Year |
Citation |
Score |
2006 |
Li Z, Lee H, Borucki L, Rogers C, Kikuma R, Rikita N, Nagasawa K, Philipossian A. Effects of disk design and kinematics of conditioners on process hydrodynamics during copper CMP Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2177067 |
0.609 |
|
2006 |
Lee H, Seike Y, Li Z, Zhuang Y, Takaoka M, Miyachi K, Philipossian A. Characterization of slurry residues in pad grooves for diamond disc and high pressure micro jet pad conditioning processes Japanese Journal of Applied Physics, Part 2: Letters. 45. DOI: 10.1143/Jjap.45.L1325 |
0.623 |
|
2005 |
Zhuang Y, Li Z, Shimazu Y, Uotani N, Borucki L, Philipossian A. Experimental and numerical analysis of an inhibitor-containing slurry for copper chemical mechanical planarization Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers. 44: 82-86. DOI: 10.1143/Jjap.44.82 |
0.626 |
|
2004 |
Borucki L, Li Z, Philipossian A. Experimental and theoretical investigation of heating and convection in copper polishing Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1774489 |
0.61 |
|
2004 |
Li Z, Borucki L, Koshiyama I, Philipossian A. Effect of slurry flow rate on tribological, thermal, and removal rate attributes of copper CMP Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1758818 |
0.588 |
|
2004 |
Sorooshian J, DeNardis D, Charns L, Li Z, Shadman F, Boning D, Hetherington D, Philipossian A. Arrhenius Characterization of ILD and Copper CMP Processes Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1635388 |
0.503 |
|
2003 |
Li Z, Ina K, Lefevre P, Philipossian A. Determining the effects of slurry surfactant, abrasive size and abrasive content on the tribology and kientics of copper CMP Proceedings - Electrochemical Society. 21: 92-103. DOI: 10.1149/1.1869974 |
0.597 |
|
2003 |
Li Z, Rader S, Lefevre P, Ina K, Boning D, Philipossian A. Comparison of copper disc and copper wafer polishing processes in terms of their kinetic, tribological and thermal characteristics Proceedings - Electrochemical Society. 21: 35-43. DOI: 10.1109/Tsm.2005.858522 |
0.621 |
|
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