Siddharth Bhopte, Ph.D.
Affiliations: | 2009 | Mechanical Engineering | State University of New York at Binghamton, Vestal, NY, United States |
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"Siddharth Bhopte"Parents
Sign in to add mentorBahgat Sammakia | grad student | 2009 | SUNY Binghamton | |
(Study of transport processes from macroscale to microscale.) |
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Publications
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Alissa H, Alkharabsheh S, Bhopte S, et al. (2014) Numerical investigation of underfloor obstructions in open-contained data center with fan curves Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 771-777 |
Ibrahim M, Bhopte S, Sammakia B, et al. (2012) Effect of transient boundary conditions and detailed thermal modeling of data center rooms Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 300-310 |
Galloway JE, Bhopte S, Nelson C. (2012) Characterizing junction-to-case thermal resistance and its impact on end-use applications Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1342-1347 |
Sammakia B, Bhopte S, Ibrahim M. (2012) Numerical modeling of data center clusters Energy Efficient Thermal Management of Data Centers. 2147483647: 335-382 |
Ibrahim M, Sammakia B, Bhopte S, et al. (2011) Numerical study on the reduction of recirculation using sealed cold aisles and its effects on the efficiency of the cooling infrastructure Asme 2011 Pacific Rim Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Systems, Interpack 2011. 2: 585-593 |
Bhopte S, Sammakia B, Iyengar M, et al. (2011) Numerical and experimental study of the effect of underfloor blockages on data center performance Journal of Electronic Packaging, Transactions of the Asme. 133 |
Gondipalli S, Sammakia B, Bhopte S, et al. (2010) Optimization of cold aisle isolation designs for a data center with roofs and doors using slits Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 841-850 |
Mahmoud I, Bhopte S, Sammakia B, et al. (2010) Effect of thermal characteristics of electronic enclosures on dynamic data center performance Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 4: 411-420 |
Bhopte S, Desu SB, Sammakia B. (2010) An integrated nano-structured heat spreader for high heat flux electronic systems 2010 14th International Heat Transfer Conference, Ihtc 14. 3: 629-635 |
Gondipalli S, Ibrahim M, Bhopte S, et al. (2010) Numerical modeling of data center with transient boundary conditions 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010 |