Year |
Citation |
Score |
2013 |
Banerjee S, Agarwal KB. Diffraction pattern based optimization of lithographic targets for improved printability Proceedings of Spie - the International Society For Optical Engineering. 8684. DOI: 10.1117/12.2011532 |
0.398 |
|
2013 |
Banerjee S, Agarwal KB, Orshansky M. Methods for joint optimization of mask and design targets for improving lithographic process window Journal of Micro/Nanolithography, Mems, and Moems. 12. DOI: 10.1117/1.Jmm.12.2.023014 |
0.37 |
|
2013 |
Banerjee S, Agarwal KB, Nassif S, Orshansky M. Shape slack: A design-manufacturing co-optimization methodology using tolerance information Journal of Micro/Nanolithography, Mems, and Moems. 12. DOI: 10.1117/1.Jmm.12.1.013014 |
0.378 |
|
2013 |
Ghaida RS, Agarwal KB, Nassif SR, Yuan X, Liebmann LW, Gupta P. Layout decomposition and legalization for double-patterning technology Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 32: 202-215. DOI: 10.1109/Tcad.2012.2232710 |
0.357 |
|
2012 |
Ghaida RS, Agarwal KB, Liebmann LW, Nassif SR, Gupta P. A novel methodology for triple/multiple-patterning layout decomposition Proceedings of Spie - the International Society For Optical Engineering. 8327. DOI: 10.1117/12.916636 |
0.314 |
|
2011 |
Banerjee S, Agarwal KB, Orshansky M. Simultaneous OPC and decomposition for double exposure lithography Proceedings of Spie - the International Society For Optical Engineering. 7973. DOI: 10.1117/12.879540 |
0.373 |
|
2011 |
Agarwal KB, Banerjee S. Integrated model-based retargeting and optical proximity correction Proceedings of Spie - the International Society For Optical Engineering. 7974. DOI: 10.1117/12.879531 |
0.391 |
|
2011 |
Agarwal K. Lithographic variation aware design centering for SRAM yield enhancement Proceedings of Spie. 7974: 797406. DOI: 10.1117/12.879503 |
0.387 |
|
2011 |
Banerjee S, Agarwal KB, Nassif SR, Culp JA, Liebmann LW, Orshansky M. Coupling timing objectives with optical proximity correction for improved timing yield Proceedings of the 12th International Symposium On Quality Electronic Design, Isqed 2011. 97-102. DOI: 10.1109/ISQED.2011.5770710 |
0.313 |
|
2011 |
Banerjee S, Agarwal KB, Nassif SR. Electrically-driven retargeting for nanoscale layouts Proceedings of the Custom Integrated Circuits Conference. DOI: 10.1109/CICC.2011.6055404 |
0.313 |
|
2010 |
Singh H, Rao R, Agarwal K, Sylvester D, Brown R. Dynamically Pulsed MTCMOS With Bus Encoding for Reduction of Total Power and Crosstalk Noise Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 18: 166-170. DOI: 10.1109/Tvlsi.2009.2031290 |
0.568 |
|
2010 |
Joshi V, Cline B, Sylvester D, Blaauw D, Agarwal K. Mechanical stress aware optimization for leakage power reduction Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 29: 722-736. DOI: 10.1109/Tcad.2010.2042893 |
0.621 |
|
2009 |
Banerjee S, Agarwal KB, Culp JA, Elakkumanan P, Liebmann LW, Orshansky M. Compensating non-optical effects using electrically-driven optical proximity correction Proceedings of Spie - the International Society For Optical Engineering. 7275. DOI: 10.1117/12.814872 |
0.374 |
|
2009 |
Wang V, Agarwal K, Nassif SR, Nowka KJ, Markovic D. A Simplified Design Model for Random Process Variability Ieee Transactions On Semiconductor Manufacturing. 22: 12-21. DOI: 10.1109/Tsm.2008.2011630 |
0.438 |
|
2009 |
Zhao W, Liu F, Agarwal K, Acharyya D, Nassif SR, Nowka KJ, Cao Y. Rigorous Extraction of Process Variations for 65-nm CMOS Design Ieee Transactions On Semiconductor Manufacturing. 22: 196-203. DOI: 10.1109/Tsm.2008.2011182 |
0.416 |
|
2009 |
Hayes JD, Agarwal K, Nassif SR. Technique for the Rapid Characterization of Parametric Distributions Ieee Transactions On Semiconductor Manufacturing. 22: 66-71. DOI: 10.1109/Tsm.2008.2010732 |
0.326 |
|
2008 |
Agarwal K, Nassif S. The Impact of Random Device Variation on SRAM Cell Stability in Sub-90-nm CMOS Technologies Ieee Transactions On Very Large Scale Integration Systems. 16: 86-97. DOI: 10.1109/Tvlsi.2007.909792 |
0.387 |
|
2008 |
Agarwal K, Hayes J, Nassif S. Fast Characterization of Threshold Voltage Fluctuation in MOS Devices Ieee Transactions On Semiconductor Manufacturing. 21: 526-533. DOI: 10.1109/Tsm.2008.2004323 |
0.353 |
|
2008 |
Sylvester D, Agarwal K, Shah S. Invited paper: Variability in nanometer CMOS: Impact, analysis, and minimization Integration. 41: 319-339. DOI: 10.1016/J.Vlsi.2007.09.001 |
0.62 |
|
2007 |
Singh H, Agarwal K, Sylvester D, Nowka KJ. Enhanced Leakage Reduction Techniques Using Intermediate Strength Power Gating Ieee Transactions On Very Large Scale Integration Systems. 15: 1215-1224. DOI: 10.1109/Tvlsi.2007.904101 |
0.566 |
|
2007 |
Agarwal K, Rao R, Sylvester D, Brown R. Parametric Yield Analysis and Optimization in Leakage Dominated Technologies Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 15: 613-623. DOI: 10.1109/Tvlsi.2007.898625 |
0.597 |
|
2006 |
Agarwal K, Sylvester D, Blaauw D. Modeling and analysis of crosstalk noise in coupled RLC interconnects Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 25: 892-901. DOI: 10.1109/Tcad.2005.855961 |
0.565 |
|
2006 |
Agarwal K, Agarwal M, Sylvester D, Blaauw D. Statistical interconnect metrics for physical-design optimization Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 25: 1273-1288. DOI: 10.1109/Tcad.2005.855954 |
0.421 |
|
2004 |
Agarwal K, Sylvester D, Blaauw D. A simple metric for slew rate of RC circuits based on two circuit moments Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 23: 1346-1354. DOI: 10.1109/Tcad.2004.833607 |
0.567 |
|
2004 |
Agarwal K, Sylvester D, Blaauw D. A Library Compatible Driver Output Model for On-Chip RLC Transmission Lines Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 23: 128-136. DOI: 10.1109/Tcad.2003.819889 |
0.574 |
|
2003 |
Sato T, Cao Y, Agarwal K, Sylvester D, Hu C. Bidirectional closed-form transformation between on-chip coupling noise waveforms and interconnect delay-change curves Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 22: 560-572. DOI: 10.1109/Tcad.2003.810750 |
0.559 |
|
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