Vidyullatha Challa, Ph.D.
Affiliations: | 2010 | Mechanical Engineering | University of Maryland, College Park, College Park, MD |
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"Vidyullatha Challa"Parents
Sign in to add mentor| Michael G. Pecht | grad student | 2010 | University of Maryland | |
| (Effect of joule heating on the reliability of stamped metal land grid array sockets.) | ||||
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| Challa V, Rundle P, Pecht M. (2013) Challenges in the qualification of electronic components and systems Ieee Transactions On Device and Materials Reliability. 13: 26-35 |
| Challa V, Lopez LD, Osterman M, et al. (2010) Stress relaxation testing of stamped metal land-grid-array sockets Ieee Transactions On Device and Materials Reliability. 10: 55-61 |
| Challa V, Pecht M, Liu S, et al. (2010) A verification of application specific component qualification Proceedings - 2010 11th International Conference On Electronic Packaging Technology and High Density Packaging, Icept-Hdp 2010. 1265-1268 |
| Lopez LD, Challa V, Pecht MG. (2009) Assessing the reliability of elastomer sockets in temperature environments Ieee Transactions On Device and Materials Reliability. 9: 80-86 |
| Challa V, Torres M, Osterman M, et al. (2008) Stress relaxation in a commercial stamped metal land grid array socket Proceedings - Electronic Components and Technology Conference. 2139-2144 |
| Challa V, Osterman M, Pecht M, et al. (2008) Temperature rise measurement due to joule heating in a stamped metal land grid array socket Proceedings - 2008 International Symposium On Microelectronics, Imaps 2008. 876-882 |