Samuel Graham
Affiliations: | Mechanical Engineering | Georgia Institute of Technology, Atlanta, GA |
Area:
Mechanical Engineering, Materials Science Engineering, Electronics and Electrical EngineeringGoogle:
"Samuel Graham"Children
Sign in to add traineeZhe Cheng | grad student | ||
Thomas E. Beechem | grad student | 2008 | Georgia Tech |
Abraham Greenstein | grad student | 2008 | Georgia Tech |
Roderick K. Jackson | grad student | 2009 | Georgia Tech |
Namsu Kim | grad student | 2009 | Georgia Tech |
Hossein Sojoudi | grad student | 2012 | Georgia Tech |
Sukwon choi | grad student | 2013 | Penn State |
Fatma Nazli Donmezer | grad student | 2013 | Bogazici University |
Jason Hirschey | grad student | 2017-2022 | Georgia Tech |
Brian M. Foley | post-doc | 2016-2018 | Georgia Tech (Chemistry Tree) |
BETA: Related publications
See more...
Publications
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
Li R, Hussain K, Liao ME, et al. (2024) Enhanced Thermal Boundary Conductance across GaN/SiC Interfaces with AlN Transition Layers. Acs Applied Materials & Interfaces |
Cheng Z, Liang J, Kawamura K, et al. (2022) High thermal conductivity in wafer-scale cubic silicon carbide crystals. Nature Communications. 13: 7201 |
Cheng Z, Mu F, Ji X, et al. (2022) Correction to "Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance". Acs Applied Materials & Interfaces. 14: 22678 |
Malakoutian M, Field DE, Hines NJ, et al. (2021) Record-Low Thermal Boundary Resistance between Diamond and GaN-on-SiC for Enabling Radiofrequency Device Cooling. Acs Applied Materials & Interfaces. 13: 60553-60560 |
Cheng Z, Li R, Yan X, et al. (2021) Experimental observation of localized interfacial phonon modes. Nature Communications. 12: 6901 |
Hines NJ, Yates L, Foley BM, et al. (2021) Steady-state methods for measuring in-plane thermal conductivity of thin films for heat spreading applications. The Review of Scientific Instruments. 92: 044907 |
Cheng Z, Mu F, Ji X, et al. (2021) Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance. Acs Applied Materials & Interfaces |
Shi J, Yuan C, Huang HL, et al. (2021) Thermal Transport across Metal/β-GaO Interfaces. Acs Applied Materials & Interfaces |
Hoque MSB, Koh YR, Braun JL, et al. (2021) High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films. Acs Nano |
Cheng Z, Mu F, You T, et al. (2020) Thermal Transport across Ion-cut Monocrystalline β-Ga2O3 Thin Films and Bonded β-Ga2O3-SiC Interfaces. Acs Applied Materials & Interfaces |