Jared M. Hornberger, Ph.D.
Affiliations: | 2012 | Electrical Engineering | University of Arkansas, Little Rock, AR |
Area:
Electronics and Electrical EngineeringGoogle:
"Jared Hornberger"Parents
Sign in to add mentor| Homer Alan Mantooth | grad student | 2012 | University of Arkansas | |
| (The development and packaging of a high-density, three-phase, silicon carbide motor drive.) | ||||
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Publications
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| McPherson BR, Shaw R, Hornberger J, et al. (2012) High Current (>1000A), High Temperature (>200°C) Silicon Carbide Trench MOSFET (TMOS) Power Modules for High Performance Systems Sae International Journal of Passenger Cars - Electronic and Electrical Systems. 6: 10-17 |
| Lostetter AB, Hornberger J, McPherson B, et al. (2012) High temperature silicon carbide power modules for high performance systems Materials Science Forum. 717: 1219-1224 |
| Reese BA, McPherson B, Shaw R, et al. (2008) High-Temperature SOI/SiC-Based DC-DC Converter Suite International Journal of Power Management Electronics. 2008: 1-6 |
| Hornberger JM, Cilio E, McPherson B, et al. (2007) A fully integrated 300°C, 4 kW, 3-phase, SiC motor drive module Pesc Record - Ieee Annual Power Electronics Specialists Conference. 1048-1053 |
| Hornberger JM, Cilio E, Schupbach RM, et al. (2006) A high-temperature multichip power module (MCPM) inverter utilizing silicon carbide (SiC) and silicon on insulator (SOI) electronics Pesc Record - Ieee Annual Power Electronics Specialists Conference |
| Hornberger JM, Mounce SD, Schupbach RM, et al. (2005) High-temperature silicon carbide (SiC) power switches in multichip power module (MCPM) applications Conference Record - Ias Annual Meeting (Ieee Industry Applications Society). 1: 393-398 |
| Hornberger JM, McPherson B, Mounce SD, et al. (2005) Packaging of a high-temperature silicon carbide (SiC) mulitchip power module (MCPM) Proceedings - 2005 International Symposium On Microelectronics, Imaps 2005. 579-585 |