Fred Barlow
Affiliations: | 1999-2006 | University of Arkansas, Fayetteville, Fayetteville, AR, United States | |
| 2006-2015 | Electrical and Computer Engineering | University of Idaho, Moscow, ID, United States | |
| 2015-2019 | University of Alaska Anchorage | ||
| 2019- | Engineering and Engineering Technology | Metropolitan State University of Denver |
Area:
Electronics and Electrical Engineering, Materials Science Engineering, Inorganic ChemistryWebsite:
https://webapp.msudenver.edu/directory/profile.php?uName=fbarlow1Google:
"Fred Barlow"Bio:
http://hdl.handle.net/10919/46096
http://hdl.handle.net/10919/28291
Parents
Sign in to add mentor| Aicha Elshabini | grad student | 1999 | Virginia Tech | |
| (Electronic Packaging Strategies for High Current DC to DC Converters) | ||||
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Publications
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| Barannyk LL, Aboutaleb HA, Elshabini A, et al. (2014) Causality Verification Using Polynomial Periodic Continuations for Electrical Interconnects Journal of Microelectronics and Electronic Packaging. 11: 181-196 |
| Tork HS, Elshabini A, Barlow F. (2013) Tunable BaSrTiO3, BaZrTiO3 Ferroelectric Capacitors Embedded Inside Low Temperature Cofired Ceramics (LTCC) Journal of Microelectronics and Electronic Packaging. 10: 95-101 |
| Xu F, Han TJ, Jiang D, et al. (2013) Development of a SiC JFET-Based Six-Pack Power Module for a Fully Integrated Inverter Ieee Transactions On Power Electronics. 28: 1464-1478 |
| Abousaif E, Elshabini A, Barlow F. (2011) A novel design of substrate integrated waveguide (SIW) E-Plane inductive strip filter implemented using LTCC Journal of Microelectronics and Electronic Packaging. 8: 121-128 |
| Abdelnaby AH, Potirniche GP, Elshabini A, et al. (2011) A Comparison of Back Grinding Processes for Bare Silicon and Through-Silicon Via Wafers Using Numerical Simulations Journal of Microelectronics and Electronic Packaging. 8: 146-153 |
| Barlow F, Wood J, Elshabini A, et al. (2009) Fabrication of precise fluidic structures in LTCC International Journal of Applied Ceramic Technology. 6: 18-23 |
| Feeler R, Junghans J, Stephens E, et al. (2008) Advanced Laser Diode Cooling Concepts Mrs Proceedings. 1076 |
| Funaki T, Balda JC, Junghans J, et al. (2007) Power conversion with SiC devices at extremely high ambient temperatures Ieee Transactions On Power Electronics. 22: 1321-1329 |
| Wang G, Folk EC, Barlow F, et al. (2006) Fabrication of microvias for multilayer LTCC substrates Ieee Transactions On Electronics Packaging Manufacturing. 29: 32-41 |
| Wang G, Van M, Barlow F, et al. (2005) An interdigital bandpass filter embedded in LTCC for 5-GHz wireless LAN applications Ieee Microwave and Wireless Components Letters. 15: 357-359 |