Avram Bar-Cohen
Affiliations: | Mechanical Engineering | University of Maryland, College Park, College Park, MD |
Area:
Mechanical Engineering, Electronics and Electrical EngineeringGoogle:
"Avram Bar-Cohen"Children
Sign in to add trainee| Raj Bahadur | grad student | 2005 | University of Maryland |
| Ihab A. Ali | grad student | 2010 | University of Maryland |
| Emil Rahim | grad student | 2011 | University of Maryland |
| Jessica R. Sheehan | grad student | 2012 | University of Maryland |
| Juan G. Cevallos | grad student | 2014 | University of Maryland |
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Publications
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| Serafy C, Srivastava A, Bar-Cohen A, et al. (2015) Design space exploration of 3D CPUs and micro-Fluidic heatsinks with thermo-electrical-physical co-optimization Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 1 |
| Serafy C, Bar-Cohen A, Srivastava A, et al. (2015) Unlocking the True Potential of 3-D CPUs With Microfluidic Cooling Ieee Transactions On Very Large Scale Integration (Vlsi) Systems |
| Rahim E, Bar-Cohen A. (2015) Thermal characteristics of a chip-scale two-phase microgap cooler Heat Transfer Engineering. 36: 511-520 |
| Sharar DJ, Bergles AE, Jankowski NR, et al. (2014) Non-intrusive optical validation of two-phase flow regimes in a small diameter tube Asme 2014 12th International Conference On Nanochannels, Microchannels, and Minichannels, Icnmm 2014, Collocated With the Asme 2014 4th Joint Us-European Fluids Engineering Division Summer Meeting |
| Devoto D, Paret P, Mihalic M, et al. (2014) Thermal performance and reliability characterization of bonded interface materials (BIMs) Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 409-417 |
| Via GD, Felbinger JG, Blevins J, et al. (2014) Wafer-scale GaN HEMT performance enhancement by diamond substrate integration Physica Status Solidi (C) Current Topics in Solid State Physics. 11: 871-874 |
| Bar-Cohen A, Holloway CA. (2014) Thermal science and engineering - From macro to nano in 200 years Proceedings of the 15th International Heat Transfer Conference, Ihtc 2014 |
| Bar-Cohen A, Srivastava A, Shi B. (2013) Thermo-electrical co-design of three-dimensional integrated circuits: Challenges and opportunities Computational Thermal Sciences. 5: 441-458 |
| Sharar DJ, Jankowski NR, Bar-Cohen A. (2013) Modified model for improved flow regime prediction in internally-grooved tubes Asme 2013 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2013. 2 |
| Manno M, Wang P, Bar-Cohen A. (2013) Anticipatory thermoelectric cooling of a transient germanium hotspot Asme 2013 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2013. 2 |