Ho-Chiao Chuang, Ph.D.
Affiliations: | 2008 | Mechanical Engineering | University of Colorado, Boulder, Boulder, CO, United States |
Area:
Mechanical Engineering, Condensed Matter PhysicsGoogle:
"Ho-Chiao Chuang"Parents
Sign in to add mentor| Victor M. Bright | grad student | 2008 | CU Boulder | |
| (Design, fabrication and characterization of tunable external cavity diode laser and atom trapping chips for atomic physics.) | ||||
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Publications
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| Chuang H, Sanchez J. (2020) Parametric Characterization of Copper Metal Coatings Produced by Supercritical Argon Electroplating Jom. 72: 711-720 |
| Chuang HC, Su HC, Sanchez J. (2019) The characteristics of nickel film produced by supercritical carbon dioxide electroplating with ultrasonic agitation. Ultrasonics Sonochemistry. 57: 48-56 |
| Chuang H, Sanchez J. (2019) Fabrication of Cu coatings by ultrasound-assisted supercritical argon electroplating Materials Letters. 243: 54-57 |
| Chuang HC, Yang HM, Wu GL, et al. (2018) The effects of ultrasonic agitation on supercritical CO2 copper electroplating. Ultrasonics Sonochemistry. 40: 147-156 |
| Chuang HC, Sánchez J, Cheng HY. (2017) The Effect of Surfactant Content over Cu-Ni Coatings Electroplated by the sc-CO₂ Technique. Materials (Basel, Switzerland). 10 |
| Chuang HC, Teng YC, Sanchez J. (2016) Study on the effects of pressure and material characterization in thin film and TSV fabricated by supercritical carbon dioxide electrolyte Materials Science in Semiconductor Processing. 56: 5-13 |
| Chuang HC, Hong GY, Sanchez J. (2016) Fabrication of high aspect ratio copper nanowires using supercritical CO2 fluids electroplating technique in AAO template Materials Science in Semiconductor Processing. 45: 17-26 |
| Chuang H, Lai W, Sanchez J. (2015) An investigation of supercritical-CO2 copper electroplating parameters for application in TSV chips Journal of Micromechanics and Microengineering. 25: 15004 |
| Chuang HC, Huang CS, Chen HP, et al. (2014) The design, fabrication and characterization of a transparent atom chip. Sensors (Basel, Switzerland). 14: 10292-305 |
| Chuang HC, Huang CS. (2014) The development of a portable ultrahigh vacuum chamber via silicon block. The Review of Scientific Instruments. 85: 053107 |