Siddharth Bhopte, Ph.D.

Affiliations: 
2009 Mechanical Engineering State University of New York at Binghamton, Vestal, NY, United States 
Area:
Mechanical Engineering
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"Siddharth Bhopte"

Parents

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Bahgat Sammakia grad student 2009 SUNY Binghamton
 (Study of transport processes from macroscale to microscale.)
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Publications

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Alissa H, Alkharabsheh S, Bhopte S, et al. (2014) Numerical investigation of underfloor obstructions in open-contained data center with fan curves Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 771-777
Ibrahim M, Bhopte S, Sammakia B, et al. (2012) Effect of transient boundary conditions and detailed thermal modeling of data center rooms Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 300-310
Galloway JE, Bhopte S, Nelson C. (2012) Characterizing junction-to-case thermal resistance and its impact on end-use applications Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1342-1347
Sammakia B, Bhopte S, Ibrahim M. (2012) Numerical modeling of data center clusters Energy Efficient Thermal Management of Data Centers. 2147483647: 335-382
Ibrahim M, Sammakia B, Bhopte S, et al. (2011) Numerical study on the reduction of recirculation using sealed cold aisles and its effects on the efficiency of the cooling infrastructure Asme 2011 Pacific Rim Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Systems, Interpack 2011. 2: 585-593
Bhopte S, Sammakia B, Iyengar M, et al. (2011) Numerical and experimental study of the effect of underfloor blockages on data center performance Journal of Electronic Packaging, Transactions of the Asme. 133
Gondipalli S, Sammakia B, Bhopte S, et al. (2010) Optimization of cold aisle isolation designs for a data center with roofs and doors using slits Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 841-850
Mahmoud I, Bhopte S, Sammakia B, et al. (2010) Effect of thermal characteristics of electronic enclosures on dynamic data center performance Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 4: 411-420
Bhopte S, Desu SB, Sammakia B. (2010) An integrated nano-structured heat spreader for high heat flux electronic systems 2010 14th International Heat Transfer Conference, Ihtc 14. 3: 629-635
Gondipalli S, Ibrahim M, Bhopte S, et al. (2010) Numerical modeling of data center with transient boundary conditions 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010
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