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Mahidhar Rayasam, Ph.D.

Affiliations: 
2007 Mechanical Engineering Purdue University, West Lafayette, IN, United States 
Area:
Mechanical Engineering
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"Mahidhar Rayasam"
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Ganesh Subbarayan grad student 2007 Purdue
 (Hierarchical partition of unity constructions for multiscale design optimization of heterogeneous objects.)

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Lin HY, Rayasam M, Subbarayan G. (2015) ISOCOMP: Unified geometric and material composition for optimal topology design Structural and Multidisciplinary Optimization. 51: 687-703
Rayasam M, Chaparala S, Farnam D, et al. (2009) Thermal solution maps: A strategy for thermal design of three-dimensional packages Journal of Electronic Packaging, Transactions of the Asme. 131: 0110151-0110159
Kanuparthi S, Rayasam M, Subbarayan G, et al. (2009) Hierarchical field compositions for simulations of near-percolation thermal transport in particulate materials Computer Methods in Applied Mechanics and Engineering. 198: 657-668
Zhang X, Rayasam M, Subbarayan G. (2007) A meshless, compositional approach to shape optimal design Computer Methods in Applied Mechanics and Engineering. 196: 2130-2146
Rayasam M, Srinivasan V, Subbarayan G. (2007) CAD inspired hierarchical partition of unity constructions for NURBS-based, meshless design, analysis and optimization International Journal For Numerical Methods in Engineering. 72: 1452-1489
Rayasam M, Subbarayan G. (2006) A three-dimensional solder shape model incorporating top pad inclination and misalignment Journal of Electronic Packaging, Transactions of the Asme. 128: 291-293
Rayasam M, Thompson TB, Subbarayan G, et al. (2006) A model for assessing the shape of solder joints in the presence of PCB and package warpage Journal of Electronic Packaging, Transactions of the Asme. 128: 184-191
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