Muhammad A. Alam
Affiliations: | Electrical and Computer Engineering | Purdue University, West Lafayette, IN, United States |
Area:
Electronics and Electrical Engineering, Biomedical EngineeringWebsite:
https://engineering.purdue.edu/ECE/People/ptPeopleListing?group_id=2571&resource_id=3171Google:
"Muhammad Alam"Bio:
https://www.proquest.com/openview/7bbaa950a25bf78c8ffa7c178bbb3c07/1
Parents
Sign in to add mentor| Mark S. Lundstrom | grad student | 1995 | Purdue | |
| (Computational studies of the physics of optoelectronic devices) | ||||
Children
Sign in to add trainee| Sayed Hasan | grad student | 2006 | Purdue |
| Haldun Kufluoglu | grad student | 2007 | Purdue |
| Nauman Z. Butt | grad student | 2008 | Purdue |
| Oguz H. Elibol | grad student | 2008 | Purdue |
| Ninad V. Pimparkar | grad student | 2008 | Purdue |
| Dhanoop Varghese | grad student | 2009 | Purdue |
| Ahmad E. Islam | grad student | 2010 | Purdue |
| Jonghyun Go | grad student | 2012 | Purdue |
| Biswajit Ray | grad student | 2013 | Purdue |
| Ravi P. Vedula | grad student | 2013 | Purdue |
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Publications
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| Lundstrom MS, Alam MA. (2022) Moore's law: The journey ahead. Science (New York, N.Y.). 378: 722-723 |
| Jin X, Bandodkar AJ, Fratus M, et al. (2020) Modeling, design guidelines, and detection limits of self-powered enzymatic biofuel cell-based sensors. Biosensors & Bioelectronics. 168: 112493 |
| Karda K, Mouli C, Alam MA. (2020) Design Principles of Self-Compensated NBTI-Free Negative Capacitor FinFET Ieee Transactions On Electron Devices. 67: 2238-2242 |
| Ahn W, Cornigli D, Varghese D, et al. (2020) Effects of Filler Configuration and Moisture on Dissipation Factor and Critical Electric Field of Epoxy Composites for HV-ICs Encapsulation Ieee Transactions On Components, Packaging and Manufacturing Technology. 1-1 |
| Ahn W, Zhang H, Shen T, et al. (2020) A Closed-Form Transient Joule Heating Model for an Interconnect in an Integrated Circuit Ieee Electron Device Letters. 41: 288-291 |
| Asadpour R, Sulas-Kern DB, Johnston S, et al. (2020) Dark Lock-in Thermography Identifies Solder Bond Failure as the Root Cause of Series Resistance Increase in Fielded Solar Modules Ieee Journal of Photovoltaics. 10: 1409-1416 |
| Song E, Chiang CH, Li R, et al. (2019) Flexible electronic/optoelectronic microsystems with scalable designs for chronic biointegration. Proceedings of the National Academy of Sciences of the United States of America |
| Islam AE, Mahapatra S, Deora S, et al. (2019) Essential aspects of Negative Bias Temperature Instability (NBTI) Ecs Transactions. 35: 145-174 |
| Alam MA, Mahajan BK, Chen Y, et al. (2019) A Device-to-System Perspective Regarding Self-Heating Enhanced Hot Carrier Degradation in Modern Field-Effect Transistors: A Topical Review Ieee Transactions On Electron Devices. 66: 4556-4565 |
| Kim S, Song JD, Alam MA, et al. (2019) Highly Stable Self-Aligned Ni-InGaAs and Non-Self-Aligned Mo Contact for Monolithic 3-D Integration of InGaAs MOSFETs Ieee Journal of the Electron Devices Society. 7: 869-877 |