Avram Bar-Cohen
Affiliations: | Mechanical Engineering | Ben-Gurion University of the Negev, Be'er Sheva, South District, Israel | |
Mechanical engineering | University of Minnesota, Twin Cities, Minneapolis, MN | ||
University of Maryland, College Park, College Park, MD |
Area:
Mechanical Engineering, Electronics and Electrical EngineeringWebsite:
https://calce.umd.edu/professor-avram-bar-cohenGoogle:
"Avram Markowitz" OR "Avram Bar-Cohen"Bio:
(1946 - 2020)
aka Avram Markowitz
https://ipst.umd.edu/people/avram-bar-cohen
DOI: 10.1109/TCPMT.2021.3101276
https://www.researchgate.net/publication/355750069_A_Tribute_Prof_Avram_Bar-Cohen
Bar-Cohen, Avram, Boiling and condensation in a liquid-filled enclosure, Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1971.
Children
Sign in to add traineeGary Solbrekken | grad student | 2003 | UMN (Chemistry Tree) |
Raj Bahadur | grad student | 2005 | University of Maryland |
Ihab A. Ali | grad student | 2010 | University of Maryland |
Emil Rahim | grad student | 2011 | University of Maryland |
Jessica R. Sheehan | grad student | 2012 | University of Maryland |
Juan G. Cevallos | grad student | 2014 | University of Maryland |
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Publications
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Bar-Cohen A, Maurer JJ, Altman DH. (2019) Embedded Cooling for Wide Bandgap Power Amplifiers: A Review Journal of Electronic Packaging. 141 |
Khanna S, McCluskey P, Bar-Cohen A, et al. (2017) Thin Thermally Efficient ICECool Defense Semiconductor Power Amplifiers Journal of Microelectronics and Electronic Packaging. 14: 77-93 |
Deisenroth DC, Moradi R, Shooshtari AH, et al. (2017) Review of Heat Exchangers Enabled by Polymer and Polymer Composite Additive Manufacturing Heat Transfer Engineering. 39: 1648-1664 |
Manno M, Yang B, Bar-Cohen A. (2017) Near-junction “hot spot” suppression with integral SiC microcontact TEC International Journal of Heat and Mass Transfer. 115: 530-536 |
Kim DS, Holloway C, Han B, et al. (2016) Method for predicting junction temperature distribution in a high-power laser diode bar. Applied Optics. 55: 7487-7496 |
Bulman G, Barletta P, Lewis J, et al. (2016) Superlattice-based thin-film thermoelectric modules with high cooling fluxes. Nature Communications. 7: 10302 |
Bar-Cohen A, Maurer JJ, Sivananthan A. (2016) Near-Junction Microfluidic Cooling for Wide Bandgap Devices Mrs Advances. 1: 181-195 |
Fish M, McCluskey P, Bar-Cohen A. (2016) Modeling thermal microspreading resistance in via arrays Journal of Electronic Packaging, Transactions of the Asme. 138 |
Cevallos J, Bar-Cohen A, Deisenroth DC. (2016) Thermal performance of a polymer composite webbed-tube heat exchanger International Journal of Heat and Mass Transfer. 98: 845-856 |
Manno M, Yang B, Bar-Cohen A. (2015) Non-contact method for characterization of small size thermoelectric modules. The Review of Scientific Instruments. 86: 084701 |