Year |
Citation |
Score |
2024 |
Kang T, Park J, Jung H, Choi H, Lee SM, Lee N, Lee RG, Kim G, Kim SH, Kim HJ, Yang CW, Jeon J, Kim YH, Lee S. High-κ dielectric (HfO)/2D Semiconductor (HfSe) Gate Stack for Low-Power Steep-switching Computing Devices. Advanced Materials (Deerfield Beach, Fla.). e2312747. PMID 38531112 DOI: 10.1002/adma.202312747 |
0.345 |
|
2023 |
Kim JH, Kim SG, Kim SH, Han KH, Kim J, Yu HY. Highly Tunable Negative Differential Resistance Device Based on Insulator-to-Metal Phase Transition of Vanadium Dioxide. Acs Applied Materials & Interfaces. PMID 37339325 DOI: 10.1021/acsami.3c03213 |
0.338 |
|
2021 |
Kim SG, Kim SH, Kim GS, Jeon H, Kim T, Yu HY. Steep-Slope Gate-Connected Atomic Threshold Switching Field-Effect Transistor with MoS Channel and Its Application to Infrared Detectable Phototransistors. Advanced Science (Weinheim, Baden-Wurttemberg, Germany). 8: 2100208. PMID 34194944 DOI: 10.1002/advs.202100208 |
0.349 |
|
2007 |
Kim S, Fossum JG. Design Optimization and Performance Projections of Double-Gate FinFETs With Gate–Source/Drain Underlap for SRAM Application Ieee Transactions On Electron Devices. 54: 1934-1942. DOI: 10.1109/Ted.2007.901070 |
0.632 |
|
2006 |
Kim S, Fossum J, Yang J. Modeling and Significance of Fringe Capacitance in Nonclassical CMOS Devices With Gate–Source/Drain Underlap Ieee Transactions On Electron Devices. 53: 2143-2150. DOI: 10.1109/Ted.2006.880369 |
0.604 |
|
2005 |
Kim S, Fossum JG, Trivedi VP. Bulk inversion in FinFETs and implied insights on effective gate width Ieee Transactions On Electron Devices. 52: 1993-1997. DOI: 10.1109/Ted.2005.854286 |
0.621 |
|
2005 |
Kim S, Fossum JG. Nanoscale CMOS: potential nonclassical technologies versus a hypothetical bulk-silicon technology Solid-State Electronics. 49: 595-605. DOI: 10.1016/J.Sse.2004.12.004 |
0.641 |
|
2003 |
Mehandru R, Kim S, Kim J, Ren F, Lothian JR, Pearton SJ, Park SS, Park YJ. Thermal simulations of high power, bulk GaN rectifiers Solid-State Electronics. 47: 1037-1043. DOI: 10.1016/S0038-1101(02)00481-1 |
0.395 |
|
2002 |
Mehandru R, Dang G, Kim S, Ren F, Hobson W, Lopata J, Pearton S, Chang W, Shen H. Finite difference analysis of thermal characteristics of CW operation 850 nm lateral current injection and implant-apertured VCSEL with flip-chip bond design Solid-State Electronics. 46: 699-704. DOI: 10.1016/S0038-1101(01)00329-X |
0.351 |
|
Show low-probability matches. |