Kaustav Banerjee
Affiliations: | Electrical & Computer Engineering | University of California, Santa Barbara, Santa Barbara, CA, United States |
Area:
Computer Engineering/ Electronics & PhotonicsGoogle:
"Kaustav Banerjee"Children
Sign in to add trainee| Sheng-Chih Lin | grad student | 2007 | UC Santa Barbara |
| Navin Srivastava | grad student | 2009 | UC Santa Barbara |
| Hamed F. Dadgour | grad student | 2010 | UC Santa Barbara |
| Seid H. Rasouli | grad student | 2011 | UC Santa Barbara |
| Chuan Xu | grad student | 2012 | UC Santa Barbara |
| Yasin Khatami | grad student | 2013 | UC Santa Barbara |
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Cao W, Bu H, Vinet M, et al. (2023) The future transistors. Nature. 620: 501-515 |
| Cao W, Banerjee K. (2020) Author Correction: Is negative capacitance FET a steep-slope logic switch? Nature Communications. 11: 1094 |
| Cao W, Banerjee K. (2020) Is negative capacitance FET a steep-slope logic switch? Nature Communications. 11: 196 |
| Pal A, Cao W, Banerjee K. (2020) A Compact Current-Voltage Model for 2-D-Semiconductor-Based Lateral Homo-/Hetero-Junction Tunnel-FETs Ieee Transactions On Electron Devices. 1-9 |
| Cao W, Huang M, Yeh C, et al. (2020) Impact of Transport Anisotropy on the Performance of van der Waals Materials-Based Electron Devices Ieee Transactions On Electron Devices. 67: 1310-1316 |
| Xu C, Kolluri SK, Endo K, et al. (2020) Correction to “Analytical Thermal Model for Self-Heating in Advanced FinFET Devices With Implications for Design and Reliability” Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 39: 277-277 |
| Jiang J, Parto K, Cao W, et al. (2019) Ultimate Monolithic-3D Integration With 2D Materials: Rationale, Prospects, and Challenges Ieee Journal of the Electron Devices Society. 7: 878-887 |
| Cao W, Jiang J, Xie X, et al. (2018) 2-D Layered Materials for Next-Generation Electronics: Opportunities and Challenges Ieee Transactions On Electron Devices. 65: 4109-4121 |
| Hu Y, Brus V, Cao W, et al. (2017) Understanding the Device Physics in Polymer-Based Ionic-Organic Ratchets. Advanced Materials (Deerfield Beach, Fla.) |
| Jiang J, Kang J, Cao W, et al. (2016) Intercalation Doped Multilayer-Graphene-Nanoribbons for Next-Generation Interconnects. Nano Letters |