Hai Ding, Ph.D. - Publications
Affiliations: | 2003 | Georgia Institute of Technology, Atlanta, GA |
Area:
Mechanical Engineering, Packaging EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2005 | Ding H, Ume IC, Zhang J, Baldwin DF. Integrated hardware and software for improved flatness measurement with ATC4.1 flip-chip assembly case study Ieee Transactions On Instrumentation and Measurement. 54: 1898-1904. DOI: 10.1109/Tim.2005.855088 | 0.376 | |||
2005 | Ding H, Ume IC, Powell RE, Hanna CR. Parametric study of warpage in printed wiring board assemblies Ieee Transactions On Components and Packaging Technologies. 28: 517-524. DOI: 10.1109/Tcapt.2005.848570 | 0.52 | |||
2004 | Ding H, Ume IC, Zhang C. Warpage Analysis of Underfilled Wafers Journal of Electronic Packaging. 126: 265-270. DOI: 10.1115/1.1707036 | 0.514 | |||
2002 | Ding H, Powell RE, Hanna CR, Ume IC. Warpage measurement comparison using shadow moiré and projection moiré methods Ieee Transactions On Components and Packaging Technologies. 25: 714-721. DOI: 10.1109/Tcapt.2002.808010 | 0.529 | |||
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