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Xuejun Fan - Publications

Affiliations: 
Mechanical Engineering Lamar University - Beaumont 
Area:
Mechanical Engineering
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32 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Fan J, Chen W, Yuan W, Fan X, Zhang G. Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model. Optics Express. 28: 13921-13937. PMID 32403858 DOI: 10.1364/Oe.387660  0.33
2020 Cui Z, Fan J, Ginkel HJv, Fan X, Zhang G. The interface adhesion of CaAlSiN 3 : Eu 2+ phosphor/silicone used in light-emitting diode packaging: A first principles study Applied Surface Science. 510: 145251. DOI: 10.1016/J.Apsusc.2020.145251  0.312
2019 Fan J, Wang Z, Deng Z, Fan X, Zhang G. High Moisture Accelerated Mechanical Behavior Degradation of Phosphor/Silicone Composites Used in White Light-Emitting Diodes. Polymers. 11. PMID 31370367 DOI: 10.3390/Polym11081277  0.33
2019 Zhang H, Liu Y, Wang L, Sun F, Fan J, Placette MD, Fan X, Zhang G. Effects of Sintering Pressure on the Densification and Mechanical Properties of Nanosilver Double-Side Sintered Power Module Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 963-972. DOI: 10.1109/Tcpmt.2018.2884032  0.3
2019 Chen W, Fan J, Qian C, Pu B, Fan X, Zhang G. Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method Ieee Access. 7: 68495-68502. DOI: 10.1109/Access.2019.2916878  0.349
2019 Sun B, Fan J, Fan X, Zhang G, Zhang G. A Reliability Prediction Methodology for LED Arrays Ieee Access. 7: 8127-8134. DOI: 10.1109/Access.2018.2887252  0.337
2019 Hoque A, Bradley RK, Fan J, Fan X. Effects of humidity and phosphor on silicone/phosphor composite in white light-emitting diode package Journal of Materials Science: Materials in Electronics. 30: 20471-20478. DOI: 10.1007/S10854-019-02393-8  0.319
2018 Jiang C, Fan J, Qian C, Zhang H, Fan X, Guo W, Zhang G. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages Ieee Transactions On Components, Packaging and Manufacturing Technology. 8: 1254-1262. DOI: 10.1109/Tcpmt.2018.2789345  0.327
2018 Sun B, Fan X, Driel WDv, Cui C, Zhang G. A stochastic process based reliability prediction method for LED driver Reliability Engineering & System Safety. 178: 140-146. DOI: 10.1016/J.Ress.2018.06.001  0.303
2018 Fan J, Cao J, Yu C, Qian C, Fan X, Zhang G. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures Microelectronics Reliability. 84: 140-148. DOI: 10.1016/J.Microrel.2018.03.033  0.323
2017 Qian C, Fan J, Fang J, Yu C, Ren Y, Fan X, Zhang G. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method. Materials (Basel, Switzerland). 10. PMID 29035300 DOI: 10.3390/Ma10101181  0.337
2017 Hou F, Lin T, Cao L, Liu F, Li J, Fan X, Zhang GQ. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1721-1728. DOI: 10.1109/Tcpmt.2017.2726084  0.324
2017 Sun B, Fan X, Li L, Ye H, Driel Wv, Zhang G. A Reliability Prediction for Integrated LED Lamp With Electrolytic Capacitor-Free Driver Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1081-1088. DOI: 10.1109/Tcpmt.2017.2698468  0.331
2017 Sun B, Fan X, Ye H, Fan J, Qian C, van Driel W, Zhang G. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation Reliability Engineering & System Safety. 163: 14-21. DOI: 10.1016/J.Ress.2017.01.017  0.313
2017 Lu G, van Driel W, Fan X, Fan J, Qian C, Zhang G. Color shift acceleration on mid-power LED packages Microelectronics Reliability. 78: 294-298. DOI: 10.1016/J.Microrel.2017.09.014  0.32
2017 Tang H, Ye H, Wong CKY, Leung SYY, Fan J, Chen X, Fan X, Zhang G. Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component Microelectronics Reliability. 78: 197-204. DOI: 10.1016/J.Microrel.2017.09.008  0.317
2017 Qian C, Li Y, Fan J, Fan X, Fu J, Zhao L, Zhang G. Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method Microelectronics Reliability. 74: 173-178. DOI: 10.1016/J.Microrel.2017.04.015  0.313
2017 Fan J, Yu C, Qian C, Fan X, Zhang G. Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages Microelectronics Reliability. 74: 179-185. DOI: 10.1016/J.Microrel.2017.04.012  0.329
2017 Fan J, Zhang M, Luo X, Qian C, Fan X, Ji A, Zhang G. Phosphor–silicone interaction effects in high power white light emitting diode packages Journal of Materials Science: Materials in Electronics. 28: 17557-17569. DOI: 10.1007/S10854-017-7692-X  0.329
2016 Sun B, Fan X, Qian C, Zhang G. PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers Ieee Transactions On Industrial Electronics. 63: 6726-6735. DOI: 10.1109/Tie.2016.2581156  0.31
2016 Huang J, Golubovic DS, Koh S, Yang D, Li X, Fan X, Zhang G. Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation Ieee Transactions On Electron Devices. 63: 2807-2814. DOI: 10.1109/Ted.2016.2565709  0.317
2016 Shen Y, Zhang L, Zhu W, Zhou J, Fan X. Finite-Element Analysis and Experimental Test for a Capped-Die Flip-Chip Package Design Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 1308-1316. DOI: 10.1109/Tcpmt.2016.2592947  0.324
2016 Cai M, Yang D, Tian K, Chen W, Chen X, Zhang P, Fan X, Zhang G. A hybrid prediction method on luminous flux maintenance of high-power LED lamps Applied Thermal Engineering. 95: 482-490. DOI: 10.1016/J.Applthermaleng.2015.11.034  0.342
2015 Huang J, Golubovic DS, Koh S, Yang D, Li X, Fan X, Zhang GQ. Rapid Degradation of Mid-Power White-Light LEDs in Saturated Moisture Conditions Ieee Transactions On Device and Materials Reliability. 15: 478-485. DOI: 10.1109/Tdmr.2015.2468587  0.337
2015 Huang J, Golubović DS, Koh S, Yang D, Li X, Fan X, Zhang GQ. Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests Microelectronics Reliability. DOI: 10.1016/J.Microrel.2015.09.008  0.3
2013 Fan X, Ranouta AS, Dhiman HS. Effects of Package Level Structure and Material Properties on Solder Joint Reliability Under Impact Loading Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 52-60. DOI: 10.1109/Tcpmt.2012.2217744  0.323
2012 Fan X, Ranouta AS. Finite Element Modeling of System Design and Testing Conditions for Component Solder Ball Reliability Under Impact Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 1802-1810. DOI: 10.1109/Tcpmt.2012.2204884  0.312
2012 Fan X, Nagaraj V. In-situ moisture desorption characterization of epoxy mold compound 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Eurosime 2012. DOI: 10.1109/ESimE.2012.6191772  0.455
2012 Fan X, Nagaraj V. Finite element modeling of anomalous moisture diffusion with dual stage model Proceedings - Electronic Components and Technology Conference. 1190-1193. DOI: 10.1109/ECTC.2012.6248987  0.485
2011 Dandu P, Fan X. Assessment of current density singularity in electromigration of solder bumps Proceedings - Electronic Components and Technology Conference. 2192-2196. DOI: 10.1109/ECTC.2011.5898823  0.655
2008 Fan X, Zhang GQ, Driel WDv, Ernst LJ. Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning Ieee Transactions On Components and Packaging Technologies. 31: 252-259. DOI: 10.1109/Tcapt.2008.921629  0.316
2004 Driel WDv, Wisse G, Chang AYL, Janssen JHJ, Fan X, Zhang KGQ, Ernst LJ. Influence of material combinations on delamination failures in a cavity-down TBGA package Ieee Transactions On Components and Packaging Technologies. 27: 651-658. DOI: 10.1109/Tcapt.2004.838859  0.317
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