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Wayne H. Chen, Ph.D. - Publications

Affiliations: 
2011 Electrical Engineering (Applied Physics) University of California, San Diego, La Jolla, CA 
Area:
Electronics and Electrical Engineering, Materials Science Engineering
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10 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2012 Doran C, Chen W, Alford TL, Lau SS. A study of single-crystal silicon diodes integrated on flexible substrates using conductive adhesives Applied Physics Letters. 100. DOI: 10.1063/1.3684970  0.506
2011 Chen W, Kuech TF, Lau SS. Ion-cut transfer of InP-based high electron mobility transistors Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3591110  0.574
2011 Chen W, Doran C, Govea D, Alford TL, Lau SS. Stress-induced transfer of ultrathin silicon layers onto flexible substrates Electrochemical and Solid-State Letters. 14: H171-H173. DOI: 10.1149/1.3548508  0.558
2011 Vemuri RNP, Gadre MJ, Theodore ND, Chen W, Lau SS, Alford TL. Susceptor assisted microwave annealing for recrystallization and dopant activation of arsenic-implanted silicon Journal of Applied Physics. 110: 34907. DOI: 10.1063/1.3622287  0.505
2011 Chen W, Alford TL, Kuech TF, Lau SS. High electron mobility transistors on plastic flexible substrates Applied Physics Letters. 98. DOI: 10.1063/1.3593006  0.583
2010 Chen W, Chen WV, Lee K, Lau SS, Kuech TF. High quality InP layers transferred by cleavage plane assisted ion-cutting Electrochemical and Solid-State Letters. 13: H268-H270. DOI: 10.1149/1.3428748  0.59
2009 Chen W, Bandaru P, Tang CW, Lau KM, Kuech TF, Lau SS. InP Layer Transfer with Masked Implantation Electrochemical and Solid-State Letters. 12: H149. DOI: 10.1149/1.3078487  0.572
2009 Chen W, Zhang A, Chen P, Pulsifer JE, Alford TL, Kuech TF, Lau SS. Feasibility study of ion-cut InP photoconductor devices on glass substrates Applied Physics Express. 2. DOI: 10.1143/Apex.2.022201  0.583
2008 Chen W, Chen P, Pulsifer JE, Alford TL, Kuech TF, Lau SS. Integration of thin layers of single-crystalline InP with flexible substrates Applied Physics Letters. 92. DOI: 10.1063/1.2937409  0.569
2007 Chen W, Chen P, Jing Y, Lau SS, Kuech TF, Liu J, Wang X, Chu W. Double-flip transfer of indium phosphide layers via adhesive wafer bonding and ion-cutting process Applied Physics Letters. 90: 52114. DOI: 10.1063/1.2450665  0.596
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