Hyo-Sang Lee, Ph.D.
Affiliations: | 2008 | Chemical Engineering | University of Arizona, Tucson, AZ |
Area:
Chemical EngineeringGoogle:
"Hyo-Sang Lee"Parents
Sign in to add mentorAra Philipossian | grad student | 2008 | University of Arizona | |
(Characterization and modeling of mainstream and alternative conditioning and polishing technologies in inter-layer dielectric and copper chemical mechanical planarization.) |
BETA: Related publications
See more...
Publications
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
Rosales-Yeomans D, Lee H, Suzuki T, et al. (2012) Effect of concentric slanted pad groove patterns on slurry flow during chemical mechanical planarization Thin Solid Films. 520: 2224-2232 |
Lee H, Zhuang Y, Borucki L, et al. (2010) Investigation of pad staining and its effect on removal rate in copper chemical mechanical planarization Thin Solid Films. 519: 259-264 |
Lee H, Zhuang Y, Sugiyama M, et al. (2010) Pad flattening ratio, coefficient of friction and removal rate analysis during silicon dioxide chemical mechanical planarization Thin Solid Films. 518: 1994-2000 |
Lee H, Borucki L, Zhuang Y, et al. (2009) Analysis of formation of pad stains in copper chemical mechanical planarization Japanese Journal of Applied Physics. 48 |
Borucki L, Lee H, Zhuang Y, et al. (2009) Theoretical and experimental investigation of conditioner design factors on tribology and removal rate in copper chemical mechanical planarization Japanese Journal of Applied Physics. 48 |
Lee H, DeNardis D, Philipossian A, et al. (2007) Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP Transactions On Electrical and Electronic Materials. 8: 67-72 |
Zhuanga Y, Borucki L, Philipossian A, et al. (2007) Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization Transactions On Electrical and Electronic Materials. 8: 53-57 |
Lee H, DeNardis D, Philipossian A, et al. (2007) Development of a Pad Conditioning Method for ILD CMP using a High Pressure Micro Jet System Transactions On Electrical and Electronic Materials. 8: 26-31 |
Boruckia L, Zhuang Y, Kikuma R, et al. (2007) Diamond Conditioner Wear Characterization for a Copper CMP Process Transactions On Electrical and Electronic Materials. 8: 15-20 |
Lee H, Ara P, Suryadevara VB, et al. (2007) Study of Inhibition Characteristics of Slurry Additives in Copper CMP using Force Spectroscopy Transactions On Electrical and Electronic Materials. 8: 5-10 |