Ranga Komanduri - US grants

Matching funds will support acquisition of a chemical vapor deposition system for study of diamond films and coatings. The relationship between fundamental processing parameters, substrate adherence, and tribological performance will be studied in detail with the goal of optimizing the tribological properties.

Support is requested so that the key contributors to research in machining and grinding in the 20th century be brought together for a 2-day symposium at Oklahoma State University. The symposium will allow currently active researchers to benefit from the knowledge and experience of the pioneers, before they are no longer available to us.

For machining many difficult-to-machine materials, such as high silicon aluminum-silicon alloys and composites, polycrystalline diamond tools made by the high pressure (50 kbars) -- high temperature (1500 C) (HP-HT) process are used. These tools are expensive because of the high cost of processing and finishing and need exists for an alternate tool material. The low pressure chemical vapor desposition (CVD) diamond synthesis, in contrast, is relatively simple and inexpensive, thus offering a potential for producing diamond coated cutting tools. The primary goal of this project is to develop the science base for strongly adherent diamond coatings on various cutting tool materials, including, cemented carbide (coated and uncoated) and ceramics (silicon nitride and SiAION) by the four activated CVD diamond synthesis techniques, namely, combustion synthesis, microwave CVD, hot filament CVD, and laser assisted CVD with emphasis on the first two. The conditions for each of the activated CVD diamond coating processes will be optimized for a given tool material based on good metallurgical coating, its thickness and morphology. These tools will be characterized by optical and scanning electron microscopy, and Raman spectroscopy. They will be evaluated in machining different work materials with the cutting speed and length of cut as variables. Various surface treatments including etching of the surface, different surface finishing conditions, surface interlayer coatings for the substrate will be considered. Tool wear mechanisms, tool life, and finish of the work material with diamond coated tools will be compared with that of the uncoated tools and/or polycrystalline diamond tools.

The equipment grant will provide an Environmental Scanning Electron Microscope (ESEM) for conducting in-situ dynamic studies on a range of manufacturing processes, materials engineering and tribological problems. This revolutionary equipment allows samples to be examined, or in-situ phenomenon recorded, under dynamic conditions in different environments (gaseous or liquid at chamber pressures from 0.1 to 50 torr and at different temperatures up to 1000C. The large specimen chamber (12" x 12" x 12") can accommodate a wide range of samples allowing the simulation of manufacturing processes (eg., cutting metal forming, plastics injection molding, etc.), tribological phenomena, and materials testing (tension, compression torsion, fatigue, stress corrosion cracking, combined loading). Some of the in situ studies include hot corrosion; failure of glass fibers in an epoxy-glass composite or silicon carbide fibers in an aluminum matrix under a range of loading conditions; effect of various cutting fluids in machining of different materials; machining of glass, ceramics, polymers, and composites; metal forming; effect of lubricants in friction and wear; solidification of metals; and the mechanism of nucleation and growth of polycrystalline diamond films made by low pressure chemical vapor deposition techniques.

9411144 Komanduri This award supports cooperative research between Ranga Komanduri, Oklahoma State University, and Hou Zhenbin, Tongji University Shanghai, China. The proposal is for cooperative research on thermal aspects of manufacturing processes and materials. A variety of manufacturing technologies such as low-pressure CVD diamond coating techniques, magnetic field assisted polishing of advanced ceramics, laser assisted machining of materials, and conventional machining of superalloys will be considered. Advanced materials considered include diamond, ceramics, glasses, and composites. Initiation of investigation on some of these processes is proposed, with the expectation that collaborative work would continue beyond the duration of the award. This award supported under the U.S.-China Cooperative Research Program.

9402895 Komanduri The award is for the development of an integrated approach to the design of equipment for precision finishing of advanced ceramics and glasses based on the magnetic field assisted polishing technique. Experimental and analytical approaches will be taken to develop the science base for the design, construction, and optimization of the equipment used for the polishing. Finite- element based techniques will be used to help select specific magnetic field configurations, and optimization of process parameters will be based on studies of relationships between process parameters and various measures of process performance. A database relating process parameters and process performance will be developed. The finishing techniques to be developed here can be used successfully for efficient finishing of a variety of materials both magnetic and non-magnetic, as material removal rates are at least an order of magnitude higher than conventional polishing techniques. The analytical techniques developed here will facilitate design and optimization of the equipment without reliance on trial and error as is currently the case.

9414610 Komanduri A study will be made of the tribological interactions between fine polishing abrasives and the surface of advanced ceramic materials (alumina and silicon nitride). The chemical and mechanical causes of material removal will be determined in detail to the extent possible by the use of a number of in situ measurement techniques, including tribological testing inside an environmental scanning electron microscope. The results will be used to validate models developed on the basis of fracture mechanics and thermodynamics. ***

9523551 Komanduri Molecular dynamics simulation is done on the temporal and spatial scale of atoms, and solves the equations of Molecular dynamics simulation is done on the temporal and spatial scale of atoms, and solves the equations of motion using the fundamental forces that hold atoms together. This is a memory and time intensive computation that is feasible with today's computer technology. In some fields of science and engineering this simulation approach has been used for a number of years, but molecular dynamics is still relatively new in understanding metal cutting processes. This research focuses on nano machining of various materials with single crystal diamond cutting edges using both a simulation and experimental approach. The molecular dynamics models will include the traditional machining parameters. The detailed scale allows the investigation of subsurface damage and the effects of crystallographic orientation and defect structure. In addition, it is possible to take a new look at the wear of diamond tools when machining iron, and the exit failures that occur when a cutting edge leaves a workpiece. Using a nanometer scale machining setup inside a scanning electron microscope, experiments will be conducted to complement and verify the molecular dynamics modeling predictions. The major impact of this research will be in building the research infrastructure to gain a fundamental understanding of machining at the nano level. This will give a technological edge in the design of processes for micro scale precision components and systems. ***

Malshe
EPS-9977830
This project will establish a distributed Center of Excellence for "Durable Miniaturized Systems." Research on nano and micro systems engineering is leading to fundamental changes in various applications that require miniaturized systems such as automobiles, aerospace vehicles, bio-medicine, informatics, high performance computing, etc. Miniaturized systems affect important areas such as efficiency, portability, cost efficiency, durability, as well as configurability, evolutionary and intelligent decision-making abilities, and real-time interacting. Since surface-to-volume ratio increases significantly in miniaturized systems, performance of these systems depends in large part, on the integration of surfaces and interfaces. Therefore, the research associated with the "durability" of such nano and micro systems is critical insofar as the development of durable miniaturized products is concerned in the coming century. The nature of the distributed activity will be to address various areas of physics, chemistry and engineering in these systems having to do with fabrication processes, systems handling, particulate surface matter, friction and wear, encapsulation and aging. Test structures will be designed, as will novel prototyping and manufacturing methods related to friction and wear of surfaces and interfaces.

The proposed distributed research Center is a collaborative effort in research and education between the University of Arkansas, Fayetteville, the University of Nebraska at Lincoln and Oklahoma State University in Stillwater, which will serve to broaden opportunities for students and researchers to spend time in laboratories and share equipment. Together with establishing a particular research and education program, the project also seeks to establish a successful cross campus management scheme, and build a critical mass of investigators to establish the Center. The program will also include collaborations with Sandia Labs and members of industry.

This grant provides funding for the development of an analytical model and experimental verification of high-speed machining (HSM) of different workmaterials. In specific, thermal modeling of shear localization in HSM will be conducted using different difficult-to-machine materials, such as titanium alloys, nickel-based superalloys, and hardened steels taking into account various heat sources (primary, preheating, and image) using the classical Jeager's stationary and moving heat source models. The onset of shear localization will be predicted based on thermo-mechanical shear instability of different workmaterials. Depending on the thermo-mechanical properties of the workmaterial and the cutting conditions, the cutting speed for the onset of shear instability will be determined. In addition to the conventional machine tools, such as a precision lathe and an NC milling machine, a high-speed spindle (Bryant) (50,000 rpm, 50 hp) will be used for conducting the high-speed machining tests. Attempts will be made to measure the temperature generated in machining under shear localized conditions using either advanced thermally sensitive paints and optical infrared techniques.

Some of the difficult-to-machine materials including titanium alloys, nickel-base superalloys, and hardened steels are challenging materials in the aerospace and aircraft industries. New tool materials and tool geometries are being specifically developed to dramatically increase the productivity in machining. Fundamental knowledge on the nature of chip formation process, forces, energy consumed, tool wear can provide the basis for the implementation of this technology in industry. The PIs would interact with tool manufacturers as well as aircraft and automobile industries on this technology Development of infrastructure and training of qualified graduate and undergraduate students (including the U.S. - born , women, and minorities) can provide the human resources necessary for advancing manufactuirng technologies in the U.S. industry.

This project is on the finishing of balls of advanced ceramics, glasses, and semiconductor material using the magnetic float polishing technology. Conventional finishing of advanced ceramics and glasses by grinding, polishing, lapping generally leads to several defects including large scratches, formation of pits due to the dislodgment of grains, viscous flow of the glassy phase in the case of glass, and surface and subsurface microcracks. These defects affect the properties and performance of these materials and are traditionally removed by subsequent diamond polishing. To address this difficult problem, a "gentle" finishing technology, called the magnetic float polishing was developed (in a recently completed investigation supported by NSF) without the need to use diamond abrasives. Surface finish on the order of 4 nm Ra and 40 nm Rmax with sphericity in the range of 0.25 micrometers were accomplished on Si3N4 balls with a total polishing time of ~ 20 hours. A better understanding of the mechanical and chemo-mechanical actions involved in the polishing of Si3N4 balls has resulted. In this project, the investigators intend to generalize this work to cover other advanced ceramics (balls of different size and number per batch), various glasses, and silicon. Advanced ceramics, such as Si3N4, SiC, Zr02, and Al2O3 are increasing being considered for structural applications of which Si3N4, in specific, is chosen for hybrid ball and roller bearing applications.

Similarly, various types of glasses are used for optical applications, such as lenses and recently spherical silicon balls are being considered for micro-electronic applications (instead of silicon wafers). This research would be the first of its kind on the finishing of silicon balls (instead of wafers) by magnetic float polishing. Thus, the finishing technology proposed is expected to address structural, optical, and electronic applications that can have a significant impact on the manufacture of balls for various advanced technology applications.

The goals of this workshop are: (1) To assess the state-of-the-art and to address the research needs in the thermal aspects of various material removal processes, in view of the rapid advancements in new experimental techniques, numerical methods, and analytical aspects (due to the availability of powerful, inexpensive personal computers); and (2) To provide the thermal basis for addressing "green manufacturing" which is so critical for the protection of the health and safety of the environment and associated personnel of the shop floor.

The focus of the workshop will be thermal aspects of various material removal processes, such as metal cutting, grinding, and polishing. Various experimental, analytical, and numerical techniques will be critically reviewed and research needs and opportunities will be identified.

0217947
Komanduri

Description: This award supports a US-India collaborative research project in mechanical engineering entitled Magnetic Field Assisted Finishing Process. The investigators are Ranga Komanduri of Oklahoma State University (OSU) and Vijay Jain of the Indian Institute of Technology, Kanpur (IITK). The primary focus of their research is the finishing of advanced materials by magnetic field assisted polishing. Their collaborative work will have a direct impact on ultra-precision machining and finishing of advanced materials. This is an area of high current interest and will contribute to fundamental understanding of the ultra-precision machining process.

Scope: The US PI is a recognized leader in the development of magnetic float technology and has established a state-of-the-art research facility at OSU. They have been one of the most active groups in the finishing of advanced materials in the U.S. The Indian PI, an expert in magnetic abrasive finishing processes, is also well recognized for his work in manufacturing. Their collaboration will advance technologies in each of their complementary areas and, by taking advantage of their combined knowledge base, they intend to extend their studies to a new technology, the magnetorheological abrasive flow finishing of advanced materials. This project will support an international experience for a US graduate student and result in stronger cooperation between OSU and the IIT,Kanpur. This project is jointly funded by the Office of International Science and Engineering and the Division of Design, Manufacture, & Industrial Innovation.

This grant provides funding for the development of techniques for the simulation of machining at the atomic level, known as, molecular dynamics (MD) simulation. The following three important areas of simulation that would have a significant impact on our understanding of the cutting process will be considered. They are: (1) simulations of machining at conventional cutting speeds, never before attempted due to long processing times involved with conventional MD simulations, (2) simulations of machining of semiconductor materials, such as silicon, germanium with a diamond tool. Also, included under this category are the simulations of machining of iron with a diamond tool to investigate the chemical nature of wear and simulations of machining of bcc (body centered cubic) and hcp (hexagonal close packed) materials (in addition to fcc (face centered cubic) metals currently being modeled), using the Modified Embedded Atom Method (MEAM), and (3) use of parallel processing in a distributed computing environment (or Beowulf cluster) to significantly reduce the computational time per run so that large size work pieces (up to 1 million atoms) or lower cutting speeds can be considered. The hybrid Molecular Dynamics/Monte Carlo (MD/MC) approach enables addressing of the machining problem at conventional cutting speeds. In MC simulations, time (or the cutting velocity) is not an explicit variable as one is concerned with a series of equilibrium states. However, it is involved indirectly through the temperature in the cutting process. If one knows the temperature distribution at conventional cutting speeds a priori, then this information can be used as an input to the MC moves.

The work proposed under this grant will enable determination of mechanical properties of semiconductor materials at nanoscale for application to microelectromechanical systems (MEMS), and for ultraprecision machining of a wide range of materials (both metals and semiconductor materials). It may be noted that experimental techniques require very expensive high precision, high rigidity machine tools in a temperature controlled environment and costly single crystal diamond tools. The simulations can provide adequate information such that only a few tests to verify the MD simulation results are necessary. The new hybrid MD/MC approach also enables use of larger size workpieces (up to a million atoms) and cutting speeds close to conventional.

0320968

Abstract
There has been a considerable effort in research at Oklahoma State
University (OSU) in recent years in the fields of polymer fatigue, mechanics in the
manufacturing of continuous thin materials, called webs, high-speed machining of
difficult-to-machine materials, finishing of advanced ceramics, and fluid-structure
interactions. It has relied on extensive experimental investigations utilizing advanced
instrumentation. Technologies developed from these researches have been transferred
to industry and have directly benefited sponsoring and other companies, such as
Eastman Kodak, 3M, Imation, Procter & Gamble, ALCOA, Rockwell Automation,
Medtronic, and DuPont; and research findings have been published in leading archival
journals and conferences. To continue research in these fields for the discovery in
science and engineering and for the development of new technologies transferable to
industry, a high-speed digital camera system is needed to investigate the high-speed
mechanics accompanied with the research in these areas. The projects outlined in this
proposal require the ability to observe in situ high-speed phenomena occurring in these
fields. Experiments using the camera will be conducted to investigate the dynamic crack
initiation and propagation at high-speeds in both virgin and fatigue-damaged structural
polymers for the purpose of identifying the onset and the mode of failure; to study high-speed
mechanical slitting processes of plastic and metallic webs; to study the
mechanisms of high-speed machining processes of advanced materials; to study the
mechanisms of material removal in magnetic-field-assisted ceramic polishing processes;
to study the interaction of thin films (solid) and turbulent air (fluid) in web manufacturing
processes; to examine blade structural response and aerodynamic damping in
turbomachine compressors; and to study the high-speed winding of webs.
The availability of high-speed digital camera will greatly enhance the
research infrastructure at OSU, as well as develop research infrastructure in Oklahoma,
an EPSCoR state, to enhance research competitiveness of the state; it will also help
support productive research that will continuously benefit the U.S. industry, especially
the web material industry through the Web Handling Research Center, the only center
on web handling in the world, that is sponsored by 17 U.S. companies.

The objective of the proposed research is to present an integrated approach for conducting simulations at the atomistic level using ab initio quantum mechanical potential-energy surfaces and force fields computed at high-level with extended basis sets. The approach involves (1) electronic structure calculations (using GAUSSIAN 2003 software) of non-equilibrium clusters within the cut-off radius of a material, (2) sampling of the subset of the system configuration space that is important in the dynamics using MD methods augmented with novelty sampling procedures, and (3) accurate interpolation between the computed points using neural network (NN) with early stopping and regularization methods employed to improve network performance. The accuracy of the method will be tested and validated in wide range of manufacturing processing including nanometric cutting, tribology, and material testing. This approach will be extended this to other applications involving carbon nanotubes and synthesis of microcrystalline diamond by chemical vapor deposition (CVD).

Molecular dynamics (MD) and Monte Carlo (MC) simulations can be applied for modeling a wide range of manufacturing processes including ultraprecision machining, grinding, and polishing as well as materials testing, and tribology. The method proposed is a generalized method in that it can be applied for a wide range of fields in engineering as well as in basic chemistry, physics, biology, and other scientific fields of endeavor. This problem will be addressed by an interdisciplinary group of researchers from chemistry, electrical engineering, and mechanical engineering, math and materials science background working with graduate and undergraduate (through NSF REU program) students from these disciplines. Research conducted will be fully integrated with the graduate level education. We intend to interact with industry and national laboratories involved in this area. Attempts will be made to recruit U.S. born women, minority, and physically impaired students to work on this project.

This MRI grant supports the acquisition of an Interfacial Force Microscope (IFM). The IFM uses self-balanced force sensor so that force can be measured precisely as its measurement is independent of displacement measurement. The IFM is capable of probing the thermo-mechanical behavior of such materials as polymers and nano-structured materials from atomistic to micrometer scales with a force range between 1 nN and 500microN over a range of temperatures. The new equipment will allow the characterization of the Young's relaxation modulus in the matrix near fibers or nanoparticles and the nano-necks in nanofoams, and interfacial strength at the interface of nanoparticle/matrix and the bonding strength of adhesives at different temperatures. The equipment will also enable investigation of the short-range forces in crystal imperfections, nanosliding and nanotribology, nanoscale crack initiation and propagation, and cohesive traction separation law. The acquisition of the IFM will enhance the research competitiveness of the State of Oklahoma. The IFM will be used in research studies and in laboratory demonstration for both undergraduate and graduate students. The instrument will be included as part of the research facilities for use by researchers and graduate students on the Oklahoma NanoNet.

The objective of this research project is to address the following issues involved in the predictive modeling and real-time monitoring of chemical mechanical planarization/polishing (CMP) process used in the finishing of semiconductor chips: the interaction of chemical and mechanical phenomena at the silicon wafer-pad interface, the effect of machine vibrations, forces, temperature profiles, and acoustic emission signals, and the modeling of nonlinear stochastic process-machine interactions that capture the dynamic relationships between the wafer-pad interactions and the response of the sensor signals. Both experimental and analytical investigations will be undertaken to address these issues. A production machine will be instrumented with an array of heterogeneous sensors, including force, temperature, vibration, and acoustic emission (both wired and wireless). A sensor fusion approach will be used to monitor various stages of the process. The complex relationships connecting machine-specific and material-specific parameters with performance variables, namely, removal rate and planarity will be delineated by the application of a suite of statistical analysis methods applied to the experimental data. The mechanical and chemical interactions at the wafer-pad interface at various temperatures will be determined by developing a thermal model using Jaeger's classical heat source theory, Gibbs free-energy minimization, and molecular dynamics modeling.

Productivity gains in the finishing of semiconductor devices depend on advances in chemical mechanical planarization/polishing. Wafer sizes, device density, feature dimensions, surface quality, and defect structure are posing serious challenges to the science and technology of chemical mechanical planarization/polishing . This investigation, if successful, will yield deeper insights into various chemo-mechanical interactions and will integrate a heterogeneous sensor network for improving productivity and integrated circuit quality.

The objective of this Small Grant for Exploratory Research (SGER) project is to apply (probabilistic) decision theory to find a quantitative relationship that connects the measured sensor signal features with the dynamic state and the material removal rate in chemical mechanical planarization process for end-point detection and control. The approach will be to use a sequential Bayesian model to estimate at each time step the state of the process from the measured vibration and other sensor signals. A utility function (of the process state and decisions) will be defined, and evaluated at each time step. A decision on whether to stop the machine or to continue polishing will be made at every time step based on the alternative that minimizes the expected utility. The research will combine the complementary expertise of the PIs in chemical mechanical polishing science, sensors and signal analysis, and Bayesian decision theory.

If successful, the exploratory effort will introduce a radically new approach, rooted in decision theory, for real-time prediction and control of quality and productivity in semiconductor manufacturing processes. This methodology can be extended to prediction and control of quality and performance in other ultra-precision manufacturing processes and complex systems. The sensor-networked polishing machine can serve as a test bed for instruction and training of students as well as industry personnel. This research will be integrated with the PIs' graduate courses. The PIs will continue to involve undergraduate and graduate students from underrepresented groups as part of their research. They will be exposed to fundamental multi-disciplinary research and industry practices in advanced manufacturing processes. The research highlights will be made available in the PIs' website and published in various journals, trade magazines, and conference proceedings.

This grant provides support for a workshop on Sensing and Prognostics for Scalability of Nanomanufacturing. The goal of the proposed workshop is to develop a national agenda and a road map for sensing and prognostics research to address the quality and reliability issues encountered in scaling up lab-based nano processes to high volume nanomanufacturing. It will bring together academic experts, industry and national laboratory leaders, and government policy makers to look at currently available field data and to develop a research agenda. Current research is focused on the science and engineering of the nano processes and there is an urgent need to address production issues now in order for high-rate/high-volume nanomanufacturing to become a reality. The outcomes of the workshop can be used nationwide to promote sensing and quality/reliability programs in nanomanufacturing and to stimulate related research activities.

The expected outcomes of the workshop are an examination of the current landscape and research in nanomanufacturing so as to identify the sensing and quality/reliability research needs in nanomanufacturing and the development of a national agenda and roadmap for nano sensing and quality/reliability research in nanomanufacturing. This will allow for the field to move from the lab to commercialization. The results will be widely disseminated.

The objective of this research is to apply the principles of multi-sensor fusion and decision theory for deriving quantitative relationships connecting signal features from various sensors, including, force, temperature, vibration, and others, gathered during chemical mechanical planarization of microelectronics wafers, with specific defect evolutions, towards real-time surface defect mitigation and process control. The approach will be to first induce certain basic defect patterns on wafers, such as indentation, scratching using nanoindentation and nanoscratching techniques. These wafers then will be polished on a chemical mechanical planarization machine instrumented with multiple wireless microelectromechanical systems sensors. It is anticipated that an archive of defect-sensitive sensor features for different defects generated in chemical mechanical planarization will be developed. Decision theory will be used to predict and control the defects. The control action (for example, specific adjustment of down force and platen speed) at each time-epoch will be estimated by maximizing a utility function, so that the control actions are robust to noise. The chemical mechanical planarization platform will be equipped with multiple wired- and wireless-microelectromechanical systems-based sensors, where possible, to monitor temperature, vibrations, chemistry (pH), and forces for defect detection and mitigation.

If successful, this research will facilitate industry adoption of micro-electromechanical systems sensor-based approaches to address defects and such critical impediments to wafer yield. The sensor-networked chemical mechanical planarization platform can be used as a test bed for instruction and training of students and industry personnel. The Principal Investigators have a track record for attracting students from diverse backgrounds, and plan to work with local minority institutions to recruit qualified students into this research project. The students will be exposed to fundamental multi-disciplinary research and industry practices in advanced manufacturing processes through mutual visits between university and industry. The highlights of the research will be made available on the website of the Principal Investigators and the results will be published in various journals, trade magazines, and presentations at national and international conferences.

Under this Major Research Instrumentation (MRI) project, Oklahoma State University High Performance Computing Center (OSUHPCC) will acquire, deploy and maintain an HPC cluster supercomputer, to be named Cowboy, that will support computing-intensive research and research training across a broad variety of Science, Technology, Engineering and Mathematics (STEM) disciplines. As a campus-wide shared resource, Cowboy will be available not only to all of OSU's faculty, staff, postdocs, graduate students and undergraduates, but to researchers across Oklahoma.

Many areas of Computational and Data-Enabled Science and Engineering (CDESE) research will be facilitated by the proposed system by collaborating research teams with an expected doubling of the number of users every 12 months based on experience to date. Projects include: mechanics of granular materials and fracture simulations in nuclear clad materials; discovery genes for canine hip dysplasia; improvements to performance per Watt of many-core systems; transcriptional profiling of determination events in adult and embryonic murine stem cell lines; genomic, metagenomic and proteomic approaches to decipher host- pathogen interactions, complex carbohydrate metabolism and cellulosic bioenergy; modeling geophysical fluids; computational chemistry; simulations of nanostructured materials; simulation of the growth of carbon nanotubes; simulating gas-phase and condensed-phase materials; seismic characterization of surface geology; computational optimization; optimal error-control coding and compressive sensing techniques; charge, spin and heat transport; molecular phylogeny of the Asteraceae; evolutionary genetics of morphological diversification and domestication in grasses (Poaceae) and mustards (Brassicaceae); robust electromagnetic field testing; phylogenomic analyses of the extremophile red alga Galdieria sulphuraria; integrating data in evolving social networks; computational and combinatorial methods in commutative algebra; microbes associated with non-cultivated and cultivated plants; intensity-modulated radiation therapy planning software; and phylogenomics of milkweeds (Asclepias, Apocynaceae).

Oklahoma users are at 24 institutions, including 11 of Oklahoma's 13 public universities. The Oklahoma Supercomputing Symposium (MRI PI Brunson is 2011 Conference Co-Chair), the only event of its kind held annually in an EPSCoR jurisdiction, in 8 years has had over 2000 attendees from 92 academic institutions in 24 states and Puerto Rico (including 33 in Oklahoma and 26 in 12 other EPSCoR jurisdictions), 97 private companies, 31 government agencies and 14 nonprofits. This project includes seven women senior personnel who serve as role models and are creating interest and excitement about computational science and engineering. This project also includes participation of two researchers at Langston University, Oklahoma's sole Historically Black University. Research projects include 80 graduate students and 29 undergraduates, including 29 women, an African American, three Native Americans and three Hispanics.

The research objective of this award is to develop a new approach to effectively capture the underlying nonlinear and nonstationary evolution of the multi-dimensional process states in Chemical Mechanical Planarization (CMP) process, to enable early defect detection of pattern dependent surface topography in CMP, i.e., dishing/erosion. The proposed research will: (1) establish the fundamental relationships that connect process abnormalities in CMP with extracted features from online sensor signals, i.e., a mapping between the sensor features with the evolving dishing and erosion, thus, to enable early detection of surface topography related defects; and (2) create a new online predictive model with a novel recurrent nested Dirichlet process (RNDP) model which has a non-parametric property and data-driven nature, and can accurately capture CMP process nonlinearity/nonstationarity and avoid the possible model over- and under-fitting.

If successful, this research will result in a technological breakthrough that can fully utilize/integrate the CMP process data and thus enable early defect detection/alleviation for wafer yield improvement. It is anticipated that this proposal would generate significant contributions toward promoting the technological advances in process monitoring and control for semiconductor industry, leading to a better product (IC) quality and higher process productivity for the CMP process. The new curricula, REU, combined with undergraduate and graduate student mentoring programs, will attract potential students, especially from underrepresented groups, to engineering related research and education by exposing students to both fundamental research and industry practices. Dissemination of research outcomes includes professional presentations and publications, website development, media outreach and student publications, as well as collaboration with industry partners.