☰ E-Tree

King-ning Tu

Affiliations:	1968-1993	Materials Science	IBM Thomas J. Watson Research Center, Yorktown Heights, NY, United States
	1993-2016	Materials Science & Engineering	University of California, Los Angeles, Los Angeles, CA
	2012-	Materials and Electrical Engineering	City University of Hong Kong, Kowloon, Hong Kong
	2016-		National Chiao Tung University, Taiwan

Area:

3D IC packaging and joule heating, metal-silicon interfaces, electromigration, pb-free solder joints

Website:

https://www.ee.cityu.edu.hk/~kntu/

Google:

Bio:

http://www.seas.ucla.edu/ethinfilm/professor.html
https://www.ee.ucla.edu/king-ning-tu/
https://ui.adsabs.harvard.edu/abs/1968PhDT.........8T/abstract
DOI: 10.1016/0001-6160(67)90214-3

Tree Publications Similar researchers PubMed Report error

Parents

David Turnbull	grad student	1968	Harvard (Chemistry Tree)
(Morphology and Kinetics of Cellular Precipitation)

Children

Taekyeong Lee	grad student	2001	UCLA
Peter S. Nam	grad student	2001	UCLA
Woojin Choi	grad student	2002	UCLA
Hua Gan	grad student	2004	UCLA
Shengquan Ou	grad student	2005	UCLA
Minyu Yan	grad student	2005	UCLA
Annie T. Huang	grad student	2006	UCLA
Fei Ren	grad student	2006	UCLA
Jongook Suh	grad student	2006	UCLA
Fan-Yi Ou Yang	grad student	2007	UCLA
Kuo-Chang Lu	grad student	2008	UCLA
Di Xu	grad student	2009	UCLA
Hsin-Ping Chen	grad student	2010	UCLA
Yi-Chia Chou	grad student	2010	UCLA
Daechul Choi	grad student	2011	UCLA

Collaborators

BETA: Related publications

Publications

You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect.
Chou YC, Chen LJ, Tu KN. (2022) Uphill Diffusion Induced Point Contact Reaction in Si Nanowires. Nano Letters
Li YJ, Tu KN, Chen C. (2020) Tensile Properties of <111>-Oriented Nanotwinned Cu with Different Columnar Grain Structures. Materials (Basel, Switzerland). 13
Li YJ, Hsu CW, Ting YH, et al. (2020) Deformation induced columnar grain rotation in nanotwinned metals Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 797: 140045
Thompson RD, Gupta D, Tu KN. (2019) Low-temperature diffusion and solubility of Ni in P-doped Czochralski-grown Si. Physical Review. B, Condensed Matter. 33: 2636-2641
Shen YA, Zhou S, Li J, et al. (2019) Thermomigration induced microstructure and property changes in Sn-58Bi solders Materials & Design. 166: 107619
Juang JY, Lu CL, Chen KJ, et al. (2018) Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient. Scientific Reports. 8: 13910
Tseng CH, Tu KN, Chen C. (2018) Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding. Scientific Reports. 8: 10671
Chang YW, Cheng Y, Helfen L, et al. (2017) Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation. Scientific Reports. 7: 17950
Annuar S, Mahmoodian R, Hamdi M, et al. (2017) Intermetallic compounds in 3D integrated circuits technology: a brief review. Science and Technology of Advanced Materials. 18: 693-703
Chu DT, Chu Y, Lin J, et al. (2017) Growth competition between layer-type and porous-type Cu 3 Sn in microbumps Microelectronics Reliability. 79: 32-37

See more...