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Kristen P. Constant

Affiliations: 
Materials Science and Engineering Iowa State University, Ames, IA, United States 
Area:
Materials Science Engineering, Energy, Nanotechnology
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"Kristen Constant"

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David J. Hasler grad student 2003 Iowa State
Henry H. Kang grad student 2004 Iowa State
Ping Kuang grad student 2011 Iowa State
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Publications

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Kuang P, Park JM, Liu G, et al. (2013) Metal-nanowall grating transparent electrodes: achieving high optical transmittance at high incident angles with minimal diffraction. Optics Express. 21: 2393-401
Ye Z, Park JM, Constant KP, et al. (2012) Photonic crystal: energy-related applications Journal of Photonics For Energy. 2: 21012
Ye Z, Park JM, Constant K, et al. (2012) Publisher’s Note: Photonic crystal: energy-related applications Journal of Photonics For Energy. 2: 20102
Park JM, Gan Z, Leung WY, et al. (2011) Soft holographic interference lithography microlens for enhanced organic light emitting diode light extraction. Optics Express. 19: A786-92
Kuang P, Park JM, Leung W, et al. (2011) A new architecture for transparent electrodes: relieving the trade-off between electrical conductivity and optical transmittance. Advanced Materials (Deerfield Beach, Fla.). 23: 2469-73
Park JM, Kim TG, Constant KP, et al. (2011) Fabrication of submicron metallic grids with interference and phase-mask holography Journal of Micro-Nanolithography Mems and Moems. 10: 13011
Park JM, Nalwa KS, Leung W, et al. (2010) Fabrication of metallic nanowires and nanoribbons using laser interference lithography and shadow lithography. Nanotechnology. 21: 215301
Kuang P, Park JM, Leung W, et al. (2010) High aspect ratio nanoscale metallic structures as transparent electrodes Proceedings of Spie. 7756
Shin YC, Kim DH, Chae DJ, et al. (2010) Effects of Nanometer-Scale Photonic Crystal Structures on the Light Extraction From GaN Light-Emitting Diodes Ieee Journal of Quantum Electronics. 46: 1375-1380
Lee J, Kuang P, Leung WY, et al. (2010) Semicrystalline woodpile photonic crystals without complicated alignment via soft lithography Applied Physics Letters. 96: 193303
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