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Thomas Bieler - Publications

Affiliations: 
Mechanical Engineering - Doctor of Philosophy Michigan State University, East Lansing, MI 
Area:
Mechanical Engineering, Materials Science Engineering
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10 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2019 Fensin S, Spearot D, Bieler T, Dillon S, Luo J. Deformation and Transitions at Interfaces and Grain Boundaries Jom. 71: 1198-1199. DOI: 10.1007/S11837-019-03390-2  0.347
2017 Nguyen D, Kang D, Bieler T, Park K, Kwon P. Microstructural impact on flank wear during turning of various Ti-6Al-4V alloys Wear. 384: 72-83. DOI: 10.1016/J.Wear.2017.05.002  0.384
2016 Zhou Q, Zhou B, Lee TK, Bieler T. Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling Journal of Electronic Materials. 1-12. DOI: 10.1007/S11664-016-4343-6  0.548
2013 Wang L, Li M, Almer J, Bieler T, Barabash R. Microstructural characterization of polycrystalline materials by synchrotron X-rays Frontiers of Materials Science. 7: 156-169. DOI: 10.1007/S11706-013-0201-0  0.491
2013 Wang L, Barabash R, Bieler T, Liu W, Eisenlohr P. Study of {112̄1} Twinning in α-Ti by EBSD and Laue Microdiffraction Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 44: 3664-3674. DOI: 10.1007/S11661-013-1714-Y  0.461
2012 Lee TK, Zhou B, Bieler T, Liu KC. Impact of microstructure evolution and isothermal aging on Sn-Ag-Cu solder interconnect board-level high-G mechanical shock performance and crack propagation Journal of Electronic Materials. 41: 273-282. DOI: 10.1007/S11664-011-1775-X  0.546
2011 Lee TK, Liu B, Zhou B, Bieler T, Liu KC. Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects Journal of Electronic Materials. 40: 1895-1902. DOI: 10.1007/S11664-011-1654-5  0.555
2007 Borgesen P, Bieler T, Lehman LP, Cotts EJ. Pb-free solder: New materials considerations for microelectronics processing Mrs Bulletin. 32: 360-365. DOI: 10.1557/Mrs2007.236  0.379
2007 Baars D, Jiang H, Bieler T, Compton C, Bauer P, Grimm T. Crystal orientations near welds in high RRR niobium with very large grains Ieee Transactions On Applied Superconductivity. 17: 1295-1298. DOI: 10.1109/Tasc.2007.898014  0.581
2005 Bieler T, Goetz RL, Semiatin SL. Anisotropic plasticity and cavity growth during upset forging of Ti-6Al-4V Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 405: 201-213. DOI: 10.1016/J.Msea.2005.05.064  0.396
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