Year |
Citation |
Score |
2022 |
Wang H, Long X, Liu XX. fastESN: Fast Echo State Network. Ieee Transactions On Neural Networks and Learning Systems. PMID 35482690 DOI: 10.1109/TNNLS.2022.3167466 |
0.506 |
|
2020 |
Wang H, Guo X, Tan SX, Zhang C, Tang H, Yuan Y. Leakage-Aware Predictive Thermal Management for Multicore Systems Using Echo State Network Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 39: 1400-1413. DOI: 10.1109/Tcad.2019.2915316 |
0.707 |
|
2019 |
Wang H, Huang D, Liu R, Zhang C, Tang H, Yuan Y. STREAM: Stress and Thermal Aware Reliability Management for 3-D ICs Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 38: 2058-2071. DOI: 10.1109/Tcad.2018.2877019 |
0.337 |
|
2019 |
Wang H, Tang D, Zhang M, Tan SX, Zhang C, Tang H, Yuan Y. GDP: A Greedy Based Dynamic Power Budgeting Method for Multi/Many-Core Systems in Dark Silicon Ieee Transactions On Computers. 68: 526-541. DOI: 10.1109/Tc.2018.2875986 |
0.698 |
|
2018 |
Zhao H, Hua Q, Chen H, Ye Y, Wang H, Tan SX-, Tlelo-Cuautle E. Thermal-Sensor-Based Occupancy Detection for Smart Buildings Using Machine-Learning Methods Acm Transactions On Design Automation of Electronic Systems. 23: 54. DOI: 10.1145/3200904 |
0.359 |
|
2018 |
Wang H, Wan J, Tan SX, Zhang C, Tang H, Yuan Y, Huang K, Zhang Z. A Fast Leakage-Aware Full-Chip Transient Thermal Estimation Method Ieee Transactions On Computers. 67: 617-630. DOI: 10.1109/Tc.2017.2778066 |
0.709 |
|
2017 |
Kim T, Sun Z, Chen H, Wang H, Tan SX. Energy and Lifetime Optimizations for Dark Silicon Manycore Microprocessor Considering Both Hard and Soft Errors Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 25: 2561-2574. DOI: 10.1109/Tvlsi.2017.2707401 |
0.7 |
|
2017 |
Tang H, Peng Y, Lu X, Wang AZ, Wang H. A quantitative design methodology for high-speed interpolation/averaging ADCs Integration. 58: 215-224. DOI: 10.1016/J.Vlsi.2017.03.008 |
0.362 |
|
2016 |
Wang H, Ma J, Tan SX-, Zhang C, Tang H, Huang K, Zhang Z. Hierarchical Dynamic Thermal Management Method for High-Performance Many-Core Microprocessors Acm Transactions On Design Automation of Electronic Systems. 22: 1-21. DOI: 10.1145/2891409 |
0.391 |
|
2016 |
Zhao Y, Kim T, Shin H, Tan SX, Li X, Chen H, Wang H. Statistical Rare-Event Analysis and Parameter Guidance by Elite Learning Sample Selection Acm Transactions On Design Automation of Electronic Systems. 21: 1-21. DOI: 10.1145/2875422 |
0.683 |
|
2016 |
He K, Tan SX-, Wang H, Shi G. GPU-Accelerated Parallel Sparse LU Factorization Method for Fast Circuit Analysis Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 24: 1140-1150. DOI: 10.1109/Tvlsi.2015.2421287 |
0.337 |
|
2016 |
He K, Tan SXD, Zhao H, Liu XX, Wang H, Shi G. Parallel GMRES solver for fast analysis of large linear dynamic systems on GPU platforms Integration, the Vlsi Journal. 52: 10-22. DOI: 10.1016/J.Vlsi.2015.07.005 |
0.584 |
|
2015 |
Chen H, Li Y, Tan SX-, Huang X, Wang H, Wong N. H -Matrix-Based Finite-Element-Based Thermal Analysis for 3D ICs Acm Transactions On Design Automation of Electronic Systems. 20: 47. DOI: 10.1145/2714563 |
0.331 |
|
2015 |
Liu Z, Tan SX-, Huang X, Wang H. Task Migrations for Distributed Thermal Management Considering Transient Effects Ieee Transactions On Very Large Scale Integration Systems. 23: 397-401. DOI: 10.1109/Tvlsi.2014.2309331 |
0.577 |
|
2015 |
Chen HB, Tan SXD, Shin DH, Huang X, Wang H, Shi G. H 2-matrix-based finite element linear solver for fast transient thermal analysis of high-performance ICs International Journal of Circuit Theory and Applications. 43: 1953-1970. DOI: 10.1002/Cta.2051 |
0.362 |
|
2014 |
Liu Z, Swarup S, Tan SXD, Chen HB, Wang H. Compact lateral thermal resistance model of TSVs for fast finite-difference based thermal analysis of 3-D stacked ICs Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 33: 1490-1502. DOI: 10.1109/Tcad.2014.2334321 |
0.607 |
|
2014 |
Liu Z, Tan SXD, Wang H, Hua Y, Gupta A. Compact thermal modeling for packaged microprocessor design with practical power maps Integration. 47: 71-85. DOI: 10.1016/J.Vlsi.2013.07.003 |
0.633 |
|
2013 |
Wang H, Tan SX, Li D, Gupta A, Yuan Y. Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors Acm Transactions On Design Automation of Electronic Systems. 18: 1-27. DOI: 10.1145/2442087.2442099 |
0.711 |
|
2012 |
Shen R, Tan SX-, Wang H, Xiong J. Fast Statistical Full-Chip Leakage Analysis for Nanometer VLSI Systems Acm Transactions On Design Automation of Electronic Systems. 17: 51. DOI: 10.1145/2348839.2348855 |
0.341 |
|
2012 |
Wang H, Tan SX-, Rakib R. Compact Modeling of Interconnect Circuits over Wide Frequency Band by Adaptive Complex-Valued Sampling Method Acm Transactions On Design Automation of Electronic Systems. 17: 5. DOI: 10.1145/2071356.2071361 |
0.348 |
|
2012 |
Wang H, Yu H, Tan SXD. Fast timing analysis of clock networks considering environmental uncertainty Integration. 45: 376-387. DOI: 10.1016/J.Vlsi.2011.03.001 |
0.368 |
|
2010 |
Tan SX-, Yan B, Wang H. Recent advance in non-Krylov subspace model order reduction of interconnect circuits Tsinghua Science & Technology. 15: 151-168. DOI: 10.1016/S1007-0214(10)70045-6 |
0.366 |
|
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