Nathan P. Marchack, Ph.D.
Affiliations: | 2012 | Chemical Engineering 0294 | University of California, Los Angeles, Los Angeles, CA |
Area:
Chemical EngineeringGoogle:
"Nathan Marchack"Parents
Sign in to add mentor| Jane P. Chang | grad student | 2012 | UCLA | |
| (Kinetic Modeling of Halogen-Based Plasma Etching of Complex Oxide Films and its Application to Predictive Feature Profile Simulation.) | ||||
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Buzi L, Miyazoe H, Sagianis MP, et al. (2020) Utilizing photosensitive polymers to evaluate UV radiation exposures in different plasma chamber configurations Journal of Vacuum Science and Technology. 38: 33006 |
| Marchack N, Innocent-Dolor J, Hopstaken M, et al. (2020) Control of surface oxide formation in plasma-enhanced quasiatomic layer etching of tantalum nitride Journal of Vacuum Science and Technology. 38: 22609 |
| Ishikawa K, Ishijima T, Shirafuji T, et al. (2019) Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: a physics and chemistry perspective Japanese Journal of Applied Physics. 58: SE0801 |
| Marchack N, Hernandez K, Walusiak B, et al. (2019) Cover Picture: Plasma Process. Polym. 9/2019 Plasma Processes and Polymers. 16: 1970019 |
| Marchack N, Hernandez K, Walusiak B, et al. (2019) Utilizing surface modification in plasma‐enhanced cyclic etching of tantalum nitride to surpass lithographic limits Plasma Processes and Polymers. 16: 1900008 |
| Marchack N, Miyazoe H, Bruce RL, et al. (2018) Nitride etching with hydrofluorocarbons. II. Evaluation of C4H9F for tight pitch Si3N4 patterning applications Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 36: 031801 |
| Miyazoe H, Marchack N, Bruce RL, et al. (2018) Nitride etching with hydrofluorocarbons III: Comparison of C4H9F and CH3F for low-k′ nitride spacer etch processes Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 36: 032201 |
| Marchack N, Khater M, Orcutt J, et al. (2017) Reducing Line Edge Roughness in Si and SiN through plasma etch chemistry optimization for photonic waveguide applications Proceedings of Spie. 10149 |
| Marchack N, Papalia JM, Engelmann S, et al. (2017) Cyclic Cl2/H2 quasi-atomic layer etching approach for TiN and TaN patterning using organic masks Journal of Vacuum Science & Technology a: Vacuum, Surfaces, and Films. 35: 05C314 |
| Papalia J, Marchack N, Bruce R, et al. (2016) Applications for surface engineering using atomic layer Etching Solid State Phenomena. 255: 41-48 |