Jin Yao, Ph.D.

Affiliations: 
2007 University of California, Berkeley, Berkeley, CA, United States 
Area:
Si photonics, optoelectronics, nanophotonics, optical MEMS, Optofluidics; Micro/Nano Electro Mechanical Systems (MEMS); Physical Electronics (PHY)
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"Jin Yao"

Parents

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Ming C. Wu grad student 2007 UC Berkeley
 (Tunable optical microresonators with micro-electro-mechanical-system (MEMS) integration.)
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Publications

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Bovington J, Zheng X, Djordjevic SS, et al. (2017) III–V/Si Vernier-Ring Comb Lasers (VRCLs) Ieee Journal of Selected Topics in Quantum Electronics. 23: 15-22
Evans GA, Butler JK, He R, et al. (2017) Enhanced Coupling Strength Gratings for Couplers in III–V Compound Dielectric Waveguides Journal of Lightwave Technology. 35: 2234-2242
Lin S, Zheng X, Yao J, et al. (2016) Efficient, tunable flip-chip-integrated III-V/Si hybrid external-cavity laser array. Optics Express. 24: 21454-21462
Lee DY, Zheng X, Yao J, et al. (2016) Error-free operation of a polarization-insensitive 4λ x 25 Gbps silicon photonic WDM receiver with closed-loop thermal stabilization of Si microrings. Optics Express. 24: 13204-13209
Luo Y, Zheng X, Lin S, et al. (2016) A Process-Tolerant Ring Modulator Based on Multi-Mode Waveguides Ieee Photonics Technology Letters. 28: 1391-1394
Zheng X, Shubin I, Lee J, et al. (2016) III-V/Si Hybrid Laser Arrays Using Back End of the Line (BEOL) Integration Ieee Journal of Selected Topics in Quantum Electronics. 22: 204-217
Lee JH, Lee DY, Shubin I, et al. (2016) III-V/Si hybrid laser stabilization using micro-ring feedback control Ieee Photonics Journal
Shubin I, Zheng X, Thacker H, et al. (2015) Microring-based multi-chip WDM photonic module. Optics Express. 23: 13172-84
Thacker HD, Zheng X, Lexau J, et al. (2015) An all-solid-state, WDM silicon photonic digital link for chip-to-chip communications. Optics Express. 23: 12808-22
Lee JH, Bovington J, Shubin I, et al. (2015) Demonstration of 12.2% wall plug efficiency in uncooled single mode external-cavity tunable Si/III-V hybrid laser. Optics Express. 23: 12079-88
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