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Jay M. Ochterbeck

Affiliations: 
Mechanical Engineering Clemson University, Clemson, SC, United States 
Area:
Mechanical Engineering
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"Jay Ochterbeck"
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Children

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Yonghong Yan grad student 2000 Clemson University
Pascal O. Brocheny grad student 2006 Clemson University
Brian P. d'Entremont grad student 2011 Clemson University

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Publications

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D'Entremont BP, Ochterbeck JM. (2009) Investigation of loop heat pipe startup using liquid core visualization 2008 Proceedings of the Asme Summer Heat Transfer Conference, Ht 2008. 2: 387-393
Chernysheva MA, Maydanik YF, Ochterbeck JM. (2008) Heat transfer investigation in evaporator of loop heat pipe during startup Journal of Thermophysics and Heat Transfer. 22: 617-622
D'Entremont BP, Ochterbeck JM. (2008) Performance of low-conductivity ceramic wicks in capillary evaporators 40th Aiaa Thermophysics Conference
Wang Z, Ochterbeck JM, Peng XF. (2007) Boiling dryout on flat surfaces covered with bead-packed structures Heat and Mass Transfer/Waerme- Und Stoffuebertragung. 43: 405-414
Couto P, Mantelli MBH, Ochterbeck JM. (2006) Experimental analysis of supercritical startup of nitrogen/stainless steel cryogenic heat pipes Journal of Thermophysics and Heat Transfer. 20: 842-849
Brocheny P, Ochterbeck JM. (2005) Modeling of capillary dryout and rewetting for room-temperature heat pipes American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. 376: 13-19
Maydanik YF, Vershinin SV, Korukov MA, et al. (2005) Miniature loop heat pipes - A promising means for cooling electronics Ieee Transactions On Components and Packaging Technologies. 28: 290-296
Couto P, Ochterbeck JM, Mantelli MBH. (2005) Analysis of supercritical startup of cryogenic heat pipes with parasitic heat loads Journal of Thermophysics and Heat Transfer. 19: 497-508
D'Entremont BP, Ochterbeck JM. (2005) Performance of ceramic wick evaporators for loop heat pipes and Capillary Pumped Loops 38th Aiaa Thermophysics Conference
Wang Z, Peng XF, Ochterbeck JM. (2004) Dynamic bubble behavior during boiling in bead-packed structures International Journal of Heat and Mass Transfer. 47: 4771-4783
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