Keith L. Rogers, Ph.D.

Affiliations: 
2005 University of Maryland, College Park, College Park, MD 
Area:
Packaging Engineering
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"Keith Rogers"

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Michael G. Pecht grad student 2005 University of Maryland
 (An analytical and experimental investigation of filament formation in glass/epoxy composites.)
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Publications

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Deng Y, Pecht M, Rogers K. (2006) Analysis of Phosphorus Flame Retardant Induced Leakage Currents in IC Packages Using SQUID Microscopy Ieee Transactions On Components and Packaging Technologies. 29: 804-808
Rogers KL, Pecht MG. (2006) A variant of conductive filament formation failures in PWBs with 3 and 4 mil spacings Circuit World. 32: 11-18
Rogers K, Hillman C, Pecht M. (2001) Hollow Fibers Can Accelerate Conductive Filament Formation Practical Failure Analysis. 1: 57-60
Pecht M, Hillman C, Rogers K, et al. (1999) Conductive filament formation: a potential reliability issue in laminated printed circuit cards with hollow fibers Ieee Transactions On Electronics Packaging Manufacturing. 22: 80-84
Hillman C, Rogers K, Dasgupta A, et al. (1999) Solder failure mechanisms in single‐sided insertion‐mount printed wiring boards Circuit World. 25: 28-38
Rogers K, Hillman C, Pecht M, et al. (1999) Conductive filament formation failure in a printed circuit board Circuit World. 25: 6-8
Pecht M, Rogers K, Fowler A. (1998) Characterization of a non‐woven randomly dispersed short fiber laminate Circuit World. 24: 34-37
Shukla A, Pecht M, Jordan J, et al. (1997) Hollow Fibres in PCB, MCM‐L and PBGA Laminates May Induce Reliability Degradation Circuit World. 23: 5-6
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