Year |
Citation |
Score |
2020 |
Kirk TL, Karamanis G, Crowdy DG, Hodes M. Thermocapillary stress and meniscus curvature effects on slip lengths in ridged microchannels Journal of Fluid Mechanics. 894. DOI: 10.1017/Jfm.2020.279 |
0.503 |
|
2019 |
Kane D, Hodes M. Isoflux Nusselt Number Expression For Combined Poiseuille And Couette Flow Capturing Asymmetry And Slip Heat Transfer Research. 50: 1531-1538. DOI: 10.1615/Heattransres.2018024625 |
0.347 |
|
2019 |
Karamanis G, Hodes M. Conjugate Nusselt Numbers for Simultaneously Developing Flow Through Rectangular Ducts Journal of Heat Transfer-Transactions of the Asme. 141: 81701. DOI: 10.1115/1.4043623 |
0.353 |
|
2019 |
Karamanis G, Hodes M. Simultaneous Optimization of an Array of Heat Sinks Journal of Electronic Packaging. 141: 21001. DOI: 10.1115/1.4042668 |
0.42 |
|
2019 |
Mayer M, Hodes M, Kirk T, Crowdy D. Effect of surface curvature on contact resistance between cylinders Journal of Heat Transfer-Transactions of the Asme. 141: 32002. DOI: 10.1115/1.4042441 |
0.328 |
|
2019 |
Game SE, Hodes M, Papageorgiou DT. Effects of slowly-varying meniscus curvature on internal flows in the Cassie state Journal of Fluid Mechanics. 872: 272-307. DOI: 10.1017/Jfm.2019.366 |
0.332 |
|
2018 |
Hodes M, Kirk T, Crowdy D. Spreading and Contact Resistance Formulae Capturing Boundary Curvature and Contact Distribution Effects Journal of Heat Transfer-Transactions of the Asme. 140: 104503. DOI: 10.1115/1.4039993 |
0.31 |
|
2018 |
Game S, Hodes M, Kirk T, Papageorgiou DT. Nusselt Numbers for Poiseuille Flow over Isoflux Parallel Ridges for Arbitrary Meniscus Curvature Journal of Heat Transfer-Transactions of the Asme. 140: 81701. DOI: 10.1115/1.4038831 |
0.357 |
|
2017 |
Karamanis G, Hodes M, Kirk T, Papageorgiou DT. Solution of the Extended Graetz–Nusselt Problem for Liquid Flow Over Isothermal Parallel Ridges Journal of Heat Transfer-Transactions of the Asme. 140: 61703. DOI: 10.1115/1.4039085 |
0.348 |
|
2017 |
Kirk TL, Hodes M, Papageorgiou DT. Nusselt numbers for Poiseuille flow over isoflux parallel ridges accounting for meniscus curvature Journal of Fluid Mechanics. 811: 315-349. DOI: 10.1017/Jfm.2016.760 |
0.525 |
|
2016 |
Karamanis G, Hodes M. Longitudinal-fin heat sink optimization capturing conjugate effects under fully developed conditions Journal of Thermal Science and Engineering Applications. 8. DOI: 10.1115/1.4034339 |
0.569 |
|
2016 |
Lam LS, Hodes M, Karamanis G, Kirk T, MacLachlan S. Effect of meniscus curvature on apparent thermal slip Journal of Heat Transfer. 138. DOI: 10.1115/1.4034189 |
0.738 |
|
2015 |
Hodes M, Lam LS, Cowley A, Enright R, MacLachlan S. Effect of evaporation and condensation at menisci on apparent thermal slip Journal of Heat Transfer. 137. DOI: 10.1115/1.4029818 |
0.75 |
|
2015 |
Zhang R, Hodes M, Lower N, Wilcoxon R. Water-Based Microchannel and Galinstan-Based Minichannel Cooling Beyond 1 kW/cm² Heat Flux Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2426791 |
0.579 |
|
2014 |
Lam LS, Melnick C, Hodes M, Ziskind G, Enright R. Nusselt numbers for thermally developing couette flow with hydrodynamic and thermal slip Journal of Heat Transfer. 136. DOI: 10.1115/1.4026305 |
0.74 |
|
2014 |
Enright R, Hodes M, Salamon T, Muzychka Y. Isoflux nusselt number and slip length formulae for superhydrophobic microchannels Journal of Heat Transfer. 136. DOI: 10.1115/1.4024837 |
0.579 |
|
2014 |
Hodes M, Zhang R, Lam LS, Wilcoxon R, Lower N. On the potential of galinstan-based minichannel and minigap cooling Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 46-56. DOI: 10.1109/Tcpmt.2013.2274699 |
0.737 |
|
2014 |
Zhang R, Hodes M, Lower N, Wilcoxon R. High heat flux, single-phase microchannel cooling Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 1-7. DOI: 10.1109/SEMI-THERM.2014.6892207 |
0.471 |
|
2014 |
Griffin JS, Mills DH, Cleary M, Nelson R, Manno VP, Hodes M. Continuous extraction rate measurements during supercritical CO2 drying of silica alcogel Journal of Supercritical Fluids. 94: 38-47. DOI: 10.1016/J.Supflu.2014.05.020 |
0.317 |
|
2014 |
Hodes M, Lam LS, MacLachlan S, Enright R. Effects of evaporation and condensation on apparent thermal slip Proceedings of the 15th International Heat Transfer Conference, Ihtc 2014. |
0.74 |
|
2013 |
Lam LS, Hodes M, Enright R. Analysis of galinstan-based microgap cooling enhancement using structured surfaces Asme 2013 Heat Transfer Summer Conf. Collocated With the Asme 2013 7th Int. Conf. On Energy Sustainability and the Asme 2013 11th Int. Conf. On Fuel Cell Science, Engineering and Technology, Ht 2013. 3. DOI: 10.1115/1.4030208 |
0.733 |
|
2013 |
Cleary M, North MT, Van Lieshout M, Brooks DA, Grimes R, Hodes M. Reduced power precision temperature control using variable conductance heat pipes Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 2048-2058. DOI: 10.1109/Tcpmt.2013.2270286 |
0.421 |
|
2013 |
Mueller S, Hodes M, Lyons A. Capillary-driven evaporation-enhanced heat sink Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1683-1692. DOI: 10.1109/Tcpmt.2013.2253157 |
0.557 |
|
2013 |
Zhang R, Hodes M, Lower N, Wilcoxon R. Thermo-fluid characteristics of a minichannel heat sink cooled with liquid metal Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 159-165. DOI: 10.1109/SEMI-THERM.2013.6526822 |
0.479 |
|
2012 |
Zhang R, Hodes M, Brooks DA, Manno VP. Optimized thermoelectric module-heat sink assemblies for precision temperature control Journal of Electronic Packaging, Transactions of the Asme. 134. DOI: 10.1115/1.4005905 |
0.514 |
|
2012 |
Melnick C, Hodes M, Ziskind G, Cleary M, Manno VP. Thermoelectric module-variable conductance heat pipe assemblies for reduced power temperature control Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 474-482. DOI: 10.1109/Tcpmt.2011.2178413 |
0.52 |
|
2012 |
Krishnan S, Hernon D, Hodes M, Mullins J, Lyons AM. Design of complex structured monolithic heat sinks for enhanced air cooling Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 266-277. DOI: 10.1109/Tcpmt.2011.2175448 |
0.533 |
|
2012 |
Hodes M. Optimal design of thermoelectric refrigerators embedded in a thermal resistance network Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 483-495. DOI: 10.1109/Tcpmt.2011.2166762 |
0.478 |
|
2012 |
Hodes M, Rui Zhang, Wilcoxon R, Lower N. Cooling potential of galinstan-based minichannel heat sinks Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 297-302. DOI: 10.1109/ITHERM.2012.6231443 |
0.49 |
|
2011 |
Wlezien R, Prapas J, Briggs S, Hodes M, Manno V, Matson D, Chiesa L. Characterization and optimization of fluid flow in a high biot number system Materials Research Society Symposium Proceedings. 1306: 25-30. DOI: 10.1557/Opl.2011.91 |
0.404 |
|
2010 |
Hodes M. Optimal pellet geometries for thermoelectric power generation Ieee Transactions On Components and Packaging Technologies. 33: 307-318. DOI: 10.1615/Ihtc13.P21.210 |
0.314 |
|
2010 |
Hodes M. Optimal pellet geometries for thermoelectric refrigeration under robin boundary conditions Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 605-614. DOI: 10.1115/InterPACK2009-89376 |
0.395 |
|
2010 |
Kumari N, Bahadur V, Hodes M, Salamon T, Lyons A, Kolodner P, Garimella SV. Numerical analysis of mist-cooled high power components in cabinets Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 933-944. DOI: 10.1115/InterPACK2009-89269 |
0.473 |
|
2010 |
Enright R, Hodes M, Salamon TR, Muzychka Y. Analysis and simulation of heat transfer in a superhydrophobic microchannel 2010 14th International Heat Transfer Conference, Ihtc 14. 6: 157-168. DOI: 10.1115/IHTC14-22948 |
0.451 |
|
2010 |
Hwang DC, Manno VP, Hodes M, Chan GJ. Energy savings achievable through liquid cooling: A rack level case study 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501419 |
0.36 |
|
2010 |
Annapragada SR, Salamon T, Kolodner P, Hodes M, Garimella SV. Prediction of electrical contact resistivity in thermoelectric modules (TEMs) from module-level measurements 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501317 |
0.349 |
|
2010 |
Kumari N, Bahadur V, Hodes M, Salamon T, Kolodner P, Lyons A, Garimella SV. Analysis of evaporating mist flow for enhanced convective heat transfer International Journal of Heat and Mass Transfer. 53: 3346-3356. DOI: 10.1016/J.Ijheatmasstransfer.2010.02.027 |
0.549 |
|
2009 |
Pettes AM, Hodes MS, Goodson KE. Optimized thermoelectric refrigeration in the presence of thermal boundary resistance Ieee Transactions On Advanced Packaging. 32: 423-430. DOI: 10.1109/Tadvp.2008.924221 |
0.423 |
|
2009 |
Hernon D, Salamon T, Kempers R, Krishnan S, Lyons A, Hodes M, Kolodner P, Mullins J, McGarry L. Thermal management: Enabling enhanced functionality and reduced carbon footprint Bell Labs Technical Journal. 14: 7-19. DOI: 10.1002/bltj.20385 |
0.409 |
|
2009 |
Kim KJ, Hodes M. Thermoelectric energy scavenging from waste heat of power amplifier transistors 15th International Workshop On Thermal Investigations of Ics and Systems, Therminic 2009. 75-79. |
0.306 |
|
2009 |
Lyons A, Krishnan S, Mullins J, Hodes M, Hernon D. Advanced heat sinks enabled by three-dimensional printing 20th Annual International Solid Freeform Fabrication Symposium, Sff 2009. 749-760. |
0.369 |
|
2009 |
Cleary M, Grimes R, Hodes M, North MT. PIV measurements in the condenser region of a gas-loaded thermosyphon 2008 Proceedings of the Asme Summer Heat Transfer Conference, Ht 2008. 3: 651-658. |
0.365 |
|
2008 |
Enright R, Dalton T, Krupenkin TN, Kolodner P, Hodes M, Salamon TR. Effects of interfacial position on drag reduction in a superhydrophobic microchannel Proceedings of the 6th International Conference On Nanochannels, Microchannels, and Minichannels, Icnmm2008. 835-845. DOI: 10.1115/ICNMM2008-62251 |
0.333 |
|
2008 |
Bahadur V, Hodes M, Lyons A, Krishnan S, Garimella SV. Enhanced cooling in a sealed cabinet using an evaporating-condensing dielectric mist 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 1191-1198. DOI: 10.1109/ITHERM.2008.4544396 |
0.458 |
|
2007 |
Krishnan S, Hodes M, Jones C, Malis O. Analysis of an annular-geometry thermoelectric module (TEM) 2007 Proceedings of the Asme Interpack Conference, Ipack 2007. 2: 241-247. DOI: 10.1115/IPACK2007-33763 |
0.465 |
|
2007 |
Cleary M, Hodes M, Grimes R, North MT. Characterisation of a variable conductance heat pipe prototype for a photonic application 2007 Proceedings of the Asme/Jsme Thermal Engineering Summer Heat Transfer Conference - Ht 2007. 3: 313-320. DOI: 10.1115/HT2007-32623 |
0.334 |
|
2007 |
Hodes M, Bolle C, Kolodner P. Efficient cooling of multiple components in a shielded circuit pack Journal of Electronic Packaging, Transactions of the Asme. 129: 216-218. DOI: 10.1115/1.2721095 |
0.547 |
|
2007 |
Kolodner P, Hodes M, Ewes I, Holmes P. Mechanical gap fillers: Concepts and thermal resistance measurements Ieee Transactions On Components and Packaging Technologies. 30: 813-823. DOI: 10.1109/Tcapt.2007.906696 |
0.452 |
|
2007 |
Hodes M. Optimal Pellet Geometries for Thermoelectric Refrigeration Ieee Transactions On Components and Packaging Technologies. 30: 50-58. DOI: 10.1109/Tcapt.2007.892068 |
0.377 |
|
2006 |
Cleary M, Hodes M, Grimes R, North MT. Design of a variable conductance heat pipe for a photonic component American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. DOI: 10.1115/IMECE2006-13603 |
0.347 |
|
2006 |
Krupenkin T, Kolodner P, Taylor JA, Hodes M. Electrically tunable superhydrophobic nanostructured surfaces Proceedings of the 4th International Conference On Nanochannels, Microchannels and Minichannels, Icnmm2006. 2006: 1211-1220. DOI: 10.1002/Bltj.20111 |
0.327 |
|
2006 |
Enright R, Eason C, Dalton T, Hodes M, Salamon T, Kolodner P, Krupenkin T. Friction factors and nusselt numbers in microchannels with superhydrophobic walls Proceedings of the 4th International Conference On Nanochannels, Microchannels and Minichannels, Icnmm2006. 2006: 599-609. |
0.454 |
|
2005 |
Salamon T, Lee W, Krupenkin T, Hodes M, Kolodner P, Enright R, Salinger A. Numerical simulation of fluid flow in microchannels with superhydrophobic walls American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. 376: 819-829. DOI: 10.1115/IMECE2005-82641 |
0.303 |
|
2005 |
Hodes M. On one-dimensional analysis of thermoelectric modules (TEMs) Ieee Transactions On Components and Packaging Technologies. 28: 218-229. DOI: 10.1109/Tcapt.2005.848532 |
0.337 |
|
2004 |
Hodes M, Marrone PA, Hong GT, Smith KA, Tester JW. Salt precipitation and scale control in supercritical water oxidation - Part A: Fundamentals and research Journal of Supercritical Fluids. 29: 265-288. DOI: 10.1016/S0896-8446(03)00093-7 |
0.397 |
|
2004 |
Marrone PA, Hodes M, Smith KA, Tester JW. Salt precipitation and scale control in supercritical water oxidation - Part B: Commercial/full-scale applications Journal of Supercritical Fluids. 29: 289-312. DOI: 10.1016/S0896-8446(03)00092-5 |
0.355 |
|
2004 |
Hodes M, Griffith P, Smith KA, Hurst WS, Bowers WJ, Sako K. Salt solubility and deposition in high temperature and pressure aqueous solutions Aiche Journal. 50: 2038-2049. DOI: 10.1002/Aic.10238 |
0.368 |
|
2003 |
Hodes M, Smith KA, Griffith P. A natural convection model for the rate of salt deposition from near-supercritical, aqueous solutions Journal of Heat Transfer. 125: 1027-1037. DOI: 10.1115/1.1603772 |
0.33 |
|
2002 |
Hodes M, Weinstein RD, Pence SJ, Piccini JM, Manzione L, Chen C. Transient Thermal Management of a Handset Using Phase Change Material (PCM) Journal of Electronic Packaging, Transactions of the Asme. 124: 419-426. DOI: 10.1115/1.1523061 |
0.318 |
|
2002 |
Smith KA, Hodes M, Griffith P. On the potential for homogeneous nucleation of salt from aqueous solution in a natural convection boundary layer Journal of Heat Transfer. 124: 930-937. DOI: 10.1115/1.1494089 |
0.356 |
|
2001 |
Chen C, Hodes M, Manzione L. Sizing of heat spreaders above dielectric layers Journal of Electronic Packaging, Transactions of the Asme. 123: 173-181. DOI: 10.1115/1.1377271 |
0.487 |
|
2001 |
Weinstein RD, Hodes M, Piccini JM. Improved static and transient thermal management of handsets using heat spreaders and Phase Change Materials (PCMS) Proceedings of the National Heat Transfer Conference. 1: 205-214. |
0.389 |
|
2000 |
Hodes M. Formulae to size axisymmetric heat spreaders above dielectric layers American Society of Mechanical Engineers, Manufacturing Engineering Division, Med. 11: 443-451. |
0.413 |
|
1995 |
Bar-Cohen A, Solbreken G, Hodes M, Sherwood G. Gas-Assisted Evaporative Cooling of High Density Electronic Modules Ieee Transactions On Components Packaging and Manufacturing Technology Part A. 18: 502-509. DOI: 10.1109/95.465144 |
0.432 |
|
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