| Year |
Citation |
Score |
| 2020 |
Barmak K, Ezzat S, Gusley R, Jog A, Kerdsongpanya S, Khaniya A, Milosevic E, Richardson W, Sentosun K, Zangiabadi A, Gall D, Kaden WE, Mucciolo ER, Schelling PK, West AC, et al. Epitaxial metals for interconnects beyond Cu Journal of Vacuum Science & Technology A. 38: 033406. DOI: 10.1116/6.0000018 |
0.427 |
|
| 2019 |
Gusley R, Sentosun K, Ezzat S, Coffey KR, West AC, Barmak K. Electrodeposition of Epitaxial Co on Ru(0001)/Al2O3(0001) Journal of the Electrochemical Society. 166: D875-D881. DOI: 10.1149/2.1091915Jes |
0.317 |
|
| 2019 |
Ezzat SS, Mani PD, Khaniya A, Kaden W, Gall D, Barmak K, Coffey KR. Resistivity and surface scattering of (0001) single crystal ruthenium thin films Journal of Vacuum Science & Technology A. 37: 031516. DOI: 10.1116/1.5093494 |
0.31 |
|
| 2019 |
Milosevic E, Kerdsongpanya S, McGahay ME, Zangiabadi A, Barmak K, Gall D. Resistivity scaling and electron surface scattering in epitaxial Co(0001) layers Journal of Applied Physics. 125: 245105. DOI: 10.1063/1.5086458 |
0.324 |
|
| 2019 |
Boissonière GML, Choksi R, Barmak K, Esedoḡlu S. Statistics of grain growth: Experiment versus the phase-field-crystal and Mullins models Materialia. 6: 100280. DOI: 10.1016/J.Mtla.2019.100280 |
0.394 |
|
| 2018 |
Milosevic E, Kerdsongpanya S, Zangiabadi A, Barmak K, Coffey KR, Gall D. Resistivity size effect in epitaxial Ru(0001) layers Journal of Applied Physics. 124: 165105. DOI: 10.1063/1.5046430 |
0.335 |
|
| 2017 |
Barmak K, Liu J. Impact of deposition rate, underlayers, and substrates on β-tungsten formation in sputter deposited films Journal of Vacuum Science and Technology. 35: 61516. DOI: 10.1116/1.5003628 |
0.351 |
|
| 2017 |
Ratanaphan S, Boonkird T, Sarochawikasit R, Beladi H, Barmak K, Rohrer GS. Atomistic simulations of grain boundary energies in tungsten Materials Letters. 186: 116-118. DOI: 10.1016/J.Matlet.2016.09.104 |
0.315 |
|
| 2017 |
Choi D, Barmak K. On the potential of tungsten as next-generation semiconductor interconnects Electronic Materials Letters. 13: 449-456. DOI: 10.1007/S13391-017-1610-5 |
0.317 |
|
| 2017 |
Rohrer GS, Liu X, Liu J, Darbal A, Kelly MN, Chen X, Berkson MA, Nuhfer NT, Coffey KR, Barmak K. The grain boundary character distribution of highly twinned nanocrystalline thin film aluminum compared to bulk microcrystalline aluminum Journal of Materials Science. 52: 9819-9833. DOI: 10.1007/S10853-017-1112-8 |
0.452 |
|
| 2016 |
Barmak K, Liu X, Darbal A, Nuhfer NT, Choi D, Sun T, Warren AP, Coffey KR, Toney MF. On twin density and resistivity of nanometric Cu thin films Journal of Applied Physics. 120: 065106. DOI: 10.1063/1.4960701 |
0.464 |
|
| 2016 |
Liu J, Riddiford LJ, Floristean C, Goncalves-Neto F, Rezaeeyazdi M, Lewis LH, Barmak K. Kinetics of order-disorder transformation of L12 FeNi3 in the Fe-Ni system Journal of Alloys and Compounds. 689: 593-598. DOI: 10.1016/J.Jallcom.2016.08.036 |
0.341 |
|
| 2016 |
Montes-Arango AM, Marshall LG, Fortes AD, Bordeaux NC, Langridge S, Barmak K, Lewis LH. Discovery of process-induced tetragonality in equiatomic ferromagnetic FeNi Acta Materialia. 116: 263-269. DOI: 10.1016/J.Actamat.2016.06.050 |
0.341 |
|
| 2016 |
Liu J, Barmak K. Topologically close-packed phases: Deposition and formation mechanism of metastable β-W in thin films Acta Materialia. 104: 223-227. DOI: 10.1016/J.Actamat.2015.11.049 |
0.342 |
|
| 2016 |
Bordeaux N, Montes-Arango AM, Liu J, Barmak K, Lewis LH. Thermodynamic and kinetic parameters of the chemical order-disorder transformation in L10 FeNi (tetrataenite) Acta Materialia. 103: 608-615. DOI: 10.1016/J.Actamat.2015.10.042 |
0.333 |
|
| 2015 |
Liu X, Nuhfer NT, Warren AP, Coffey KR, Rohrer GS, Barmak K. Grain size dependence of the twin length fraction in nanocrystalline Cu thin films via transmission electron microscopy based orientation mapping Journal of Materials Research. 30: 528-537. DOI: 10.1557/Jmr.2014.393 |
0.486 |
|
| 2015 |
Liu J, Barmak K. Interdiffusion in nanometric Fe/Ni multilayer films Journal of Vacuum Science and Technology. 33: 21510. DOI: 10.1116/1.4905465 |
0.382 |
|
| 2015 |
Poirier E, Pinkerton FE, Kubic R, Mishra RK, Bordeaux N, Mubarok A, Lewis LH, Goldstein JI, Skomski R, Barmak K. Intrinsic magnetic properties of L10 FeNi obtained from meteorite NWA 6259 Journal of Applied Physics. 117. DOI: 10.1063/1.4916190 |
0.32 |
|
| 2015 |
Liu J, Barmak K. Method for measurement of diffusivity: Calorimetric studies of Fe/Ni multilayer thin films Scripta Materialia. 104: 1-4. DOI: 10.1016/J.Scriptamat.2015.02.031 |
0.373 |
|
| 2015 |
Montes-Arango AM, Bordeaux NC, Liu J, Barmak K, Lewis LH. L10 phase formation in ternary FePdNi alloys Journal of Alloys and Compounds. 648: 845-852. DOI: 10.1016/J.Jallcom.2015.07.019 |
0.364 |
|
| 2014 |
Barmak K, Darbal A, Ganesh KJ, Ferreira PJ, Rickman JM, Sun T, Yao B, Warren AP, Coffey KR. Surface and grain boundary scattering in nanometric Cu thin films: A quantitative analysis including twin boundaries Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 32. DOI: 10.1116/1.4894453 |
0.384 |
|
| 2014 |
Barmak K, Wang B, Jesanis AT, Berry DC, Rickman JM. Quantitative Kinetic Models of the A1 to ${\rm L}1_{0}$ Transformation in FePt and Related Ternary Alloy Films Ieee Transactions On Magnetics. 50: 1-4. DOI: 10.1109/Tmag.2013.2279132 |
0.399 |
|
| 2014 |
Choi D, Liu X, Schelling PK, Coffey KR, Barmak K. Failure of semiclassical models to describe resistivity of nanometric, polycrystalline tungsten films Journal of Applied Physics. 115: 104308. DOI: 10.1063/1.4868093 |
0.413 |
|
| 2014 |
Liu X, Warren AP, Nuhfer NT, Rollett AD, Coffey KR, Barmak K. Comparison of crystal orientation mapping-based and image-based measurement of grain size and grain size distribution in a thin aluminum film Acta Materialia. 79: 138-145. DOI: 10.1016/J.Actamat.2014.07.014 |
0.381 |
|
| 2014 |
Backofen R, Barmak K, Elder K, Voigt A. Capturing the complex physics behind universal grain size distributions in thin metallic films Acta Materialia. 64: 72-77. DOI: 10.1016/J.Actamat.2013.11.034 |
0.396 |
|
| 2014 |
Liu X, Nuhfer NT, Rollett AD, Sinha S, Lee SB, Carpenter JS, Ledonne JE, Darbal A, Barmak K. Interfacial orientation and misorientation relationships in nanolamellar Cu/Nb composites using transmission-electron-microscope-based orientation and phase mapping Acta Materialia. 64: 333-344. DOI: 10.1016/J.Actamat.2013.10.046 |
0.36 |
|
| 2013 |
Choi D, Moneck M, Liu X, Oh SJ, Kagan CR, Coffey KR, Barmak K. Crystallographic anisotropy of the resistivity size effect in single crystal tungsten nanowires. Scientific Reports. 3: 2591. PMID 24005230 DOI: 10.1038/Srep02591 |
0.334 |
|
| 2013 |
Darbal AD, Ganesh KJ, Liu X, Lee SB, Ledonne J, Sun T, Yao B, Warren AP, Rohrer GS, Rollett AD, Ferreira PJ, Coffey KR, Barmak K. Grain boundary character distribution of nanocrystalline Cu thin films using stereological analysis of transmission electron microscope orientation maps. Microscopy and Microanalysis : the Official Journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada. 19: 111-9. PMID 23380005 DOI: 10.1017/S1431927612014055 |
0.399 |
|
| 2013 |
Granz SD, Barmak K, Kryder MH. Granular L10 FePt:X (X = Ag, B, C, SiOx, TaO x) thin films for heat assisted magnetic recording European Physical Journal B. 86. DOI: 10.1140/Epjb/E2012-30655-3 |
0.436 |
|
| 2013 |
Barmak K, Wang B, Jesanis AT, Berry DC, Rickman JM. L1$_{0}$ FePt: Ordering, Anisotropy Constant and Their Relation to Film Composition Ieee Transactions On Magnetics. 49: 3284-3291. DOI: 10.1109/Tmag.2013.2242445 |
0.381 |
|
| 2013 |
Liu X, Warren AP, Nuhfer TN, Rohrer GS, Coffey KR, Barmak K. Variation of Σ3 and Coherent Σ3 Boundary Fraction with Thickness in Nanometric Cu Films Microscopy and Microanalysis. 19: 1774-1775. DOI: 10.1017/S1431927613010866 |
0.418 |
|
| 2013 |
Liu X, Choi D, Beladi H, Nuhfer NT, Rohrer GS, Barmak K. The five-parameter grain boundary character distribution of nanocrystalline tungsten Scripta Materialia. 69: 413-416. DOI: 10.1016/J.Scriptamat.2013.05.046 |
0.385 |
|
| 2013 |
Barmak K, Eggeling E, Kinderlehrer D, Sharp R, Ta'Asan S, Rollett AD, Coffey KR. Grain growth and the puzzle of its stagnation in thin films: The curious tale of a tail and an ear Progress in Materials Science. 58: 987-1055. DOI: 10.1016/J.Pmatsci.2013.03.004 |
0.441 |
|
| 2013 |
Donegan SP, Tucker JC, Rollett AD, Barmak K, Groeber M. Extreme value analysis of tail departure from log-normality in experimental and simulated grain size distributions Acta Materialia. 61: 5595-5604. DOI: 10.1016/J.Actamat.2013.06.001 |
0.376 |
|
| 2012 |
Ganesh KJ, Darbal AD, Rajasekhara S, Rohrer GS, Barmak K, Ferreira PJ. Effect of downscaling nano-copper interconnects on the microstructure revealed by high resolution TEM-orientation-mapping. Nanotechnology. 23: 135702. PMID 22418052 DOI: 10.1088/0957-4484/23/13/135702 |
0.363 |
|
| 2012 |
Barmak K, Eggeling E, Sharp R, Roberts S, Shyu T, Sun T, Yao B, Ta'asan S, Kinderlehrer D, Rollett A, Coffey K. Grain growth and the puzzle of its stagnation in thin films: A detailed comparison of experiments and simulations Materials Science Forum. 715: 473-479. DOI: 10.4028/Www.Scientific.Net/Msf.715-716.473 |
0.434 |
|
| 2012 |
Barmak K, Eggeling E, Emelianenko M, Epshteyn Y, Kinderlehrer D, Sharp R, Ta'Asan S. A first approach toward a proper generalized decomposition based time parallelization Materials Science Forum. 715: 279-285. DOI: 10.4028/Www.Scientific.Net/Msf.715-716.279 |
0.312 |
|
| 2012 |
Choi D, Kim CS, Naveh D, Chung S, Warren AP, Nuhfer NT, Toney MF, Coffey KR, Barmak K. Electron mean free path of tungsten and the electrical resistivity of epitaxial (110) tungsten films Physical Review B. 86: 45432. DOI: 10.1103/Physrevb.86.045432 |
0.373 |
|
| 2012 |
Rickman JM, Barmak K. Resistivity in rough metallic thin films: A Monte Carlo study Journal of Applied Physics. 112: 013704. DOI: 10.1063/1.4732082 |
0.364 |
|
| 2012 |
Wang B, Barmak K. The impact of deposition temperature on L10 formation in FePt films Journal of Applied Physics. 111. DOI: 10.1063/1.3679388 |
0.42 |
|
| 2012 |
Granz SD, Barmak K, Kryder MH. Granular L1 0 FePt-B and FePt-B-Ag (001) thin films for heat assisted magnetic recording Journal of Applied Physics. 111. DOI: 10.1063/1.3677766 |
0.415 |
|
| 2012 |
Warren AP, Sun T, Yao B, Barmak K, Toney MF, Coffey KR. Evolution of nanoscale roughness in Cu/SiO2 and Cu/Ta interfaces Applied Physics Letters. 100: 024106. DOI: 10.1063/1.3675611 |
0.364 |
|
| 2012 |
Liu X, Nuhfer T, Ledonne J, Lee S, Rollett A, Barmak K, Carpenter J, Darbal A. Precession-Assisted Nanoscale Phase and Crystal Orientation Mapping of Cu-Nb Composites in the Transmission Electron Microscope Microscopy and Microanalysis. 18: 1426-1427. DOI: 10.1017/S1431927612008987 |
0.341 |
|
| 2012 |
Carpenter JS, Liu X, Darbal A, Nuhfer NT, McCabe RJ, Vogel SC, Ledonne JE, Rollett AD, Barmak K, Beyerlein IJ, Mara NA. A comparison of texture results obtained using precession electron diffraction and neutron diffraction methods at diminishing length scales in ordered bimetallic nanolamellar composites Scripta Materialia. 67: 336-339. DOI: 10.1016/J.Scriptamat.2012.05.018 |
0.377 |
|
| 2011 |
Barmak K, Eggeling E, Emelianenko M, Epshteyn Y, Kinderlehrer D, Sharp R, Ta'Asan S. An entropy based theory of the grain boundary character distribution Discrete and Continuous Dynamical Systems. 30: 427-454. DOI: 10.3934/Dcds.2011.30.427 |
0.323 |
|
| 2011 |
Choi D, Wang B, Chung S, Liu X, Darbal A, Wise A, Nuhfer NT, Barmak K, Warren AP, Coffey KR, Toney MF. Phase, grain structure, stress, and resistivity of sputter-deposited tungsten films Journal of Vacuum Science & Technology a: Vacuum, Surfaces, and Films. 29: 051512. DOI: 10.1116/1.3622619 |
0.445 |
|
| 2011 |
Dillon SJ, Helmick L, Miller HM, Wilson L, Gemman R, Petrova RV, Barmak K, Rohrer GS, Salvador PA. The Orientation Distributions of Lines, Surfaces, and Interfaces around Three-Phase Boundaries in Solid Oxide Fuel Cell Cathodes Journal of the American Ceramic Society. 94: 4045-4051. DOI: 10.1111/J.1551-2916.2011.04673.X |
0.318 |
|
| 2011 |
Barmak K, Eggeling E, Emelianenko M, Epshteyn Y, Kinderlehrer D, Sharp R, Ta'Asan S. Critical events, entropy, and the grain boundary character distribution Physical Review B - Condensed Matter and Materials Physics. 83. DOI: 10.1103/Physrevb.83.134117 |
0.31 |
|
| 2011 |
Wang B, Berry DC, Chiari Y, Barmak K. Experimental measurements of the heats of formation of Fe3Pt, FePt, and FePt3 using differential scanning calorimetry Journal of Applied Physics. 110: 13903. DOI: 10.1063/1.3601743 |
0.35 |
|
| 2011 |
Wang B, Barmak K. Re-evaluation of the impact of ternary additions of Ni and Cu on the A1 to L10 transformation in FePt films Journal of Applied Physics. 109: 123916. DOI: 10.1063/1.3592980 |
0.307 |
|
| 2011 |
Wang B, Barmak K, Klemmer TJ. The A1 to L10 transformation in FePt films with ternary alloying additions of Mg, V, Mn, and B Journal of Applied Physics. 109. DOI: 10.1063/1.3559482 |
0.426 |
|
| 2011 |
Darbal A, Ganesh K, Barmak K, Rohrer G, Ferreira P, Sun T, Coffey K. Grain Boundary Characterization of Nanocrystalline Cu from the Stereological Analysis of Transmission Electron Microscope Orientation Maps Microscopy and Microanalysis. 17: 1426-1427. DOI: 10.1017/S1431927611008002 |
0.351 |
|
| 2011 |
Ganesh K, Darbal A, Rajasekhara S, Rohrer G, Barmak K, Ferreira P. Characterizing Texture and Grain Boundaries in Nanoscale Cu Interconnects by Precession Electron Diffraction Microscopy and Microanalysis. 17: 1346-1347. DOI: 10.1017/S1431927611007604 |
0.359 |
|
| 2011 |
Rauch E, Barmak K, Ganesh J, Ferreira P, Darbal A, Choi D, Sun T, Yao B, Coffey K, Nicolopoulos S. Automated Crystal Orientation and Phase Mapping for Thin Film Applications by Transmission Electron Microscopy Microscopy and Microanalysis. 17: 1086-1087. DOI: 10.1017/S1431927611006301 |
0.39 |
|
| 2010 |
Yao B, Sun T, Warren A, Heinrich H, Barmak K, Coffey KR. High contrast hollow-cone dark field transmission electron microscopy for nanocrystalline grain size quantification. Micron (Oxford, England : 1993). 41: 177-82. PMID 20018512 DOI: 10.1016/J.Micron.2009.11.008 |
0.339 |
|
| 2010 |
Wang B, Barmak K, Klemmer TJ. A1 to L1 $_{0}$ Transformation in FePt Films With Ternary Alloying Additions of Ag and Au Ieee Transactions On Magnetics. 46: 1773-1776. DOI: 10.1109/Tmag.2010.2042039 |
0.41 |
|
| 2010 |
Sun T, Yao B, Warren AP, Barmak K, Toney MF, Peale RE, Coffey KR. Surface and grain-boundary scattering in nanometric Cu films Physical Review B - Condensed Matter and Materials Physics. 81. DOI: 10.1103/Physrevb.81.155454 |
0.4 |
|
| 2010 |
Darbal A, Barmak K, Nuhfer T, Sun T, Coffey K. Grain Size Determination and Grain Boundary Characterization of Nanocrystalline Thin Films from Conical Dark Field Imaging Microscopy and Microanalysis. 16: 1276-1277. DOI: 10.1017/S1431927610056849 |
0.409 |
|
| 2009 |
Sun T, Yao B, Warren AP, Barmak K, Toney MF, Peale RE, Coffey KR. Dominant role of grain boundary scattering in the resistivity of nanometric Cu films Physical Review B - Condensed Matter and Materials Physics. 79. DOI: 10.1103/Physrevb.79.041402 |
0.461 |
|
| 2009 |
Darbal A, Barmak K, Nuhfer N, Dingley D, Meaden G, Michael J, Sun T, Yao B, Coffey K. Orientation Imaging of Nanocrystalline Platinum Films in the TEM Microscopy and Microanalysis. 15: 1232-1233. DOI: 10.1017/S1431927609093131 |
0.383 |
|
| 2009 |
Dybkov VI, Khoruzha VG, Sidorko VR, Meleshevich KA, Samelyuk AV, Berry DC, Barmak K. Interfacial interaction of solid cobalt with liquid Pb-free Sn―Bi―In―Zn―Sb soldering alloys Journal of Materials Science. 44: 5960-5979. DOI: 10.1007/S10853-009-3717-Z |
0.332 |
|
| 2008 |
Yao B, Sun T, Kumar V, Barmak K, Coffey KR. Grain growth and void formation in dielectric-encapsulated Cu thin films Journal of Materials Research. 23: 2033-2039. DOI: 10.1557/Jmr.2008.0254 |
0.471 |
|
| 2008 |
Barmak K, Emelianenko M, Golovaty D, Kinderlehrer D, Ta'Asan S. Towards a statistical theory of texture evolution in polycrystals Siam Journal On Scientific Computing. 30: 3150-3169. DOI: 10.1137/070692352 |
0.334 |
|
| 2008 |
Warren AP, Todi RM, Yao B, Barmak K, Sundaram KB, Coffey KR. On the phase identification of dc magnetron sputtered Pt–Ru alloy thin films Journal of Vacuum Science and Technology. 26: 1208-1212. DOI: 10.1116/1.2966422 |
0.467 |
|
| 2008 |
Sun T, Yao B, Warren AP, Kumar V, Roberts S, Barmak K, Coffey KR. Classical size effect in oxide-encapsulated Cu thin films: Impact of grain boundaries versus surfaces on resistivity Journal of Vacuum Science and Technology. 26: 605-609. DOI: 10.1116/1.2938395 |
0.432 |
|
| 2008 |
Dybkov VI, Khoruzha VG, Sidorko VR, Meleshevich KA, Samelyuk AV, Berry DC, Barmak K. Interfacial interaction of solid nickel with liquid Pb-free Sn–Bi–In–Zn–Sb soldering alloys Journal of Alloys and Compounds. 460: 337-352. DOI: 10.1016/J.Jallcom.2007.06.056 |
0.321 |
|
| 2007 |
Barmak K, Berry DC, Khoruzha VG, Meleshevich KA, Dybkov VI. Dissolution Kinetics of Nickel in Lead-Free Sn-Bi-In-Zn-Sb Soldering Alloys Mrs Proceedings. 993. DOI: 10.1557/Proc-0993-E03-01 |
0.328 |
|
| 2007 |
Berry DC, Barmak K. Time-temperature-transformation diagrams for the A1 to L10 phase transformation in FePt and FeCuPt thin films Journal of Applied Physics. 101: 14905. DOI: 10.1063/1.2403835 |
0.437 |
|
| 2006 |
Barmak K, Cabral C, Rodbell KP, Harper JME. On the use of alloying elements for Cu interconnect applications Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 24: 2485. DOI: 10.1116/1.2357744 |
0.422 |
|
| 2006 |
Todi RM, Warren AP, Sundaram KB, Barmak K, Coffey KR. Characterization of Pt-Ru binary alloy thin films for work function tuning Ieee Electron Device Letters. 27: 542-545. DOI: 10.1109/Led.2006.876326 |
0.374 |
|
| 2006 |
Barmak K, Kim J, Kim CS, Archibald WE, Rohrer GS, Rollett AD, Kinderlehrer D, Ta'Asan S, Zhang H, Srolovitz DJ. Grain boundary energy and grain growth in Al films: Comparison of experiments and simulations Scripta Materialia. 54: 1059-1063. DOI: 10.1016/J.Scriptamat.2005.11.060 |
0.423 |
|
| 2005 |
Barmak K, Archibald WE, Kim J, Kim CS, Rollett AD, Rohrer GS, Ta'asan S, Kinderlehrer D. Grain boundary energy and grain growth in highly-textured al films and foils: Experiment and simulation Materials Science Forum. 495: 1255-1260. DOI: 10.4028/Www.Scientific.Net/Msf.495-497.1255 |
0.442 |
|
| 2005 |
Barmak K, Cabral C, Kellock AJ, Harper JME. Resistivity–temperature behavior of dilute Cu(Ir) and Cu(W) alloy films Journal of Materials Research. 20: 3391-3396. DOI: 10.1557/Jmr.2005.0416 |
0.368 |
|
| 2005 |
Barmak K, Kim J, Lewis LH, Coffey KR, Toney MF, Kellock AJ, Thiele JU. On the relationship of magnetocrystalline anisotropy and stoichiometry in epitaxial L1 0 CoPt (001) and FePt (001) thin films Journal of Applied Physics. 98. DOI: 10.1063/1.1991968 |
0.438 |
|
| 2005 |
Barmak K, Kim J, Berry DC, Hanani WN, Wierman K, Svedberg EB, Howard JK. Calorimetric studies of the A1 to L10 transformation in binary FePt thin films with compositions in the range of 47.5–54.4at.% Fe Journal of Applied Physics. 97: 24902. DOI: 10.1063/1.1832743 |
0.375 |
|
| 2005 |
Berry DC, Kim J, Barmak K, Wierman K, Svedberg EB, Howard JK. Differential scanning calorimetry studies of the effect of Cu on the A1 to L10 transformation in FePt thin films Scripta Materialia. 53: 423-428. DOI: 10.1016/J.Scriptamat.2005.04.026 |
0.383 |
|
| 2005 |
Dybkov VI, Lengauer W, Barmak K. Formation of boride layers at the Fe–10% Cr alloy–boron interface Journal of Alloys and Compounds. 398: 113-122. DOI: 10.1016/J.Jallcom.2005.02.033 |
0.315 |
|
| 2005 |
Dybkov VI, Barmak K, Lengauer W, Gas P. Interfacial interaction of solid nickel with liquid bismuth and Bi–base alloys Journal of Alloys and Compounds. 389: 61-74. DOI: 10.1016/J.Jallcom.2004.02.063 |
0.36 |
|
| 2004 |
Barmak K, Archibald WE, Rollett AD, Ta'asan S, Kinderlehrer D. Grain boundary properties and grain growth: Al foils, al films Materials Research Society Symposium - Proceedings. 819: 225-236. DOI: 10.1557/Proc-819-N6.6 |
0.415 |
|
| 2004 |
Singanamalla R, Greve DW, Barmak K. Growth of epitaxial CoSi 2 from Cobalt Carbonyl on Si(100) Substrate Mrs Proceedings. 810. DOI: 10.1557/Proc-810-C4.9 |
0.358 |
|
| 2004 |
Lewis LH, Kim J, Barmak K, Crew DC. Interphase exchange effects in CoPt/Co bilayer thin films Journal of Physics D: Applied Physics. 37: 2638-2642. DOI: 10.1088/0022-3727/37/19/004 |
0.365 |
|
| 2004 |
Barmak K, Kim J, Berry DC, Wierman KW, Svedberg EB, Howard JK. Calorimetric studies of the A1 to L1 0 transformation in FePt and related ternary alloy thin films Journal of Applied Physics. 95: 7486-7488. DOI: 10.1063/1.1682786 |
0.408 |
|
| 2004 |
Barmak K, Kim J, Lewis LH, Coffey KR, Toney MF, Kellock AJ, Thiele JU. Stoichiometry-anisotropy connections in epitaxial L1 0 FePt(001) films Journal of Applied Physics. 95: 7501-7503. DOI: 10.1063/1.1667856 |
0.447 |
|
| 2004 |
Barmak K, Dybkov VI. Interaction of iron-chromium alloys containing 10 and 25 mass% chromium with liquid aluminium Part II Formation of intermetallic compounds Journal of Materials Science. 39: 4219-4230. DOI: 10.1023/B:Jmsc.0000033402.37206.27 |
0.336 |
|
| 2004 |
Crew DC, Stamps RL, Liu HY, Wang ZK, Kuok MH, Ng SC, Barmak K, Kim J, Lewis LH. Spin wave excitations in exchange spring Co/CoPt thin film bilayers Journal of Magnetism and Magnetic Materials. 272: 273-274. DOI: 10.1016/J.Jmmm.2004.04.061 |
0.303 |
|
| 2003 |
Park C, Shi Y, Peng Y, Barmak K, Zhu JG, Laughlin DE, White RM. Interfacial Composition and Microstructure of Fe3O4 Magnetic Tunnel Junctions Ieee Transactions On Magnetics. 39: 2806-2808. DOI: 10.1109/Tmag.2003.815718 |
0.301 |
|
| 2003 |
Barmak K, Gungor A, Cabral C, Harper JME. Annealing behavior of Cu and dilute Cu-alloy films: Precipitation, grain growth, and resistivity Journal of Applied Physics. 94: 1605-1616. DOI: 10.1063/1.1589593 |
0.477 |
|
| 2003 |
Crew DC, Kim J, Barmak K, Lewis LH. Robust exchange coupling in bilayer exchange-spring thin films Journal of Applied Physics. 93: 7235-7237. DOI: 10.1063/1.1557313 |
0.346 |
|
| 2003 |
Barmak K, Gungor A, Rollett AD, Cabral C, Harper JME. Texture of Cu and dilute binary Cu-alloy films: Impact of annealing and solute content Materials Science in Semiconductor Processing. 6: 175-184. DOI: 10.1016/S1369-8001(03)00062-3 |
0.48 |
|
| 2003 |
Kim J, Barmak K, Lewis LH. L1o-CoPt/Co bilayer ferromagnetic films: Interdiffusion, structure and microstructure Acta Materialia. 51: 313-323. DOI: 10.1016/S1359-6454(02)00302-6 |
0.379 |
|
| 2003 |
Lewis LH, Kim J, Barmak K. The CoPt system: A natural exchange spring Physica B: Condensed Matter. 327: 190-193. DOI: 10.1016/S0921-4526(02)01725-8 |
0.362 |
|
| 2003 |
Lee S, Rickman J, Barmak K. Phase transformation kinetics and self-patterning in misfitting thin films Acta Materialia. 51: 6415-6427. DOI: 10.1016/J.Actamat.2003.08.021 |
0.424 |
|
| 2002 |
Gungor A, Barmak K, Rollett AD, Cabral C, Harper JME. Textures of Cu and Dilute Binary Cu(Ti) and Cu(In) Thin Films Materials Science Forum. 1567-1572. DOI: 10.4028/Www.Scientific.Net/Msf.408-412.1567 |
0.442 |
|
| 2002 |
Gungor A, Barmak K, Rollett AD, Cabral C, Harper JME. Cu and Dilute Binary Cu(Ti), Cu(Sn) and Cu(Al) Thin Films: Texture, Grain Growth and Resistivity Mrs Proceedings. 721. DOI: 10.1557/Proc-721-J3.2 |
0.351 |
|
| 2002 |
Barmak K, Gungor A, Rollett AD, Cabral C, Harper JME. Texture and Resistivity of Cu and Dilute Cu Alloy Films Mrs Proceedings. 721. DOI: 10.1557/Proc-721-J3.1 |
0.38 |
|
| 2002 |
Gungor A, Barmak K, Rollett AD, Cabral C, Harper JME. Texture and resistivity of dilute binary Cu(Al), Cu(In), Cu(Ti), Cu(Nb), Cu(Ir), and Cu(W) alloy thin films Journal of Vacuum Science & Technology B. 20: 2314-2319. DOI: 10.1116/1.1520549 |
0.39 |
|
| 2002 |
Barmak K, Kim J, Ristau RA, Lewis LH. Ferromagnetic exchange-spring nanocomposites of A1 + L10 CoPt Ieee Transactions On Magnetics. 38: 2799-2801. DOI: 10.1109/Tmag.2002.803107 |
0.432 |
|
| 2002 |
Barmak K, Kim J, Shell S, Svedberg EB, Howard JK. Calorimetric studies of the A1 to L10 transformation in FePt and CoPt thin films Applied Physics Letters. 80: 4268-4270. DOI: 10.1063/1.1483924 |
0.371 |
|
| 2002 |
Lucadamo G, Barmak K, Lavoie C, Cabral C, Michaelsen C. Metastable and equilibrium phase formation in sputter-deposited Ti/Al multilayer thin films Journal of Applied Physics. 91: 9575-9583. DOI: 10.1063/1.1477257 |
0.427 |
|
| 2001 |
Lucadamo G, Barmak K, Rodbell KP. Texture in Ti/Al and Nb/Al multilayer thin films: Role of Cu Journal of Materials Research. 16: 1449-1459. DOI: 10.1557/Jmr.2001.0202 |
0.387 |
|
| 2001 |
Crew DC, Lewis LH, Kim J, Barmak K. Magnetic signature of compositional gradient in exchange-spring bilayer films of CoPt/Co Journal of Applied Physics. 89: 7528-7530. DOI: 10.1063/1.1354594 |
0.41 |
|
| 2001 |
Lucadamo G, Barmak K, Carpenter DT, Rickman JM. Microstructure evolution during solid state reactions of Nb/Al multilayers Acta Materialia. 49: 2813-2826. DOI: 10.1016/S1359-6454(01)00176-8 |
0.453 |
|
| 2001 |
Crew DC, Kim J, Lewis LH, Barmak K. Interdiffusion in bilayer CoPt/Co films: Potential for tailoring the magnetic exchange spring Journal of Magnetism and Magnetic Materials. 233: 257-273. DOI: 10.1016/S0304-8853(01)00277-3 |
0.343 |
|
| 2001 |
Lucadamo G, Barmak K. Stress evolution in polycrystalline thin film reactions Thin Solid Films. 389: 8-11. DOI: 10.1016/S0040-6090(01)00861-6 |
0.395 |
|
| 2000 |
Kim J, Barmak K, Graef MD, Lewis LH, Crew DC. Effect of annealing on magnetic exchange coupling in CoPt/Co bilayer thin films Journal of Applied Physics. 87: 6140-6142. DOI: 10.1063/1.372635 |
0.409 |
|
| 2000 |
Barmak K, Lucadamo GA, Cabral C, Lavoie C, Harper JME. Dissociation of dilute immiscible copper alloy thin films Journal of Applied Physics. 87: 2204-2214. DOI: 10.1063/1.372162 |
0.421 |
|
| 2000 |
Lucadamo G, Barmak K, Hyun S. Nb/Al and Nb/Al(Cu) multilayer thin films: the enthalpy of formation of NbAl3 Thermochimica Acta. 348: 53-59. DOI: 10.1016/S0040-6031(99)00512-2 |
0.368 |
|
| 1999 |
Carpenter DT, Watanabe M, Barmak K, Williams DB. Low-magnification Quantitative X-ray Mapping of Grain-boundary Segregation in Aluminum-4 wt.% Copper by Analytical Electron Microscopy. Microscopy and Microanalysis. 5: 254-266. PMID 10421810 DOI: 10.1017/S1431927699990293 |
0.352 |
|
| 1999 |
Kim J, Barmak K. Magnetic Exchange-Coupling in CoPt/Co Bilayer thin Films Mrs Proceedings. 577: 327. DOI: 10.1557/Proc-577-353 |
0.448 |
|
| 1999 |
Ristau RA, Barmak K, Lewis LH, Coffey KR, Howard JK. A Study on High Coercivity and L1 0 Ordered Phase in CoPt and FePt Thin Films Mrs Proceedings. 577: 347. DOI: 10.1557/Proc-577-347 |
0.405 |
|
| 1999 |
Barmak K, Lucadamo GA, Cabral C, Lavoie C, Harper JME. Classification of the Modes of Dissociation in Immiscible Cu-Alloy Thin Films Mrs Proceedings. 564: 341. DOI: 10.1557/Proc-564-341 |
0.449 |
|
| 1999 |
Lucadamo G, Barmak K, Carpenter DT, Lavoie C, Cabral C, Michaelsen C, Rickman JM. Microstructure Evolution During Solid-State Reactions in Polycrystalline Nb/Al and Ti/Ai Multilayer Thin-Films Mrs Proceedings. 562. DOI: 10.1557/Proc-562-159 |
0.415 |
|
| 1999 |
Ristau RA, Barmak K, Coffey KR, Howard JK. Grain growth in ultrathin films of CoPt and FePt Journal of Materials Research. 14: 3263-3270. DOI: 10.1557/Jmr.1999.0441 |
0.436 |
|
| 1999 |
Barmak K, Rickman JM, Michaelsen C, Ristau RA, Kim J, Lucadamo GA, Carpenter DT, Tong WS. Ex situ characterization of phase transformations and associated microstructures in polycrystalline thin films Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 17: 1950-1957. DOI: 10.1116/1.581709 |
0.448 |
|
| 1999 |
Lucadamo G, Watanabe M, Barmak K, Williams DB, Michaelsen C, Alani R. High-resolution quantitative X-ray microanalysis of Nb/AI multilayer thin films using the ζ-factor approach Philosophical Magazine. 79: 1423-1442. DOI: 10.1080/01418619908210370 |
0.365 |
|
| 1999 |
Ristau RA, Barmak K, Lewis LH, Coffey KR, Howard JK. On the relationship of high coercivity and L10 ordered phase in CoPt and FePt thin films Journal of Applied Physics. 86: 4527-4533. DOI: 10.1063/1.371397 |
0.424 |
|
| 1999 |
Banovic SW, Barmak K, Marder AR. Characterization of single and discretely-stepped electro-composite coatings of nickel-alumina Journal of Materials Science. 34: 3203-3211. DOI: 10.1023/A:1004633923681 |
0.325 |
|
| 1999 |
Carpenter DT, Codner JR, Barmak K, Rickman JM. Issues associated with the analysis and acquisition of thin-film grain size data Materials Letters. 41: 296-302. DOI: 10.1016/S0167-577X(99)00146-9 |
0.434 |
|
| 1999 |
Lucadamo G, Barmak K, Hyun S, Cabral C, Lavoie C. Evidence of a two-stage reaction mechanism in sputter deposited Nb/Al multilayer thin-films studied by in situ synchrotron X-ray diffraction Materials Letters. 39: 268-273. DOI: 10.1016/S0167-577X(99)00017-8 |
0.439 |
|
| 1998 |
Barmak K, Michaelsen C, Vivekanand S. Formation of the first phase in sputter-deposited Nb/Al multilayer thin films Philosophical Magazine. 77: 167-185. DOI: 10.1080/01418619808214236 |
0.469 |
|
| 1998 |
Carpenter DT, Rickman JM, Barmak K. A methodology for automated quantitative microstructural analysis of transmission electron micrographs Journal of Applied Physics. 84: 5843-5854. DOI: 10.1063/1.368898 |
0.412 |
|
| 1998 |
Banovic SW, Barmak K, Marder AR. Microstructural characterization and hardness of electrodeposited nickel coatings from a sulphamate bath Journal of Materials Science. 33: 639-645. DOI: 10.1023/A:1004321224586 |
0.306 |
|
| 1998 |
Ristau RA, Hofer F, Barmak K, Coffey KR, Howard JK. An EFTEM and conical dark field investigation of co-sputtered CoPt+yttria stabilized zirconia thin films Micron. 29: 33-41. DOI: 10.1016/S0968-4328(97)00065-6 |
0.412 |
|
| 1997 |
Ristau RA, Barmak K, Coffey KR, Howard JK. Ll o Phase Formation in CoPt Thin Films Mrs Proceedings. 475: 119. DOI: 10.1557/Proc-475-119 |
0.379 |
|
| 1997 |
Tong WS, Rickman JM, Barmak K. Impact of boundary nucleation on product grain size distribution Journal of Materials Research. 12: 1501-1507. DOI: 10.1557/Jmr.1997.0206 |
0.33 |
|
| 1997 |
Barmak K, Michaelsen C, Lucadamo G. Reactive Phase Formation In Sputter-Deposited Ni/Al Multilayer Thin Films Journal of Materials Research. 12: 133-146. DOI: 10.1557/Jmr.1997.0021 |
0.447 |
|
| 1997 |
Michaelsen C, Barmak K, Weihs TP. Investigating the thermodynamics and kinetics of thin film reactions by differential scanning calorimetry Journal of Physics D: Applied Physics. 30: 3167-3186. DOI: 10.1088/0022-3727/30/23/001 |
0.474 |
|
| 1997 |
Barmak K, Banovic SW, Petronis CM, Susan DF, Marder AR. Structure of electrodeposited graded composite coatings of Ni–Al–Al2O3 Journal of Microscopy. 185: 265-274. DOI: 10.1046/J.1365-2818.1997.D01-606.X |
0.334 |
|
| 1997 |
Lucadamo G, Watanabe M, Barmak K, Williams DB. High Resolution X-Ray Microanalysis of Nb/Al Multilayer Thin Films Microscopy and Microanalysis. 3: 967-968. DOI: 10.1017/S1431927600011727 |
0.368 |
|
| 1997 |
Carpenter DT, Watanabe M, Barmak K, Williams DB, Smith DA. Quantification of Cu Segregation to Grain Boundaries in an Al - 4 Wt.% Cu Thin Film Using High Resolution X-Ray Mapping Microscopy and Microanalysis. 3: 537-538. DOI: 10.1017/S1431927600009570 |
0.394 |
|
| 1997 |
Rickman J, Tong W, Barmak K. Impact of heterogeneous boundary nucleation on transformation kinetics and microstructure Acta Materialia. 45: 1153-1166. DOI: 10.1016/S1359-6454(96)00245-5 |
0.36 |
|
| 1997 |
Michaelsen C, Barmak K. Calorimetric determination of NiAl3-growth kinetics in sputter-deposited Ni/Al diffusion couples Journal of Alloys and Compounds. 257: 211-214. DOI: 10.1016/S0925-8388(97)00014-5 |
0.437 |
|
| 1997 |
Barmak K, Rickman JM, Michaelsen C. Evolution of grain structure in thin film reactions Journal of Electronic Materials. 26: 1009-1020. DOI: 10.1007/S11664-997-0238-X |
0.444 |
|
| 1997 |
Barmak K, Michaelsen C. Study of solid state reactions in Nb/Al multilayer thin films Journal of Thermal Analysis and Calorimetry. 49: 1179-1185. DOI: 10.1007/Bf01983673 |
0.453 |
|
| 1996 |
Michaelsen C, Lucadamo G, Barmak K. The Early Stages Of Solid-State Reactions In Ni/Al Multilayer Films Journal of Applied Physics. 80: 6689-6698. DOI: 10.1063/1.363794 |
0.488 |
|
| 1996 |
Barmak K, Ristau RA, Coffey KR, Parker MA, Howard JK. Grain growth and ordering kinetics in CoPt thin films Journal of Applied Physics. 79: 5330-5332. DOI: 10.1063/1.361368 |
0.436 |
|
| 1995 |
Barmak K, Michaelsent C, Rickman J, Dahmstt M. Reactive Phase Formation in Thin Films: Evolution of Grain Structure Mrs Proceedings. 403: 51. DOI: 10.1557/Proc-403-51 |
0.463 |
|
| 1995 |
Ristau RA, Barmak K, Hess DW, Coffey KR, Parker MA, Howard JK. Ordering and Grain Growth Kinetics in CoPt Thin Films Mrs Proceedings. 398. DOI: 10.1557/Proc-398-557 |
0.441 |
|
| 1995 |
Barmak K, Vivekanand S, Michaelsen C. Nucleation and growth of the first phase in sputter-deposited Nb/Al multilayer thin films Mrs Proceedings. 398: 257. DOI: 10.1557/Proc-398-257 |
0.464 |
|
| 1995 |
Michaelsen C, WÖHlert S, Bormann R, Barmak K. The Early Stages of Solid-State Reactions in Ti/Al Multilayer Films Mrs Proceedings. 398. DOI: 10.1557/Proc-398-245 |
0.381 |
|
| 1995 |
Lucadamo G, Barmak K, Michaelsen C. Amorphous and crystalline phase formation in Ni/Al multilayer thin films Mrs Proceedings. 398. DOI: 10.1557/Proc-398-227 |
0.475 |
|
| 1995 |
Barmak K, Michaelsen C, Bormann R, Lucadamo G. Reactive Phase Formation in Sputter-Deposited Ni/Al Thin Films Mrs Proceedings. 382. DOI: 10.1557/Proc-382-33 |
0.446 |
|
| 1994 |
Coffey KR, Barmak K. A Unified Approach to Grain Boundary Diffusion and Nucleation in Thin Film Reactions Mrs Proceedings. 343. DOI: 10.1557/Proc-343-193 |
0.405 |
|
| 1994 |
Pellerin JG, Anderson SGH, Ho PS, Wooten C, Coffey KR, Howard JK, Barmak K. Grain boundary diffusion and its effects on the magnetic properties of Co/Cu and Co/Cr thin film bilayers Journal of Applied Physics. 75: 5052-5060. DOI: 10.1063/1.355747 |
0.454 |
|
| 1994 |
Coffey KR, Barmak K. A new model for grain boundary diffusion and nucleation in thin film reactions Acta Metallurgica Et Materialia. 42: 2905-2911. DOI: 10.1016/0956-7151(94)90232-1 |
0.423 |
|
| 1993 |
Barmak K, Coffey KK. Grain Boundary Diffusion Controlled Precipitation as a Model For thin Film Reactions Mrs Proceedings. 311. DOI: 10.1557/Proc-311-51 |
0.409 |
|
| 1993 |
Ganin E, Wind S, Ronsheim P, Yapsir A, Barmak K, Bucchignano J, Assenza R. TiSi2 Formation on Submicron Polysilicon Lines: Role of Line Width and Dopant Concentration Mrs Proceedings. 303. DOI: 10.1557/Proc-303-109 |
0.323 |
|
| 1993 |
Cabral C, Barmak K, Gupta J, Clevenger LA, Arcot B, Smith DA, Harper JME. Role of stress relief in the hexagonal‐close‐packed to face‐centered‐cubic phase transformation in cobalt thin films Journal of Vacuum Science & Technology a: Vacuum, Surfaces, and Films. 11: 1435-1440. DOI: 10.1116/1.578569 |
0.455 |
|
| 1992 |
Clevenger LA, Mutscheller A, Harper JME, Cabral C, Barmak K. The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films Journal of Applied Physics. 72: 4918-4924. DOI: 10.1063/1.352059 |
0.365 |
|
| 1992 |
Coffey KR, Barmak K, Rudman DA, Foner S. Thin film reaction kinetics of niobium/aluminum multilayers Journal of Applied Physics. 72: 1341-1349. DOI: 10.1063/1.351744 |
0.411 |
|
| 1992 |
Hong QZ, Barmak K, Clevenger LA. Crystallization of amorphous Co‐Si alloys Journal of Applied Physics. 72: 3423-3430. DOI: 10.1063/1.351415 |
0.312 |
|
| 1990 |
Barmak K, Rudman DA, Foner S. The preparation of cross-sectional transmission electron microscopy specimens of Nb/Al multilayer thin films on sapphire substrates. Journal of Electron Microscopy Technique. 16: 249-253. PMID 2243281 DOI: 10.1002/Jemt.1060160306 |
0.402 |
|
| 1990 |
Barmak K, Coffey KR, Rudman DA, Foner S. The effect of oxygen on phase formation in Al/Nb diffusion couples Journal of Applied Physics. 67: 3780-3784. DOI: 10.1063/1.345023 |
0.347 |
|
| 1990 |
Barmak K, Coffey KR, Rudman DA, Foner S. Phase formation sequence for the reaction of multilayer thin films of Nb/Al Journal of Applied Physics. 67: 7313-7322. DOI: 10.1063/1.344517 |
0.411 |
|
| 1989 |
Coffey KR, Barmak K, Rudman DA, Thieme CLH, Foner S. Reaction kinetics of phase formation in Nb-Al powder metallurgy processed wire Ieee Transactions On Magnetics. 25: 2093-2096. DOI: 10.1109/20.92720 |
0.345 |
|
| 1989 |
Coffey KR, Clevenger LA, Barmak K, Rudman DA, Thompson CV. Experimental evidence for nucleation during thin‐film reactions Applied Physics Letters. 55: 852-854. DOI: 10.1063/1.102447 |
0.37 |
|
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