Fei Ren, Ph.D. - Publications
Affiliations: | 2006 | University of California, Los Angeles, Los Angeles, CA |
Area:
3D IC packaging and joule heating, metal-silicon interfaces, electromigration, pb-free solder jointsYear | Citation | Score | |||
---|---|---|---|---|---|
2006 | Nah JW, Ren F, PaiK KW, Tu KN. Effect of electromigration on mechanical shear behavior of flip chip solder joints Journal of Materials Research. 21: 698-702. DOI: 10.1557/Jmr.2006.0086 | 0.488 | |||
2006 | Ren F, Nah J, Tu KN, Xiong B, Xu L, Pang JHL. Electromigration induced ductile-to-brittle transition in lead-free solder joints Applied Physics Letters. 89: 141914. DOI: 10.1063/1.2358113 | 0.306 | |||
2006 | Nah JW, Ren F, Tu K, Venk S, Camara G. Electromigration in Pb-free flip chip solder joints on flexible substrates Journal of Applied Physics. 99: 23520. DOI: 10.1063/1.2163982 | 0.472 | |||
2006 | Zhang X, Ren F, Goorsky MS, Tu KN. Study of the initial stage of electroless Ni deposition on Si (100) substrates in aqueous alkaline solution Surface and Coatings Technology. 201: 2724-2732. DOI: 10.1016/J.Surfcoat.2006.05.025 | 0.434 | |||
2006 | Xu L, Pang JHL, Ren F, Tu KN. Electromigration Effect on Intermetallic Growth and Young's Modulus in SAC Solder Joint Journal of Electronic Materials. 35: 2116-2125. DOI: 10.1007/S11664-006-0321-8 | 0.335 | |||
2005 | Yan MY, Suh JO, Ren F, Tu K, Vairagar AV, Mhaisalkar SG, Krishnamoorthy A. Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects Applied Physics Letters. 87: 211103. DOI: 10.1063/1.2132536 | 0.47 | |||
Show low-probability matches. |