| Year |
Citation |
Score |
| 2013 |
Gan H, Bharath K. Early power delivery analysis of bump depopulation Asme 2013 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2013. 1. DOI: 10.1115/IPACK2013-73119 |
0.368 |
|
| 2010 |
Swaminathan M, Chung D, Grivet-Talocia S, Bharath K, Laddha V, Xie J. Designing and modeling for power integrity Ieee Transactions On Electromagnetic Compatibility. 52: 288-310. DOI: 10.1109/Temc.2010.2045382 |
0.642 |
|
| 2010 |
Choi J, Govind V, Swaminathan M, Bharath K. Noise isolation in mixed-signal systems using alternating impedance electromagnetic bandgap (AI-EBG) structure-based power distribution network (PDN) Ieee Transactions On Advanced Packaging. 33: 2-12. DOI: 10.1109/Tadvp.2009.2033705 |
0.625 |
|
| 2010 |
Bharath K, Suryakumar M, Sarangi A, Taylor G. Electrical evaluation of power- Grid configurations Designcon 2010. 1: 325-343. |
0.375 |
|
| 2009 |
Bharath K, Choi JY, Swaminathan M. Use of the finite element method for the modeling of multi-layered power/ground planes with small features Proceedings - Electronic Components and Technology Conference. 1630-1635. DOI: 10.1109/ECTC.2009.5074233 |
0.352 |
|
| 2008 |
Bharath K, Sankaran N, Engin AE, Swaminathan M. Multi-layer fringe-field augmentations for the efficient modeling of package power planes Electrical Performance of Electronic Packaging, Epep. 331-334. DOI: 10.1109/EPEP.2008.4675948 |
0.601 |
|
| 2007 |
Engin AE, Bharath K, Swaminathan M. Multilayered finite-difference method (MFDM) for modeling of package and printed circuit board planes Ieee Transactions On Electromagnetic Compatibility. 49: 441-447. DOI: 10.1109/Temc.2007.893331 |
0.641 |
|
| 2007 |
Bharath K, Engin E, Swaminathan M, Uriu K, Yamada T. Signal and power integrity co-simulation for multi-layered system on package modules Ieee International Symposium On Electromagnetic Compatibility. DOI: 10.1109/ISEMC.2007.21 |
0.452 |
|
| 2007 |
Bharath K, Engin E, Swaminathan M, Uriu K, Yamada T. Efficient simulation of power/ground planes for SiP applications Proceedings - Electronic Components and Technology Conference. 1199-1205. DOI: 10.1109/ECTC.2007.373946 |
0.395 |
|
| 2007 |
Bharath K, Engin E, Swaminathan M, Uriu K, Yamada T. Computationally efficient power integrity simulation for system-on-package applications Proceedings - Design Automation Conference. 612-617. DOI: 10.1109/DAC.2007.375236 |
0.404 |
|
| 2007 |
Ege Engin A, Bharath K, Swaminathan M. Analysis for signal and power integrity using the multilayered finite difference method Proceedings - Ieee International Symposium On Circuits and Systems. 1493-1496. |
0.588 |
|
| 2006 |
Mandrekar R, Bharath K, Srinivasan K, Engin E, Swaminathan M. System level signal and power integrity analysis methodology for system-in-package applications Proceedings - Design Automation Conference. 1009-1012. DOI: 10.1145/1146909.1147163 |
0.649 |
|
| 2006 |
Bharath K, Engin E, Swaminathan M, Uriu K, Yamada T. Efficient modeling of package power delivery networks with fringing fields and gap coupling in mixed signal systems Electrical Performance of Electronic Packaging, Epep. 59-62. DOI: 10.1109/EPEP.2006.321190 |
0.415 |
|
| 2006 |
Ege Engin A, Bharath K, Swaminathan M, Cases M, Mutnury B, Pham N, De Araujo DN, Matoglu E. Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards Proceedings - Electronic Components and Technology Conference. 2006: 1262-1267. DOI: 10.1109/ECTC.2006.1645815 |
0.631 |
|
| 2006 |
Engin AE, Bharath K, Srinivasan K, Swaminathan M. Modeling of multilayered packages and boards using modal decomposition and finite difference methods Ieee International Symposium On Electromagnetic Compatibility. 3: 646-650. |
0.523 |
|
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