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Karan Vivek Dikshit - Publications

Affiliations: 
University of Colorado, Boulder, Boulder, CO, United States 
Area:
Supramolecular chemistry, rheology, mechanics of slide-ring gels
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7 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2023 Dikshit KV, Visal AM, Janssen F, Larsen A, Bruns CJ. Pressure-Sensitive Supramolecular Adhesives Based on Lipoic Acid and Biofriendly Dynamic Cyclodextrin and Polyrotaxane Cross-Linkers. Acs Applied Materials & Interfaces. PMID 36926820 DOI: 10.1021/acsami.3c00927  0.489
2022 Atreya M, Desousa S, Kauzya JB, Williams E, Hayes A, Dikshit K, Nielson J, Palmgren A, Khorchidian S, Liu S, Gopalakrishnan A, Bihar E, Bruns CJ, Bardgett R, Quinton JN, et al. A Transient Printed Soil Decomposition Sensor Based on a Biopolymer Composite Conductor. Advanced Science (Weinheim, Baden-Wurttemberg, Germany). e2205785. PMID 36507571 DOI: 10.1002/advs.202205785  0.433
2022 Dikshit K, Bruns CJ. Chemorheological Monitoring of Cross-Linking in Slide-ring Gels Derived From -cyclodextrin Polyrotaxanes. Frontiers in Chemistry. 10: 923775. PMID 35928212 DOI: 10.3389/fchem.2022.923775  0.482
2021 Dikshit K, Bruns CJ. Post-synthesis modification of slide-ring gels for thermal and mechanical reconfiguration. Soft Matter. PMID 33949424 DOI: 10.1039/d0sm02260h  0.477
2020 Parameswar AV, Dikshit KV, Movafaghi S, Bruns CJ, Goodwin AP. Mechanochemistry Activated Covalent Conjugation Reactions in Soft Hydrogels Induced by Interfacial Failure. Acs Applied Materials & Interfaces. PMID 33370089 DOI: 10.1021/acsami.0c18432  0.463
2020 Butterfield JL, Keyser SP, Dikshit KV, Kwon H, Koster MI, Bruns CJ. Solar Freckles: Long-Term Photochromic Tattoos for Intradermal Ultraviolet Radiometry. Acs Nano. PMID 32961057 DOI: 10.1021/acsnano.0c05723  0.401
2020 Atreya M, Dikshit KV, Marinick G, Nielson J, Bruns C, Whiting GL. A poly(lactic acid)-based ink for biodegradable printed electronics with conductivity enhanced through solvent aging. Acs Applied Materials & Interfaces. PMID 32326695 DOI: 10.1021/Acsami.0C05196  0.484
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