☰

Taekyeong Lee, Ph.D. - Publications

Affiliations: 
2001 University of California, Los Angeles, Los Angeles, CA 
Area:
3D IC packaging and joule heating, metal-silicon interfaces, electromigration, pb-free solder joints
Tree Info Similar researchers PubMed Report error

1 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2004 Lee T-T, Lee T, Tu K. A study of electromigration in 3-D flip Chip Solder joint using numerical Simulation of heat flux and current density Ieee Transactions On Components and Packaging Technologies. 27: 472-479. DOI: 10.1109/Tcapt.2004.831774  0.348
Show low-probability matches.