Ming-Shu Kuo, Ph.D. - Publications
Affiliations: | 2010 | Material Science and Engineering | University of Maryland, College Park, College Park, MD |
Year | Citation | Score | |||
---|---|---|---|---|---|
2010 | Kuo MS, Oehrlein GS. Surface and near-surface modifications of ultralow dielectric constant materials exposed to plasmas under sidewall-like conditions Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics. 28: 1104-1110. DOI: 10.1116/1.3499271 | 0.605 | |||
2010 | Kuo MS, Pal AR, Oehrlein GS, Hua X. Mechanistic study of ultralow k-compatible carbon dioxide in situ photoresist ashing processes. II. Interaction with preceding fluorocarbon plasma ultralow k etching processes Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics. 28: 961-967. DOI: 10.1116/1.3482353 | 0.65 | |||
2010 | Kuo MS, Pal AR, Oehrlein GS, Lazzeri P, Anderle M. Mechanistic study of ultralow k-compatible carbon dioxide in situ photoresist ashing processes. I. Process performance and influence on ULK material modification Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics. 28: 952-960. DOI: 10.1116/1.3482343 | 0.611 | |||
2010 | Kuo MS, Hua X, Oehrlein GS, Ali A, Jiang P, Lazzeri P, Anderle M. Influence of C4 F8 /Ar -based etching and H 2 -based remote plasma ashing processes on ultralow k materials modifications Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics. 28: 284-294. DOI: 10.1116/1.3308623 | 0.649 | |||
2006 | Hua X, Kuo MS, Oehrlein GS, Lazzeri P, Iacob E, Anderle M, Inoki CK, Kuan TS, Jiang P, Wu WL. Damage of ultralow k materials during photoresist mask stripping process Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 24: 1238-1247. DOI: 10.1116/1.2194947 | 0.641 | |||
Show low-probability matches. |