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Harry Schoeller, Ph.D.

Affiliations: 
2011 Mechanical Engineering State University of New York at Binghamton, Vestal, NY, United States 
Area:
Materials Science Engineering, Mechanical Engineering
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"Harry Schoeller"
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Junghyun Cho grad student 2011 SUNY Binghamton
 (Mechanical behavior of high temperature interconnects and the superplasticity of high lead- content alloys.)

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Hadian F, Schoeller H, Cotts E. (2020) Correlation Between the Growth of Voids and Ni 3 Sn 4 Intermetallic Compounds at SnAg/Ni and SnAgCuBiSbNi/Ni Interfaces at Temperatures up to 200°C Journal of Electronic Materials. 49: 226-240
Mallampati S, Yin L, Shaddock D, et al. (2018) Lead-Free Alternatives for Interconnects in High-Temperature Electronics Journal of Electronic Packaging. 140
Schoeller H, Cho J. (2016) Superplasticity from viscous flow in high Pb ternary alloy Materials Science and Engineering A. 658: 210-220
Cho J, Mallampati S, Schoeller H, et al. (2015) Developments of Bi-Sb-Cu alloys as a high-temperature Pb-free solder Proceedings - Electronic Components and Technology Conference. 2015: 1251-1256
Mallampati S, Schoeller H, Yin L, et al. (2014) Developments of high-Bi alloys as a high temperature Pb-free solder Proceedings - Electronic Components and Technology Conference. 1328-1334
Schoeller H, Anselm M, Khan I, et al. (2014) Effect of Sn component surface finish on 92.5Pb-5Sn-2.5Ag International Conference and Exhibition On High Temperature Electronics, Hitec 2014. 144-151
Schoeller H, Bansal S, Knobloch A, et al. (2011) Effect of alloying elements on the creep behavior of high Pb-based solders Materials Science and Engineering A. 528: 1063-1070
Schoeller H, Cho J. (2009) Oxidation and reduction behavior of pure indium Journal of Materials Research. 24: 386-393
Schoeller H, Bansal S, Knobloch A, et al. (2009) Effects of microstructure evolution on high-temperature mechanical deformation of 95Sn-5Sb Asme International Mechanical Engineering Congress and Exposition, Proceedings. 6: 25-32
Schoeller H, Bansal S, Knobloch A, et al. (2009) Microstructure evolution and the constitutive relations of high-temperature solders Journal of Electronic Materials. 38: 802-809
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