F Patrick McCluskey
Affiliations: | Mechanical Engineering | University of Maryland, College Park, College Park, MD |
Area:
Mechanical EngineeringGoogle:
"F McCluskey"Children
Sign in to add trainee| Casey J. O'Connor | grad student | 2003 | University of Maryland |
| Yunqi Zheng | grad student | 2005 | University of Maryland |
| Manas R. Dash | grad student | 2006 | University of Maryland |
| Pedro O. Quintero | grad student | 2008 | University of Maryland |
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Publications
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| Li NM, Manoharan S, Das D, et al. (2018) Analysis of indentation measured mechanical properties on Multilayer Ceramic Capacitors (MLCCs) Microelectronics Reliability. 528-533 |
| Manoharan S, Patel C, McCluskey FP, et al. (2018) Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment Microelectronics Reliability. 84: 197-207 |
| Greve H, Moeini SA, McCluskey FP. (2014) Reliability of paste based transient liquid phase sintered interconnects Proceedings - Electronic Components and Technology Conference. 1314-1320 |
| Jankowski NR, McCluskey FP. (2014) A review of phase change materials for vehicle component thermal buffering Applied Energy. 113: 1525-1561 |
| Moeini SA, Greve H, McCluskey FP. (2014) Strength and reliability of high temperature transient liquid phase sintered joints International Conference and Exhibition On High Temperature Electronics, Hitec 2014. 135-143 |
| Greve H, McCluskey FP. (2013) LT-TLPS Die Attach for High Temperature Electronic Packaging Journal of Microelectronics and Electronic Packaging. 2013: 246-253 |
| Greve H, Chen LY, Fox I, et al. (2013) Transient liquid phase sintered attach for power electronics Proceedings - Electronic Components and Technology Conference. 435-440 |
| McCluskey FP. (2013) Keynote: MEMS and MEMS packaging for high temperature and other harsh environments International Conference and Exhibition On Device Packaging 2013. 14 |
| Greve H, McCluskey FP. (2013) High temperature sintered interconnects formed by Transient Liquid Phase Sintering 46th International Symposium On Microelectronics, Imaps 2013. 951-956 |
| Quintero PO, McCluskey FP. (2011) Temperature cycling reliability of high-temperature lead-free die-attach technologies Ieee Transactions On Device and Materials Reliability. 11: 531-539 |