Anthony A. Primavera, Ph.D.
Affiliations: | 2000 | State University of New York at Binghamton, Vestal, NY, United States |
Area:
Mechanical Engineering, Electronics and Electrical Engineering, Materials Science EngineeringGoogle:
"Anthony Primavera"Parents
Sign in to add mentorJames M. Pitarresi | grad student | 2000 | SUNY Binghamton | |
(Reliability improvement of area array solder joints: Changing attachment pad geometry.) |
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Publications
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Yunus M, Primavera A, Srihari K, et al. (2000) Effect of voids on the reliability of BGA/CSP solder joints Proceedings of the Ieee/Cpmt International Electronics Manufacturing Technology (Iemt) Symposium. 207-213 |
Pitarresi JM, Primavera AA. (1992) Comparison of modeling techniques for the vibration analysis of printed circuit cards Journal of Electronic Packaging, Transactions of the Asme. 114: 378-383 |