Rensheng Sun, Ph.D.
Affiliations: | 2005 | Michigan State University, East Lansing, MI |
Area:
Electronics and Electrical Engineering, Chemical Engineering, Mechanical EngineeringGoogle:
"Rensheng Sun"Parents
Sign in to add mentor| Leo C. Kempel | grad student | 2005 | Michigan State | |
| (Coupled electromagnetic thermal and kinetic modeling for microwave processing of polymers with temperature- and cure-dependent permittivity using 3D FEM.) | ||||
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Publications
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| Sun R, Kempel LC, Zong L, et al. (2009) Coupled electromagnetic thermal and kinetic modeling for microwave processing of polymers with temperature- and cure-dependent permittivity using 3D FEM International Journal of Applied Electromagnetics and Mechanics. 30: 9-28 |
| Zobg L, Hawley MC, Sun R, et al. (2009) Dielectric relaxation of curing DGEBA/mPDA system at 2.45 GHz Journal of Thermoplastic Composite Materials. 22: 249-257 |
| Zong L, Zhou S, Sgriccia N, et al. (2005) Dielectric properties of an epoxy-amine system at a high microwave frequency Polymer Engineering and Science. 45: 1576-1580 |
| Zong L, Zhou S, Sun R, et al. (2004) Dielectric analysis of a crosslinking epoxy resin at a high microwave frequency Journal of Polymer Science, Part B: Polymer Physics. 42: 2871-2877 |