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Huy N. Phan, Ph.D.

Affiliations: 
2011 Mechanical Engineering University of Texas at Arlington, Arlington, TX, United States 
Area:
Mechanical Engineering, Electronics and Electrical Engineering, Packaging Engineering
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"Huy Phan"
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Dereje Agonafer grad student 2011 UT Arlington
 (Development of an experimental and analytical model of an active cooling method for high-power three-dimensional integrated circuit (3D-IC) utilizing multidimensional configured thermoelectric modules.)

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Publications

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Phan HN, Agonafer D. (2011) Thermoelectric cooling analysis using modified-graphical-method for multidimensional-heat-transfer-system Journal of Electronic Packaging, Transactions of the Asme. 133
Phan HN, Agonafer D. (2010) Response time analysis of an active cooling method for 3D-ICs utilizing multidimensional configured thermoelectric coolers Journal of Microelectronics and Electronic Packaging. 7: 73-78
Phan HN, Agonafer D. (2010) Thermoelectric cooling analysis using modified graphical method Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 33-37
Phan HN, Agonafer D. (2010) Experimental analysis model of an active cooling method for 3D-ICs utilizing multidimensional configured thermoelectric coolers Journal of Electronic Packaging, Transactions of the Asme. 132: 0245011-0245014
Phan HN, Agonafer D. (2010) Experimental analysis model of an active cooling method for 3D-ICs utilizing a multidimensional configured thermoelectric Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 55-58
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