Ja C. Ku, Ph.D.
Affiliations: | 2007 | Northwestern University, Evanston, IL |
Area:
Electronics and Electrical EngineeringGoogle:
"Ja Ku"Parents
Sign in to add mentor| Yehea I. Ismail | grad student | 2007 | Northwestern | |
| (Thermal effects on VLSI circuits and microarchitecture.) | ||||
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Publications
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| Long J, Ku JC, Ogrenci Memik S, et al. (2010) SACTA: A self-adjusting clock tree architecture for adapting to thermal-induced delay variation Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 18: 1323-1336 |
| Ku JC, Ismail Y. (2008) Area optimization for leakage reduction and thermal stability in nanometer-scale technologies Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 27: 241-248 |
| Ku JC, Ismail Y. (2007) Thermal-aware methodology for repeater insertion in low-power VLSI circuits Proceedings of the International Symposium On Low Power Electronics and Design. 86-91 |
| Ku JC, Ismail Y. (2007) Thermal-Aware Methodology for Repeater Insertion in Low-Power VLSI Circuits Ieee Transactions On Very Large Scale Integration Systems. 15: 963-970 |
| Ku JC, Ismail Y. (2007) On the scaling of temperature-dependent effects Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 26: 1882-1888 |
| Long J, Ku JC, Memik SO, et al. (2007) A self-adjusting clock tree architecture to cope with temperature variations Ieee/Acm International Conference On Computer-Aided Design, Digest of Technical Papers, Iccad. 75-82 |
| Ku JC, Ismail Y. (2007) Attaining thermal integrity in nanometer chips Proceedings - Ieee International Symposium On Circuits and Systems. 3223-3226 |
| Ku JC, Ismail Y. (2006) Area optimization for leakage reduction and thermal stability in nanometer scale technologies Proceedings of the Asia and South Pacific Design Automation Conference, Asp-Dac. 2006: 231-236 |
| Ku JC, Ozdemir S, Memik G, et al. (2006) Power density minimization for highly-associative caches in embedded processors Proceedings of the Acm Great Lakes Symposium On Vlsi, Glsvlsi. 2006: 100-104 |
| Ku JC, Ghoneima M, Ismail Y. (2005) The importance of including thermal effects in estimating the effectiveness of power reduction techniques Proceedings of the Custom Integrated Circuits Conference. 2005: 294-297 |