Daniel Rosales-Yeomans, Ph.D.
Affiliations: | 2007 | Chemical Engineering | University of Arizona, Tucson, AZ |
Area:
Chemical Engineering, Materials Science Engineering, Environmental EngineeringGoogle:
"Daniel Rosales-Yeomans"Cross-listing: Envirotree
Parents
Sign in to add mentorAra Philipossian | grad student | 2007 | University of Arizona | |
(Evaluation and modeling of novel groove pad designs on inter-layer dielectric and copper chemical mechanical planarization.) |
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Publications
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Rosales-Yeomans D, Lee H, Suzuki T, et al. (2012) Effect of concentric slanted pad groove patterns on slurry flow during chemical mechanical planarization Thin Solid Films. 520: 2224-2232 |
DeNardis D, Rosales-Yeomans D, Borucki L, et al. (2010) Studying the effect of temperature on the copper oxidation process using hydrogen peroxide for use in multi-step chemical mechanical planarization models Thin Solid Films. 518: 3903-3909 |
DeNardis D, Rosales-Yeomans D, Borucki L, et al. (2010) A three-step copper chemical mechanical planarization model including the dissolution effects of a commercial slurry Thin Solid Films. 518: 3910-3916 |
Rosales-Yeomans D, DeNardis D, Borucki L, et al. (2008) Evaluation of Pad Groove Designs under Reduced Slurry Flow Rate Conditions during Copper CMP Journal of the Electrochemical Society. 155 |
Rosales-Yeomans D, DeNardis D, Borucki L, et al. (2008) Analysis of pads with slanted grooves for copper CMP Journal of the Electrochemical Society. 155 |
Rosales-Yeomans D, Denardis D, Borucki L, et al. (2008) Design and evaluation of pad grooves for copper CMP Journal of the Electrochemical Society. 155 |
Zhuanga Y, Borucki L, Philipossian A, et al. (2007) Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization Transactions On Electrical and Electronic Materials. 8: 53-57 |
Rosales-Yeomans D, Borucki L, Doi T, et al. (2006) Implications of wafer-size scale-up on frictional, thermal, and kinetic attributes of interlayer dielectric CMP process Journal of the Electrochemical Society. 153 |
Philipossian A, Rosales-Yeomans D. (2006) The spectral fingerprints and the sounds of chemical mechanical planarization processes Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers. 45: 1553-1559 |
Rosales-Yeomans D, Doi T, Kinoshita M, et al. (2005) Effect of pad groove designs on the frictional and removal rate characteristics of ILD CMP Journal of the Electrochemical Society. 152 |