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Yinfeng Zong, Ph.D. - Publications

Affiliations: 
2005 University of Massachusetts, Amherst, Amherst, MA 
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6 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2005 Zong Y, Watkins JJ. Deposition of copper by the H2-assisted reduction of Cu(tmod)2 in supercritical carbon dioxide: Kinetics and reaction mechanism Chemistry of Materials. 17: 560-565. DOI: 10.1021/Cm048665D  0.585
2004 Zong Y, Shan X, Watkins JJ. Sacrificial adhesion promotion layers for copper metallization of device structures. Langmuir : the Acs Journal of Surfaces and Colloids. 20: 9210-6. PMID 15461508 DOI: 10.1021/La048731Q  0.601
2004 Zong Y, Watkins JJ. The influence of temperature and concentration on copper deposition kinetics in supercritical carbon dioxide Materials Research Society Symposium Proceedings. 812: 267-272. DOI: 10.1557/Proc-812-F8.6  0.557
2004 Zong Y, Shan X, Watkins JJ. Sacrificial adhesion promotion layer for cu deposition in supercritical carbon dioxide Advanced Metallization Conference (Amc). 633-637.  0.608
2004 Zong Y, Watkins JJ. Kinetics of Cu deposition by the hydrogen reduction of Cu (II)(tmod) 2 in supercritical CO 2 Advanced Metallization Conference (Amc). 353-358.  0.53
2001 Blackburn JM, Cabanas A, Zong Y, Quinn JD, Watkins JJ. Reactive deposition of device quality conformal copper films from supercritical CO2 Advanced Metallization Conference (Amc). 177-183.  0.58
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