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Indranath Dutta - Publications

Affiliations: 
Mechanical Engineering Washington State University, Pullman, WA, United States 
Area:
Mechanical Engineering
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Year Citation  Score
2020 Majumdar BS, Dutta I, Bhassyvasantha S, Mahapatra SD. Recent Advances in Mitigation of Whiskers from Electroplated Tin Jom. 72: 906-917. DOI: 10.1007/S11837-019-03933-7  0.313
2020 Arafat Y, Yang H, Dutta I, Kumar PA, Datta B. A Model for Intermetallic Growth in Thin Sn Joints Between Cu Substrates: Application to Solder Microjoints Journal of Electronic Materials. 49: 3367-3382. DOI: 10.1007/S11664-020-08019-8  0.386
2019 Yang H, Lee T, Meinshausen L, Dutta I. Heating Rate Dependence of the Mechanisms of Copper Pumping in Through-Silicon Vias Journal of Electronic Materials. 48: 159-169. DOI: 10.1007/S11664-018-6805-5  0.35
2018 Mahapatra SD, Dutta I. Co-electrodeposition of tin with 0.2–20% indium: Implications on tin whisker growth Surface & Coatings Technology. 337: 478-483. DOI: 10.1016/J.Surfcoat.2018.01.061  0.31
2018 Kumar PA, Dutta I. Effect of Intermetallic Content on Shear Deformation of Thin Sn-3.0Ag-0.5Cu Solder Micro-joints Between Copper Substrates Journal of Electronic Materials. 47: 5488-5497. DOI: 10.1007/S11664-018-6434-Z  0.376
2017 Mahapatra SD, Majumdar BS, Dutta I, Bhassyvasantha S. Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper Substrate Journal of Electronic Materials. 46: 4062-4075. DOI: 10.1007/S11664-016-5177-Y  0.327
2016 Talebanpour B, Sahaym U, Dutta I. Effect of Composition and Thermal-Mechanical History on the Creep Behavior of Sn-Ag-Cu Solders-Part I: Experiments Ieee Transactions On Device and Materials Reliability. 16: 318-325. DOI: 10.1109/TDMR.2016.2595594  0.318
2016 Talebanpour B, Sahaym U, Dutta I. Effect of Composition and Thermal-Mechanical History on the Creep Behavior of Sn-Ag-Cu Solders-Part II: Model Ieee Transactions On Device and Materials Reliability. 16: 326-335. DOI: 10.1109/Tdmr.2016.2580530  0.431
2016 Arafat Y, Dutta I, Panat R. On the deformation mechanisms and electrical behavior of highly stretchable metallic interconnects on elastomer substrates Journal of Applied Physics. 120: 115103. DOI: 10.1063/1.4962453  0.345
2015 Arafat Y, Dutta I, Panat R. Super-stretchable metallic interconnects on polymer with a linear strain of up to 100% Applied Physics Letters. 107. DOI: 10.1063/1.4929605  0.333
2015 Meinshausen L, Bhassyvasantha S, Majumdar BS, Dutta I. Influence of Indium Addition on Whisker Mitigation in Electroplated Tin Coatings on Copper Substrates Journal of Electronic Materials. 1-11. DOI: 10.1007/S11664-015-4204-8  0.314
2015 Talebanpour B, Huang Z, Chen Z, Dutta I. Effect of Joint Scale and Processing on the Fractureof Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumpsin 3D Packages Journal of Electronic Materials. DOI: 10.1007/S11664-015-4066-0  0.376
2014 Huang Z, Kumar P, Dutta I, Pang JHL, Sidhu R. A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks Engineering Fracture Mechanics. 131: 9-25. DOI: 10.1016/J.Engfracmech.2014.10.003  0.311
2014 Huang Z, Kumar P, Dutta I, Sidhu R, Renavikar M, Mahajan R. Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish Journal of Electronic Materials. 43: 4485-4496. DOI: 10.1007/S11664-014-3441-6  0.36
2014 Huang Z, Kumar P, Dutta I, Sidhu R, Renavikar M, Mahajan R. Incorporation of interfacial intermetallic morphology in fracture mechanism map for Sn-Ag-Cu solder joints Journal of Electronic Materials. 43: 88-95. DOI: 10.1007/S11664-013-2755-0  0.34
2014 Liu J, Sahaym U, Dutta I, Raj R, Renavikar M, Sidhu RS, Mahajan R. Interfacially engineered liquid-phase-sintered Cu-In composite solders for thermal interface material applications Journal of Materials Science. 49: 7844-7854. DOI: 10.1007/S10853-014-8495-6  0.391
2013 Sahaym U, Talebanpour B, Seekins S, Dutta I, Kumar P, Borgesen P. Recrystallization and Ag3Sn particle redistribution during thermomechanical treatment of bulk Sn-Ag-Cu solder alloys Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1868-1875. DOI: 10.1109/Tcpmt.2013.2272543  0.382
2013 Chan D, Nie X, Bhate D, Subbarayan G, Chen WW, Dutta I. Constitutive models for intermediate-and high-strain rate flow behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu solder alloys Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 133-146. DOI: 10.1109/Tcpmt.2012.2211022  0.37
2013 Kumar P, Dutta I. Effect of substrate surface on electromigration-induced sliding at hetero-interfaces Journal of Physics D: Applied Physics. 46. DOI: 10.1088/0022-3727/46/15/155303  0.326
2012 Kumar P, Huang Z, Chavali SC, Chan DK, Dutta I, Subbarayan G, Gupta V. Microstructurally adaptive model for primary and secondary creep of Sn-Ag-based solders Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 256-265. DOI: 10.1109/Tcpmt.2011.2173494  0.553
2012 Kumar P, Huang Z, Dutta I, Sidhu R, Renavikar M, Mahajan R. Fracture of Sn-Ag-Cu solder joints on Cu substrates. II: Fracture mechanism map Journal of Electronic Materials. 41: 412-424. DOI: 10.1007/S11664-011-1806-7  0.331
2012 Huang Z, Kumar P, Dutta I, Pang JHL, Sidhu R, Renavikar M, Mahajan R. Fracture of Sn-Ag-Cu solder joints on Cu substrates: I. Effects of loading and processing conditions Journal of Electronic Materials. 41: 375-389. DOI: 10.1007/S11664-011-1769-8  0.357
2012 Kumar P, Dutta I, Bakir MS. Interfacial effects during thermal cycling of Cu-filled through-silicon vias (TSV) Journal of Electronic Materials. 41: 322-335. DOI: 10.1007/S11664-011-1726-6  0.372
2011 Kumar P, Dutta I. Influence of electric current on diffusionally accommodated sliding at hetero-interfaces Acta Materialia. 59: 2096-2108. DOI: 10.1016/J.Actamat.2010.12.011  0.368
2011 Dutta I, Kumar P, Bakir MS. Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias Jom. 63: 70-77. DOI: 10.1007/S11837-011-0179-Y  0.373
2011 Liu J, Kumar P, Dutta I, Raj R, Sidhu R, Renavikar M, Mahajan R. Liquid phase sintered Cu-In composite solders for thermal interface material and interconnect applications Journal of Materials Science. 46: 7012-7025. DOI: 10.1007/S10853-011-5670-X  0.389
2010 Dutta I, Burkhard M, Kuwano S, Fujita T, Chen MW. Correlation between surface whisker growth and interfacial precipitation in aluminum thin films on silicon substrates Journal of Materials Science. 45: 3367-3374. DOI: 10.1007/S10853-010-4359-X  0.33
2009 Ye B, Majumdar BS, Dutta I. Texture development and strain hysteresis in a NiTi shape-memory alloy during thermal cycling under load Acta Materialia. 57: 2403-2417. DOI: 10.1016/J.Actamat.2009.01.032  0.367
2009 Dutta I, Kumar P, Subbarayan G. Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties Jom. 61: 29-38. DOI: 10.1007/S11837-009-0085-8  0.367
2008 Kumar P, Dutta I, Raj R, Renavikar M, Wakharkar V. Novel liquid phase sintered solders with indium as minority phase for next generation thermal interface material applications 2008 2nd International Conference On Thermal Issues in Emerging Technologies, Theta 2008. 325-332. DOI: 10.1007/S11664-009-0898-9  0.354
2008 Chen T, Dutta I. Effect of Ag and Cu concentrations on the creep behavior of Sn-based solders Journal of Electronic Materials. 37: 347-354. DOI: 10.1007/S11664-007-0340-0  0.363
2008 Long X, Dutta I, Sarihan V, Frear DR. Deformation behavior of Sn-3.8Ag-0.7Cu solder at intermediate strain rates: Effect of microstructure and test conditions Journal of Electronic Materials. 37: 189-200. DOI: 10.1007/S11664-007-0316-0  0.359
2007 Ye B, Majumdar BS, Dutta I. Texture memory and strain-texture mapping in a NiTi shape memory alloy Applied Physics Letters. 91. DOI: 10.1063/1.2768899  0.324
2007 Park C, Long X, Haberman S, Ma S, Dutta I, Mahajan R, Jadhav SG. A comparison of impression and compression creep behavior of polycrystalline Sn Journal of Materials Science. 42: 5182-5187. DOI: 10.1007/S10853-006-0542-5  0.365
2006 Wang ZX, Dutta I, Majumdar BS. Thermomechanical response of a lead-free solder reinforced with a shape memory alloy Scripta Materialia. 54: 627-632. DOI: 10.1016/J.Scriptamat.2005.10.037  0.388
2006 Wang ZX, Dutta I, Majumdar BS. Thermal cycle response of a lead-free solder reinforced with adaptive shape memory alloy Materials Science and Engineering A. 421: 133-142. DOI: 10.1016/J.Msea.2005.10.026  0.427
2006 Dutta I, Park C, Vella J. Effect of internal stresses on thermo-mechanical stability of interconnect structures in microelectronic devices Materials Science and Engineering A. 421: 118-132. DOI: 10.1016/J.Msea.2005.10.010  0.406
2006 Dutta I, Pan D, Ma S, Majumdar BS, Harris S. Role of shape-memory alloy reinforcements on strain evolution in lead-free solder joints Journal of Electronic Materials. 35: 1902-1913. DOI: 10.1007/S11664-006-0174-1  0.39
2005 Dutta I, Peterson KA, Park C, Vella J. Modeling of interfacial sliding and film crawling in back-end structures of microelectronic devices Ieee Transactions On Components and Packaging Technologies. 28: 397-407. DOI: 10.1109/Tcapt.2005.853588  0.406
2005 Chen MW, Inoue A, Sakurai T, Menon ESK, Nagarajan R, Dutta I. Redistribution of alloying elements in quasicrystallized Zr 65Al 7.5Ni 10Cu 7.5Ag 10 bulk metallic glass Physical Review B - Condensed Matter and Materials Physics. 71. DOI: 10.1103/Physrevb.71.092202  0.36
2005 Dutta I, Pan D, Marks RA, Jadhav SG. Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders Materials Science and Engineering A. 410: 48-52. DOI: 10.1016/J.Msea.2005.08.142  0.404
2005 Pan D, Dutta I, Jadhav SG, Raiser GF, Ma S. Impression creep characterization of 90Pb-10Sn microelectronic solder balls at subsolvus and supersolvus temperatures Journal of Electronic Materials. 34: 1040-1046. DOI: 10.1007/S11664-005-0093-6  0.347
2004 Pan D, Marks RA, Dutta I, Mahajan R, Jadhav SG. Miniaturized impression creep testing of ball grid array solder balls attached to microelectronic packaging substrates Review of Scientific Instruments. 75: 5244-5252. DOI: 10.1063/1.1821626  0.346
2004 Peterson KA, Dutta I, Chen M. Processing and characterization of diffusion-bonded Al-Si interfaces Journal of Materials Processing Technology. 145: 99-108. DOI: 10.1016/S0924-0136(03)00877-X  0.308
2004 Dutta I, Park C, Choi S. Impression creep characterization of rapidly cooled Sn-3.5Ag solders Materials Science and Engineering A. 379: 401-410. DOI: 10.1016/J.Msea.2004.03.023  0.383
2004 Pan D, Dutta I. A mechanics-induced complication of impression creep and its solution: Application to Sn-3.5Ag solder Materials Science and Engineering A. 379: 154-163. DOI: 10.1016/J.Msea.2004.01.034  0.356
2004 Dutta I, Majumdar BS, Pan D, Horton WS, Wright W, Wang ZX. Development of a novel adaptive lead-free solder containing reinforcements displaying the shape-memory effect Journal of Electronic Materials. 33: 258-270. DOI: 10.1007/S11664-004-0131-9  0.428
2003 Peterson KA, Dutta I, Chen MW. Diffusionally accommodated interfacial sliding in metal-silicon systems Acta Materialia. 51: 2831-2846. DOI: 10.1016/S1359-6454(03)00088-0  0.372
2003 Dutta I, Peterson KA, Park C. Interfacial creep in multi-component material systems Jom. 55: 38-43. DOI: 10.1007/S11837-003-0192-X  0.402
2003 Dutta I. A constitutive model for creep of lead-free solders undergoing strain-enhanced microstructural coarsening: A first report Journal of Electronic Materials. 32: 201-207. DOI: 10.1007/S11664-003-0210-3  0.388
2003 Park C, Dutta I, Peterson KA, Vella J. Deformation and interfacial sliding in back-end interconnect structures in microelectronic devices Journal of Electronic Materials. 32: 1059-1071. DOI: 10.1007/S11664-003-0089-Z  0.392
2002 Dutta I, Gopinath A, Marshall C. Underfill constraint effects during thermomechanical cycling of flip-chip solder joints Journal of Electronic Materials. 31: 253-264. DOI: 10.1007/S11664-002-0141-4  0.393
2001 Dutta I, Chen MW, Peterson K, Shultz T. Plastic deformation and interfacial sliding in Al and Cu thin film: Si substrate systems due to thermal cycling Journal of Electronic Materials. 30: 1537-1548. DOI: 10.1007/S11664-001-0171-3  0.382
2000 Chen MW, Dutta I. Atomic force microscopy study of plastic deformation and interfacial sliding in Al thin film: Si substrate systems due to thermal cycling Applied Physics Letters. 77: 4298-4300. DOI: 10.1063/1.1332098  0.344
2000 Dutta I. Role of interfacial and matrix creep during thermal cycling of continuous fiber reinforced metal-matrix composites Acta Materialia. 48: 1055-1074. DOI: 10.1016/S1359-6454(99)00402-4  0.385
1999 Nagarajan R, Dutta I, Funn JV, Esmele M. Role of interfacial sliding on the longitudinal creep response of continuous fiber reinforced metal-matrix composites Materials Science and Engineering A. 259: 237-252. DOI: 10.1016/S0921-5093(98)00896-X  0.363
1998 Funn JV, Dutta I. Creep behavior of interfaces in fiber reinforced metal-matrix composites Acta Materialia. 47: 149-164. DOI: 10.1016/S1359-6454(98)00327-9  0.374
1998 Dutta I, Quiles FN, McNelley TR, Nagarajan R. Optimization of the strength-fracture toughness relation in particulate-reinforced aluminum composites via control of the matrix microstructure Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 29: 2433-2446. DOI: 10.1007/S11661-998-0119-9  0.361
1995 Dutta I, Campbell JC. Determination of the adhesive strength of film-substrate interfaces using the constant depth scratch test Materials Research Society Symposium - Proceedings. 390: 49-54. DOI: 10.1557/Proc-390-49  0.331
1994 Dutta I, Lascurain DP, Secor ED. Measurement of adhesion at film-substrate interfaces by constant depth scratch testing Materials Research Society Symposium - Proceedings. 338: 507-512. DOI: 10.1557/Proc-338-507  0.306
1994 Dutta I, Harper CP, Dutta G. Role of Al2O3 particulate reinforcements on precipitation in 2014 Al-matrix composites Metallurgical and Materials Transactions A. 25: 1591-1602. DOI: 10.1007/Bf02668525  0.391
1993 Dutta I, Sims JD, Seigenthaler DM. An analytical study of residual stress effects on uniaxial deformation of whisker reinforced metal-matrix composites Acta Metallurgica Et Materialia. 41: 885-908. DOI: 10.1016/0956-7151(93)90023-L  0.4
1991 Dutta I, Allen SM, Hafley JL. Effect of reinforcement on the aging response of cast 6061 Al-Al2O3 particulate composites Metallurgical Transactions. a, Physical Metallurgy and Materials Science. 22: 2553-2563. DOI: 10.1007/Bf02851349  0.384
1991 Mitra S, Dutta I, Hansen RC. Thermal cycling studies of a cross-plied P100 graphite fibre-reinforced 6061 aluminium composite laminate Journal of Materials Science. 26: 6223-6230. DOI: 10.1007/Bf01113908  0.366
1991 Dutta I, Allen SM. A calorimetric study of precipitation in commercial aluminium alloy 6061 Journal of Materials Science Letters. 10: 323-326. DOI: 10.1007/Bf00719697  0.309
1990 Dutta I, Bourell DL. Influence of dislocation density and distribution on the aging behavior of 6061 AlSiCw composites Acta Metallurgica Et Materialia. 38: 2041-2049. DOI: 10.1016/0956-7151(90)90071-N  0.395
1989 Dutta I, Bourell DL. A theoretical and experimental study of aluminum alloy 6061-SiC metal matrix composite to identify the operative mechanism for accelerated aging Materials Science and Engineering A. 112: 67-77. DOI: 10.1016/0921-5093(89)90345-6  0.408
1988 Dutta I, Bourell DL, Latimer D. A Theoretical Investigation of Accelerated Aging in Metal-Matrix Composites Journal of Composite Materials. 22: 829-849. DOI: 10.1177/002199838802200904  0.4
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