling of package power planes Electrical Performance of Electronic Packaging, Epep. 331-334. DOI: 10.1109/EPEP.2008.4675948  0.68
2008 Bharath K, Engin E, Swaminathan M. Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM Proceedings - Design Automation Conference. 560-565. DOI: 10.1109/DAC.2008.4555879  0.8
2007 Engin AE, Bharath K, Swaminathan M. Multilayered finite-difference method (MFDM) for modeling of package and printed circuit board planes Ieee Transactions On Electromagnetic Compatibility. 49: 441-447. DOI: 10.1109/TEMC.2007.893331  0.76
2007 Bharath K, Engin E, Swaminathan M, Uriu K, Yamada T. Signal and power integrity co-simulation for multi-layered system on package modules Ieee International Symposium On Electromagnetic Compatibility. DOI: 10.1109/ISEMC.2007.21  0.32
2007 Bharath K, Engin E, Swaminathan M, Uriu K, Yamada T. Efficient simulation of power/ground planes for SiP applications Proceedings - Electronic Components and Technology Conference. 1199-1205. DOI: 10.1109/ECTC.2007.373946  0.48
2007 Ege Engin A, Bharath K, Swaminathan M. Analysis for signal and power integrity using the multilayered finite difference method Proceedings - Ieee International Symposium On Circuits and Systems. 1493-1496.  0.96
2006 Mandrekar R, Bharath K, Srinivasan K, Engin E, Swaminathan M. System level signal and power integrity analysis methodology for system-in-package applications Proceedings - Design Automation Conference. 1009-1012. DOI: 10.1145/1146909.1147163  0.64
2006 Bharath K, Engin E, Swaminathan M, Uriu K, Yamada T. Efficient modeling of package power delivery networks with fringing fields and gap coupling in mixed signal systems Electrical Performance of Electronic Packaging, Epep. 59-62. DOI: 10.1109/EPEP.2006.321190  0.32
2006 Ege Engin A, Bharath K, Swaminathan M, Cases M, Mutnury B, Pham N, De Araujo DN, Matoglu E. Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards Proceedings - Electronic Components and Technology Conference. 2006: 1262-1267. DOI: 10.1109/ECTC.2006.1645815  0.8
2006 Engin AE, Bharath K, Srinivasan K, Swaminathan M. Modeling of multilayered packages and boards using modal decomposition and finite difference methods Ieee International Symposium On Electromagnetic Compatibility. 3: 646-650.  0.64
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