Xuejun Fan
Affiliations: | Mechanical Engineering | Lamar University - Beaumont |
Area:
Mechanical EngineeringGoogle:
"Xuejun Fan"Children
Sign in to add trainee| Pridhvi Dandu | grad student | 2012 | Lamar University - Beaumont |
| Vishal Nagaraj | grad student | 2012 | Lamar University - Beaumont |
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Publications
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| Fan J, Chen W, Yuan W, et al. (2020) Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model. Optics Express. 28: 13921-13937 |
| Cui Z, Fan J, Ginkel HJv, et al. (2020) The interface adhesion of CaAlSiN 3 : Eu 2+ phosphor/silicone used in light-emitting diode packaging: A first principles study Applied Surface Science. 510: 145251 |
| Fan J, Wang Z, Deng Z, et al. (2019) High Moisture Accelerated Mechanical Behavior Degradation of Phosphor/Silicone Composites Used in White Light-Emitting Diodes. Polymers. 11 |
| Zhang H, Liu Y, Wang L, et al. (2019) Effects of Sintering Pressure on the Densification and Mechanical Properties of Nanosilver Double-Side Sintered Power Module Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 963-972 |
| Chen W, Fan J, Qian C, et al. (2019) Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method Ieee Access. 7: 68495-68502 |
| Sun B, Fan J, Fan X, et al. (2019) A Reliability Prediction Methodology for LED Arrays Ieee Access. 7: 8127-8134 |
| Hoque A, Bradley RK, Fan J, et al. (2019) Effects of humidity and phosphor on silicone/phosphor composite in white light-emitting diode package Journal of Materials Science: Materials in Electronics. 30: 20471-20478 |
| Jiang C, Fan J, Qian C, et al. (2018) Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages Ieee Transactions On Components, Packaging and Manufacturing Technology. 8: 1254-1262 |
| Sun B, Fan X, Driel WDv, et al. (2018) A stochastic process based reliability prediction method for LED driver Reliability Engineering & System Safety. 178: 140-146 |
| Fan J, Cao J, Yu C, et al. (2018) A design and qualification of LED flip Chip-on-Board module with tunable color temperatures Microelectronics Reliability. 84: 140-148 |