Vishal Singhal, Ph.D.
Affiliations: | 2005 | Purdue University, West Lafayette, IN, United States |
Area:
Mechanical Engineering, Electronics and Electrical EngineeringGoogle:
"Vishal Singhal"Parents
Sign in to add mentorSuresh V. Garimella | grad student | 2005 | Purdue | |
(A novel micropump for integrated microchannel cooling systems.) |
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Publications
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Singhal V, Garimella SV. (2007) Induction electrohydrodynamics micropump for high heat flux cooling Sensors and Actuators, a: Physical. 134: 650-659 |
Garimella SV, Singhal V, Liu D. (2006) On-chip thermal management with microchannel heat sinks and integrated micropumps Proceedings of the Ieee. 94: 1534-1548 |
Singhal V, Garimella SV. (2005) Influence of bulk fluid velocity on the efficiency of electrohydrodynamic pumping Journal of Fluids Engineering, Transactions of the Asme. 127: 484-494 |
Singhal V, Garimella SV. (2005) A novel valveless micropump with electrohydrodynamic enhancement for high heat flux cooling Ieee Transactions On Advanced Packaging. 28: 216-230 |
Singhal V, Litke PJ, Black AF, et al. (2005) An experimentally validated thermo-mechanical model for the prediction of thermal contact conductance International Journal of Heat and Mass Transfer. 48: 5446-5459 |
Black AF, Singhal V, Garimella SV. (2004) Analysis and prediction of constriction resistance for contact between rough engineering surfaces Journal of Thermophysics and Heat Transfer. 18: 30-36 |
Singhal V, Garimella SV. (2004) A novel micropump for electronics cooling American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. 375: 39-50 |
Singhal V, Garimella SV, Raman A. (2004) Microscale pumping technologies for microchannel cooling systems Applied Mechanics Reviews. 57: 191-221 |
Singhal V, Siegmund T, Garimella SV. (2004) Optimization of thermal interface materials for electronics cooling applications Ieee Transactions On Components and Packaging Technologies. 27: 244-252 |
Garimella SV, Singhal V. (2004) Single-phase flow and heat transport and pumping considerations in microchannel heat sinks Heat Transfer Engineering. 25: 15-25 |