Xinnan Lin, Ph.D.
Affiliations: | 2007 | Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong |
Area:
Electronics and Electrical EngineeringGoogle:
"Xinnan Lin"Parents
Sign in to add mentorMansun J. Chan | grad student | 2007 | HKUST | |
(Double Gate MOSFET technology and applications.) |
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Publications
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Ding F, Dong D, Chen Y, et al. (2021) Robust Simulations of Nanoscale Phase Change Memory: Dynamics and Retention. Nanomaterials (Basel, Switzerland). 11 |
He H, Xiong C, Yin J, et al. (2020) Analytical Drain Current and Capacitance Model for Amorphous InGaZnO TFTs Considering Temperature Characteristics Ieee Transactions On Electron Devices. 67: 3637-3644 |
Hu H, Liu D, Chen X, et al. (2020) A Compact Phase Change Memory Model With Dynamic State Variables Ieee Transactions On Electron Devices. 67: 133-139 |
Chen X, Hu H, Huang X, et al. (2020) A SPICE Model of Phase Change Memory for Neuromorphic Circuits Ieee Access. 8: 95278-95287 |
Li W, Lou H, Lin X. (2020) Investigation of trench process variation on the recessed-gate junctionless MOSFETs considering the circuit application Semiconductor Science and Technology. 35: 85002 |
Zhang L, Ma C, Xiao Y, et al. (2019) A Dynamic Time Evolution Method for Concurrent Device-Circuit Aging Simulations Ieee Transactions On Electron Devices. 66: 184-190 |
Yang Y, Lou H, Lin X. (2018) High-k Spacer Consideration of Ultrascaled Gate-All-Around Junctionless Transistor in Ballistic Regime Ieee Transactions On Electron Devices. 65: 5282-5288 |
Wan W, Lou H, Xiao Y, et al. (2018) Source/Drain Engineered Charge-Plasma Junctionless Transistor for the Immune of Line Edge Roughness Effect Ieee Transactions On Electron Devices. 65: 1873-1879 |
Yuan M, Zhou H, Tseng Y, et al. (2018) Enhancing the Electrical Uniformity and Reliability of the HfO2-Based RRAM Using High-Permittivity Ta2O5 Side Wall Ieee Journal of the Electron Devices Society. 6: 627-632 |
Zhang L, Song D, Xiao Y, et al. (2018) On the Formulation of Self-Heating Models for Circuit Simulation Ieee Journal of the Electron Devices Society. 6: 291-297 |