Li-Anne Liew, Ph.D.
Affiliations: | 2002 | University of Colorado, Boulder, Boulder, CO, United States |
Area:
Mechanical Engineering, Materials Science EngineeringGoogle:
"Li-Anne Liew"Parents
Sign in to add mentorVictor M. Bright | grad student | 2002 | CU Boulder | |
(Polymer-derived silicon carbonitride as a new technology for microelectromechanical systems.) |
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Publications
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Yersak AS, Lewis RJ, Liew LA, et al. (2016) Atomic Layer Deposited Coatings on Nanowires for High Temperature Water Corrosion Protection. Acs Applied Materials & Interfaces. 8: 32616-32623 |
Liew L, Lin C, Lewis R, et al. (2016) Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology Journal of Electronic Packaging. 139 |
Zoli L, Sciti D, Liew LA, et al. (2016) Additive Manufacturing of Ceramics Enabled by Flash Pyrolysis of Polymer Precursors with Nanoscale Layers Journal of the American Ceramic Society. 99: 57-63 |
Xu S, Lewis RJ, Liew L, et al. (2016) Development of Ultra-Thin Thermal Ground Planes by Using Stainless-Steel Mesh as Wicking Structure Journal of Microelectromechanical Systems. 25: 842-844 |
Lewis R, Xu S, Liew LA, et al. (2015) Thin Flexible Thermal Ground Planes: Fabrication and Scaling Characterization Journal of Microelectromechanical Systems |
Lewis R, Liew L, Xu S, et al. (2015) Microfabricated ultra-thin all-polymer thermal ground planes Science Bulletin. 60: 701-706 |
Oshman C, Li Q, Liew LA, et al. (2013) Flat flexible polymer heat pipes Journal of Micromechanics and Microengineering. 23 |
Oshman C, Li Q, Liew LA, et al. (2012) Thermal performance of a flat polymer heat pipe heat spreader under high acceleration Journal of Micromechanics and Microengineering. 22 |
Lin CY, Liew LA, Lee YC. (2012) Polymer-based hermetic packaging for flexible micro devices Imaps International Conference and Exhibition On Device Packaging, Dpc 2012 - in Conjunction With the Global Business Council, Gbc 2012 Spring Conference |
Liew LA, Raj R. (2003) Manufacturing and Applications of Polymer and Ceramic MEMS from a Novel Material-Process for Harsh Environments Proceedings of Spie - the International Society For Optical Engineering. 5055: 154-166 |