Sue A. Bidstrup Allen
Affiliations: | Chemical Engineering | Georgia Institute of Technology, Atlanta, GA |
Area:
Chemical Engineering, Materials Science Engineering, Polymer ChemistryWebsite:
https://chbe.gatech.edu/people/sue-ann-bidstrup-allenGoogle:
"Sue Bidstrup Allen"Bio:
Parents
Sign in to add mentorChristopher W. Macosko | grad student | 1986 | UMN | |
(Structure-property Relations for Model Epoxy Networks) |
Children
Sign in to add traineeSairam Agraharam | grad student | 2000 | Georgia Tech |
Punit P. Chiniwalla | grad student | 2001 | Georgia Tech |
Agnes M. Padovani Blanco | grad student | 2002 | Georgia Tech |
Hollie A. Kelleher | grad student | 2004 | Georgia Tech |
Ate He | grad student | 2007 | Georgia Tech |
Harley T. Hayden | grad student | 2008 | Georgia Tech |
Seongho Park | grad student | 2008 | Georgia Tech |
Venmathy Rajarathinam | grad student | 2010 | Georgia Tech |
Nathan T. Fritz | grad student | 2012 | Georgia Tech |
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Publications
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Fritz N, Koo HC, Wilson Z, et al. (2012) Electroless deposition of copper on organic and inorganic substrates using a Sn/Ag catalyst Journal of the Electrochemical Society. 159 |
Rajarathinam V, Lightsey CH, Osborn T, et al. (2009) Aqueous-Develop, Photosensitive Polynorbornene Dielectric: Properties and Characterization Journal of Electronic Materials. 38: 778-786 |
He A, Osborn T, Bidstrup Allen SA, et al. (2008) All-copper chip-to-substrate interconnects Part II. Modeling and design Journal of the Electrochemical Society. 155 |
Abdallah J, Silver M, Bidstrup Allen SA, et al. (2007) UV-induced porosity using photogenerated acids to catalyze the decomposition of sacrificial polymers templated in dielectric films Journal of Materials Chemistry. 17: 873-885 |
He A, Osborn T, Bidstrup Allen SA, et al. (2006) Low-temperature bonding of copper pillars for all-copper chip-to-substrate interconnections Electrochemical and Solid-State Letters. 9: 192-195 |
Joseph PJ, Kelleher HA, Bidstrup Allen SA, et al. (2005) Improved fabrication of micro air-channels by incorporation of a structural barrier Journal of Micromechanics and Microengineering. 15: 35-42 |
Sung T, Bidstrup Allen SA, Kohl PA. (2005) Low temperature rapid curing of polymer dielectrics on metallized organic laminates by variable frequency microwave processing Journal of Microelectronics and Electronic Packaging. 2: 142-154 |
Bai Y, Chiniwalla P, Elce E, et al. (2004) Photosensitive polynorbornene based dielectric. I. Structure-property relationships Journal of Applied Polymer Science. 91: 3023-3030 |
Wu X, Reed HA, Wang Y, et al. (2003) Fabrication of Microchannels Using Polynorbornene Photosensitive Sacrificial Materials Journal of the Electrochemical Society. 150 |
Chiniwalla P, Bai Y, Elce E, et al. (2003) Crosslinking and decomposition reactions of epoxide functionalized polynorbornene. Part I. FTIR and thermogravimetric analysis Journal of Applied Polymer Science. 89: 568-577 |