Younis Jaradat, Ph.D.
Affiliations: | 2012 | Industrial Engineering | State University of New York at Binghamton, Vestal, NY, United States |
Area:
Industrial Engineering, Materials Science EngineeringGoogle:
"Younis Jaradat"Parents
Sign in to add mentor| Peter Borgesen | grad student | 2012 | SUNY Binghamton | |
| (Reliability of Tin Silver Copper and mixed solders under variable loading conditions.) | ||||
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Publications
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| Qasaimeh A, Hamasha S, Jaradat Y, et al. (2015) Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue Journal of Electronic Packaging. 137: 21012 |
| Hamasha S, Qasaimeh A, Jaradat Y, et al. (2015) Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling Ieee Transactions On Components, Packaging and Manufacturing Technology |
| Batieha F, Hamasha S, Jaradat Y, et al. (2015) Challenges for the prediction of solder joint life in long term vibration Proceedings - Electronic Components and Technology Conference. 2015: 1553-1559 |
| Hamasha S, Jaradat Y, Qasaimeh A, et al. (2014) Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions Journal of Electronic Materials. 43: 4472-4484 |
| Obaidat M, Hamasha S, Jaradat Y, et al. (2013) Effects of varying amplitudes on the fatigue life of lead free solder joints Proceedings - Electronic Components and Technology Conference. 1308-1314 |
| Jaradat Y, Chen J, Owens JE, et al. (2012) Effects of variable amplitude loading on lead-free solder joint propoerties and damage accumulation Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 740-744 |
| Qasaimeh A, Jaradat Y, Wentlent L, et al. (2011) Recrystallization behavior of lead free and lead containing solder in cycling Proceedings - Electronic Components and Technology Conference. 1775-1781 |
| Jaradat Y, Qasaimeh A, Kondos P, et al. (2011) On the evolution of the properties and microstructure of backward compatible solder joints during cycling and aging Proceedings - Electronic Components and Technology Conference. 722-730 |